IT1043091B - Procedimento per la placcatura chimica di superfici dielettriche e soluzione catalitica colloidale per la sua realizzazione - Google Patents
Procedimento per la placcatura chimica di superfici dielettriche e soluzione catalitica colloidale per la sua realizzazioneInfo
- Publication number
- IT1043091B IT1043091B IT27918/75A IT2791875A IT1043091B IT 1043091 B IT1043091 B IT 1043091B IT 27918/75 A IT27918/75 A IT 27918/75A IT 2791875 A IT2791875 A IT 2791875A IT 1043091 B IT1043091 B IT 1043091B
- Authority
- IT
- Italy
- Prior art keywords
- realization
- procedure
- chemical plating
- catalytic solution
- dielectric surfaces
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51222474A | 1974-10-04 | 1974-10-04 | |
US05/607,506 US3993799A (en) | 1974-10-04 | 1975-08-26 | Electroless plating process employing non-noble metal hydrous oxide catalyst |
Publications (1)
Publication Number | Publication Date |
---|---|
IT1043091B true IT1043091B (it) | 1980-02-20 |
Family
ID=27057493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT27918/75A IT1043091B (it) | 1974-10-04 | 1975-10-03 | Procedimento per la placcatura chimica di superfici dielettriche e soluzione catalitica colloidale per la sua realizzazione |
Country Status (10)
Country | Link |
---|---|
US (1) | US3993799A (it) |
JP (1) | JPS5163464A (it) |
AU (1) | AU8543775A (it) |
BR (1) | BR7506436A (it) |
CA (1) | CA1081405A (it) |
DE (1) | DE2544381A1 (it) |
FR (1) | FR2287094A1 (it) |
GB (1) | GB1528015A (it) |
IT (1) | IT1043091B (it) |
NL (1) | NL7511350A (it) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5009965A (en) * | 1974-10-04 | 1991-04-23 | Nathan Feldstein | Colloidal compositions for electroless deposition |
US4321285A (en) * | 1974-10-04 | 1982-03-23 | Surface Technology, Inc. | Electroless plating |
US4136216A (en) * | 1975-08-26 | 1979-01-23 | Surface Technology, Inc. | Non-precious metal colloidal dispersions for electroless metal deposition |
US4338355A (en) * | 1975-10-23 | 1982-07-06 | Nathan Feldstein | Process using activated electroless plating catalysts |
US4087586A (en) * | 1975-12-29 | 1978-05-02 | Nathan Feldstein | Electroless metal deposition and article |
US4151311A (en) * | 1976-01-22 | 1979-04-24 | Nathan Feldstein | Post colloid addition of catalytic promoters to non noble metal principal catalytic compounds in electroless plating catalysts |
US4151313A (en) * | 1977-03-11 | 1979-04-24 | Hitachi, Ltd. | Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material |
US4233344A (en) * | 1978-07-20 | 1980-11-11 | Learonal, Inc. | Method of improving the adhesion of electroless metal deposits employing colloidal copper activator |
US4258087A (en) * | 1978-08-17 | 1981-03-24 | Nathan Feldstein | Dispersions for activating non-conductors for electroless plating |
US4318940A (en) * | 1978-08-17 | 1982-03-09 | Surface Technology, Inc. | Dispersions for activating non-conductors for electroless plating |
US4339476A (en) * | 1978-08-17 | 1982-07-13 | Nathan Feldstein | Dispersions for activating non-conductors for electroless plating |
US4278712A (en) * | 1978-08-31 | 1981-07-14 | Surface Technology, Inc. | Method for activating non-noble metal colloidal dispersion by controlled oxidation for electroless plating |
US4261747A (en) * | 1978-12-06 | 1981-04-14 | Nathan Feldstein | Dispersions for activating non-conductors for electroless plating |
DE3121015C2 (de) * | 1981-05-27 | 1986-12-04 | Friedr. Blasberg GmbH und Co KG, 5650 Solingen | Verfahren zur Aktivierung von gebeizten Oberflächen und Lösung zur Durchführung desselben |
US4762560A (en) * | 1982-09-27 | 1988-08-09 | Learonal, Inc. | Copper colloid and method of activating insulating surfaces for subsequent electroplating |
US4681630A (en) * | 1982-09-27 | 1987-07-21 | Learonal, Inc. | Method of making copper colloid for activating insulating surfaces |
CH656401A5 (de) * | 1983-07-21 | 1986-06-30 | Suisse Horlogerie Rech Lab | Verfahren zur stromlosen abscheidung von metallen. |
JPS60120589A (ja) * | 1983-12-02 | 1985-06-28 | 塩尻工業株式会社 | プリント回路基板の製造方法 |
US4847114A (en) * | 1984-01-26 | 1989-07-11 | Learonal, Inc. | Preparation of printed circuit boards by selective metallization |
US4759952A (en) * | 1984-01-26 | 1988-07-26 | Learonal, Inc. | Process for printed circuit board manufacture |
US4761304A (en) * | 1984-01-26 | 1988-08-02 | Learonal, Inc. | Process for printed circuit board manufacture |
US5007990A (en) * | 1987-07-10 | 1991-04-16 | Shipley Company Inc. | Electroplating process |
US4952286A (en) * | 1987-07-10 | 1990-08-28 | Shipley Company Inc. | Electroplating process |
US4895739A (en) * | 1988-02-08 | 1990-01-23 | Shipley Company Inc. | Pretreatment for electroplating process |
US5294370A (en) * | 1988-11-15 | 1994-03-15 | Hbt Holland Biotechnology B.V. | Selenium or tellurium elemental hydrosols and their preparation |
NL8900305A (nl) * | 1989-02-08 | 1990-09-03 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting. |
JPH0379100A (ja) * | 1989-08-22 | 1991-04-04 | Matsushita Electric Ind Co Ltd | 光透過ペーストおよびそれを用いた金属銅析出方法 |
US4919768A (en) * | 1989-09-22 | 1990-04-24 | Shipley Company Inc. | Electroplating process |
US5147692A (en) * | 1990-05-08 | 1992-09-15 | Macdermid, Incorporated | Electroless plating of nickel onto surfaces such as copper or fused tungston |
JP2768390B2 (ja) * | 1990-12-11 | 1998-06-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 無電解金属付着のために基体をコンディショニングする方法 |
US5164286A (en) * | 1991-02-01 | 1992-11-17 | Ocg Microelectronic Materials, Inc. | Photoresist developer containing fluorinated amphoteric surfactant |
DE4113262A1 (de) * | 1991-04-23 | 1992-10-29 | Siemens Ag | Verfahren zum aufbringen einer basiskupferschicht auf einem substrat aus aluminiumoxid-keramik und verfahren zur herstellung sehr feiner leiterbahnstrukturen darauf |
DE4113263A1 (de) * | 1991-04-23 | 1992-10-29 | Siemens Ag | Verfahren zur ganzflaechigen, stromlosen beschichtung von kleinen formteilen aus keramischem material |
US5474798A (en) * | 1994-08-26 | 1995-12-12 | Macdermid, Incorporated | Method for the manufacture of printed circuit boards |
US6264851B1 (en) | 1998-03-17 | 2001-07-24 | International Business Machines Corporation | Selective seed and plate using permanent resist |
GB0118870D0 (en) * | 2001-08-02 | 2001-09-26 | Shipley Co Llc | A combined adhesion promotion and direct metallization process |
US7410893B2 (en) * | 2005-04-08 | 2008-08-12 | Hewlett-Packard Development Company, L.P. | System and method for depositing a seed layer |
US20110281135A1 (en) * | 2009-12-17 | 2011-11-17 | Byd Company Limited | Surface metallizing method, method for preparing plastic article and plastic article made therefrom |
EP2610365B1 (en) | 2011-12-31 | 2020-02-26 | Rohm and Haas Electronic Materials LLC | Electroless plating method |
EP2610366A3 (en) | 2011-12-31 | 2014-07-30 | Rohm and Haas Electronic Materials LLC | Plating catalyst and method |
JP6171189B2 (ja) * | 2012-02-02 | 2017-08-02 | ナノ−ヌーヴェル プロプライエタリー リミテッドNano−Nouvelle Pty Ltd. | 材料上の薄いコーティング |
EP3149222A4 (en) * | 2014-05-27 | 2018-06-06 | Auckland Uniservices Limited | Plating or coating method for producing metal-ceramic coating on a substrate |
JP6343787B1 (ja) * | 2017-06-01 | 2018-06-20 | 石原ケミカル株式会社 | 無電解銅メッキ用の銅コロイド触媒液並びに無電解銅メッキ方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3657003A (en) * | 1970-02-02 | 1972-04-18 | Western Electric Co | Method of rendering a non-wettable surface wettable |
US3925578A (en) * | 1971-07-29 | 1975-12-09 | Kollmorgen Photocircuits | Sensitized substrates for chemical metallization |
US3950570A (en) * | 1974-05-02 | 1976-04-13 | Western Electric Company, Inc. | Method of depositing a metal on a surface |
-
1975
- 1975-08-26 US US05/607,506 patent/US3993799A/en not_active Expired - Lifetime
- 1975-09-26 NL NL7511350A patent/NL7511350A/xx unknown
- 1975-09-29 GB GB39713/75A patent/GB1528015A/en not_active Expired
- 1975-10-01 CA CA236,844A patent/CA1081405A/en not_active Expired
- 1975-10-02 FR FR7530140A patent/FR2287094A1/fr not_active Withdrawn
- 1975-10-03 AU AU85437/75A patent/AU8543775A/en not_active Expired
- 1975-10-03 DE DE19752544381 patent/DE2544381A1/de active Pending
- 1975-10-03 BR BR7506436*A patent/BR7506436A/pt unknown
- 1975-10-03 JP JP50119662A patent/JPS5163464A/ja active Pending
- 1975-10-03 IT IT27918/75A patent/IT1043091B/it active
Also Published As
Publication number | Publication date |
---|---|
AU8543775A (en) | 1977-04-07 |
NL7511350A (nl) | 1976-04-06 |
GB1528015A (en) | 1978-10-11 |
US3993799A (en) | 1976-11-23 |
CA1081405A (en) | 1980-07-15 |
BR7506436A (pt) | 1976-08-10 |
JPS5163464A (en) | 1976-06-01 |
DE2544381A1 (de) | 1976-04-15 |
FR2287094A1 (fr) | 1976-04-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IT1043091B (it) | Procedimento per la placcatura chimica di superfici dielettriche e soluzione catalitica colloidale per la sua realizzazione | |
IT1013188B (it) | Procedimento e catalizzatore per la ossidazione di metilbenzeni | |
IT1082703B (it) | Catalizzatore di amminazione e procedimento per la produzione di alchilammine | |
IT1107704B (it) | Procedimento per la produzione di un catalizzatore di (amm)ossidazione | |
IT1085937B (it) | Catalizzatore per la produzione di alchilenossidi e relativi processi di preparazione e di impiego | |
IT996121B (it) | Procedimento catalitico per il trat tamento di idrocarburi con idrogeno | |
IT965960B (it) | Procedimento per l ossidazione catalitica di composti di e tri etero arilmetanici | |
IT1028218B (it) | Procedimento e dispositivo per il rivestimento per elettroforesidi pezzi metallici | |
IT1065251B (it) | Procedimento di cracking catalitico fluido e apparecchiatura per la sua realizzazione | |
IT1019357B (it) | Apparecchiatura per la depurazione catalitica di gas | |
RO69533A (ro) | Procedeu pentru producerea metalului lichid | |
IT1049889B (it) | Procedimento per la produzione di metaoruleina e catalizzatore di ossidazione impiegato in tale procedimento | |
IT1078290B (it) | Catalizzatore per reazioni di ossidazione e procedimento per la sua produzione e applicazione | |
IT964351B (it) | Raccordo elettrico e procedimento per la sua applicazione | |
IT945659B (it) | Procedimento per la conversione di idrocarburi catalizzatore impiegato e procedimento per la sua produzione | |
IT975936B (it) | Procedimento per la fabbricazione di contatti elettrici e dispositi vo per l attuazione di detto proce dimento | |
IT1064490B (it) | Catalizzatore per la polimerizzazione di alfa olefine e procedimento per la sua preparazione | |
IT1026322B (it) | Procedimento per la produzione di catalizzatori contenenti platino metallico | |
IT1015724B (it) | Procedimento di idrodeparaffina zione catalitica | |
IT1064489B (it) | Catalizzatore per la polimerizzazione di alfa olefine e procedimento per la sua preparazione | |
IT952902B (it) | Procedimento ed elettrolita per la nichelatura di articoli metal lici | |
IT1029973B (it) | Procedimento per la nitrurazione di metalli e bagni di sale per il medesimo | |
BR7402111D0 (pt) | Corpo catalitico para oxidacao do amoniaco e processo para sua fabricacao | |
IT949740B (it) | Procedimento di ossimazione dei ciclo alcani e reattore per la sua realizzazione | |
IT998287B (it) | Catalizzatore contenente platino sua preparazione e sua utilizzazio ne per la conversione di idrocarbu ri |