IN2014CN02464A - - Google Patents
Info
- Publication number
- IN2014CN02464A IN2014CN02464A IN2464CHN2014A IN2014CN02464A IN 2014CN02464 A IN2014CN02464 A IN 2014CN02464A IN 2464CHN2014 A IN2464CHN2014 A IN 2464CHN2014A IN 2014CN02464 A IN2014CN02464 A IN 2014CN02464A
- Authority
- IN
- India
- Prior art keywords
- relates
- coating
- microns
- thickness
- main component
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH01494/07A CH710184B1 (fr) | 2007-09-21 | 2007-09-21 | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques. |
PCT/EP2008/062042 WO2009037180A1 (fr) | 2007-09-21 | 2008-09-11 | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014CN02464A true IN2014CN02464A (de) | 2015-08-07 |
Family
ID=39967872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN2464CHN2014 IN2014CN02464A (de) | 2007-09-21 | 2008-09-11 |
Country Status (12)
Country | Link |
---|---|
US (3) | US10233555B2 (de) |
EP (1) | EP2205778B1 (de) |
JP (2) | JP5563462B2 (de) |
KR (1) | KR101280675B1 (de) |
CN (1) | CN101815814B (de) |
AT (1) | ATE499461T1 (de) |
CH (1) | CH710184B1 (de) |
DE (1) | DE602008005184D1 (de) |
HK (1) | HK1147782A1 (de) |
IN (1) | IN2014CN02464A (de) |
TW (2) | TWI507571B (de) |
WO (1) | WO2009037180A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH714243B1 (fr) * | 2006-10-03 | 2019-04-15 | Swatch Group Res & Dev Ltd | Procédé d'électroformage et pièce ou couche obtenue par ce procédé. |
CH710184B1 (fr) | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques. |
EP2312021B1 (de) * | 2009-10-15 | 2020-03-18 | The Swatch Group Research and Development Ltd. | Verfahren zum erhalten einer gelben goldlegierungsablagerung durch galvanoplastik ohne verwendung von giftigen metallen |
EP2505691B1 (de) * | 2011-03-31 | 2014-03-12 | The Swatch Group Research and Development Ltd. | Verfahren zur Herhaltung einer Beschichtung aus einer Goldlegierung 18 Karat 3N |
ITFI20120103A1 (it) * | 2012-06-01 | 2013-12-02 | Bluclad Srl | Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni. |
WO2016020812A1 (en) * | 2014-08-04 | 2016-02-11 | Nutec International Srl | Electrolytic bath, electrolytic deposition method and item obtained with said method |
CN109504991B (zh) * | 2019-01-21 | 2020-08-07 | 南京市产品质量监督检验院 | 一种无氰18k金电铸液、其制备方法及其应用 |
Family Cites Families (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2596454A (en) * | 1949-09-10 | 1952-05-13 | Metals & Controls Corp | Gold alloys |
US2660554A (en) * | 1950-11-10 | 1953-11-24 | Barnet D Ostrow | Bright gold and gold alloy plating baths |
CH286123A (fr) * | 1952-05-08 | 1952-10-15 | Spreter Victor | Bain pour le dépôt par voie galvanique d'alliages d'or. |
US2976180A (en) * | 1957-12-17 | 1961-03-21 | Hughes Aircraft Co | Method of silver plating by chemical reduction |
FR1259407A (fr) | 1960-03-10 | 1961-04-28 | Maison Murat | Bain électrolytique pour dépôt épais d'alliage or-cuivre |
CH455434A (de) * | 1963-08-15 | 1968-07-15 | Werner Fluehmann Galvanische A | Verfahren zur Herstellung von Weissgoldüberzügen |
DE1460993A1 (de) | 1965-07-23 | 1970-07-23 | Kieninger & Obergfell | Elektrisches Programmsteuergeraet,vorzugsweise fuer elektrische Haushaltsgeraete,insbesondere Waschmaschinen und Geschirrspuelmaschinen |
US3475292A (en) * | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
GB1156186A (en) * | 1966-09-26 | 1969-06-25 | Sel Rex Corp | Gold Plating |
BE743946A (de) * | 1969-01-07 | 1970-05-28 | ||
US3642589A (en) * | 1969-09-29 | 1972-02-15 | Fred I Nobel | Gold alloy electroplating baths |
US3666640A (en) * | 1971-04-23 | 1972-05-30 | Sel Rex Corp | Gold plating bath and process |
DE2121150C3 (de) * | 1971-04-24 | 1980-08-21 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Verfahren zur galvanischen Abscheidung von Goldlegierungen |
CH529843A (fr) | 1971-07-09 | 1972-10-31 | Oxy Metal Finishing Europ S A | Bain pour le dépôt électrolytique d'alliages d'or et son utilisation en galvanoplastie |
FR2181455B1 (de) * | 1972-04-25 | 1974-08-30 | Parker Ste Continentale | |
DE2244434C3 (de) * | 1972-09-06 | 1982-02-25 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen |
US3902977A (en) * | 1973-12-13 | 1975-09-02 | Engelhard Min & Chem | Gold plating solutions and method |
CH621367A5 (en) | 1977-07-08 | 1981-01-30 | Systemes Traitements Surfaces | Electrolytic bath for plating gold-copper-cadmium alloys and its use in galvanoplasty |
CH622829A5 (de) * | 1977-08-29 | 1981-04-30 | Systemes Traitements Surfaces | |
FR2405312A1 (fr) * | 1977-10-10 | 1979-05-04 | Oxy Metal Industries Corp | Bains electrolytiques pour le depot d'alliages d'or |
US4168214A (en) * | 1978-06-14 | 1979-09-18 | American Chemical And Refining Company, Inc. | Gold electroplating bath and method of making the same |
DE3020765A1 (de) * | 1980-05-31 | 1981-12-10 | Degussa Ag, 6000 Frankfurt | Alkalisches bad zum galvanischen abscheiden niederkaraetiger rosa- bis gelbfarbener goldlegierungsschichten |
GB8334226D0 (en) * | 1983-12-22 | 1984-02-01 | Learonal Uk Ltd | Electrodeposition of gold alloys |
US4626324A (en) | 1984-04-30 | 1986-12-02 | Allied Corporation | Baths for the electrolytic deposition of nickel-indium alloys on printed circuit boards |
CH662583A5 (fr) * | 1985-03-01 | 1987-10-15 | Heinz Emmenegger | Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc. |
JPS62164890A (ja) | 1986-01-16 | 1987-07-21 | Seiko Instr & Electronics Ltd | 金銀銅合金めつき液 |
ATE86313T1 (de) * | 1987-08-21 | 1993-03-15 | Engelhard Ltd | Bad fuer das elektroplattieren einer gold-kupfer- zink-legierung. |
JPH01247540A (ja) | 1988-03-29 | 1989-10-03 | Seiko Instr Inc | 硬質金合金外装部品の製造方法 |
GB8903818D0 (en) * | 1989-02-20 | 1989-04-05 | Engelhard Corp | Electrolytic deposition of gold-containing alloys |
DE3929569C1 (de) | 1989-09-06 | 1991-04-18 | Degussa Ag, 6000 Frankfurt, De | |
GB2242200B (en) * | 1990-02-20 | 1993-11-17 | Omi International | Plating compositions and processes |
CH680927A5 (de) | 1990-10-08 | 1992-12-15 | Metaux Precieux Sa | |
US5085744A (en) * | 1990-11-06 | 1992-02-04 | Learonal, Inc. | Electroplated gold-copper-zinc alloys |
US5244593A (en) * | 1992-01-10 | 1993-09-14 | The Procter & Gamble Company | Colorless detergent compositions with enhanced stability |
US5256275A (en) * | 1992-04-15 | 1993-10-26 | Learonal, Inc. | Electroplated gold-copper-silver alloys |
US5340529A (en) * | 1993-07-01 | 1994-08-23 | Dewitt Troy C | Gold jewelry alloy |
AU7320996A (en) | 1995-11-03 | 1997-05-29 | Enthone-Omi Inc | Electroplating processes compositions and deposits |
DE19629658C2 (de) | 1996-07-23 | 1999-01-14 | Degussa | Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen |
WO2000079031A1 (de) * | 1999-06-17 | 2000-12-28 | Degussa Galvanotechnik Gmbh | Saures bad zur galvanischen abscheidung von glänzenden gold- und goldlegierungsschichten und glanzzusatz hierfür |
JP2001198693A (ja) | 2000-01-17 | 2001-07-24 | Ishifuku Metal Ind Co Ltd | 工業用及び宝飾用金ろう |
JP4023138B2 (ja) * | 2001-02-07 | 2007-12-19 | 日立金属株式会社 | 鉄基希土類合金粉末および鉄基希土類合金粉末を含むコンパウンドならびにそれを用いた永久磁石 |
FR2828889B1 (fr) * | 2001-08-24 | 2004-05-07 | Engelhard Clal Sas | Bain electrolytique pour le depot electrochimique de l'or et de ses alliages |
EP1548525B2 (de) * | 2003-12-23 | 2017-08-16 | Rolex Sa | Keramisches Element für Uhrengehäuse und Verfahren zu seiner Herstellung |
JP4566667B2 (ja) * | 2004-01-16 | 2010-10-20 | キヤノン株式会社 | めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置 |
JP2005214903A (ja) * | 2004-01-30 | 2005-08-11 | Kawaguchiko Seimitsu Co Ltd | 指標付き文字板の製造方法及びその製造方法を用いて製造した指標付き文字板。 |
SG127854A1 (en) * | 2005-06-02 | 2006-12-29 | Rohm & Haas Elect Mat | Improved gold electrolytes |
CH710184B1 (fr) * | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques. |
-
2007
- 2007-09-21 CH CH01494/07A patent/CH710184B1/fr unknown
-
2008
- 2008-09-11 EP EP08804009A patent/EP2205778B1/de active Active
- 2008-09-11 KR KR1020107008598A patent/KR101280675B1/ko active IP Right Grant
- 2008-09-11 AT AT08804009T patent/ATE499461T1/de not_active IP Right Cessation
- 2008-09-11 CN CN200880107881XA patent/CN101815814B/zh active Active
- 2008-09-11 IN IN2464CHN2014 patent/IN2014CN02464A/en unknown
- 2008-09-11 DE DE602008005184T patent/DE602008005184D1/de active Active
- 2008-09-11 JP JP2010525308A patent/JP5563462B2/ja active Active
- 2008-09-11 WO PCT/EP2008/062042 patent/WO2009037180A1/fr active Application Filing
- 2008-09-11 US US12/678,984 patent/US10233555B2/en active Active
- 2008-09-17 TW TW103113847A patent/TWI507571B/zh active
- 2008-09-17 TW TW097135667A patent/TWI441959B/zh active
-
2011
- 2011-02-24 HK HK11101836.3A patent/HK1147782A1/xx unknown
-
2014
- 2014-04-03 US US14/244,071 patent/US9683303B2/en active Active
- 2014-06-12 JP JP2014121169A patent/JP5887381B2/ja active Active
-
2019
- 2019-01-28 US US16/259,444 patent/US10619260B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP2205778A1 (de) | 2010-07-14 |
TWI441959B (zh) | 2014-06-21 |
JP5563462B2 (ja) | 2014-07-30 |
CN101815814A (zh) | 2010-08-25 |
US20140299481A1 (en) | 2014-10-09 |
CH710184B1 (fr) | 2016-03-31 |
US20100206739A1 (en) | 2010-08-19 |
HK1147782A1 (en) | 2011-08-19 |
US20190153608A1 (en) | 2019-05-23 |
US9683303B2 (en) | 2017-06-20 |
KR101280675B1 (ko) | 2013-07-01 |
DE602008005184D1 (de) | 2011-04-07 |
KR20100075935A (ko) | 2010-07-05 |
JP5887381B2 (ja) | 2016-03-16 |
WO2009037180A1 (fr) | 2009-03-26 |
TW201428143A (zh) | 2014-07-16 |
US10233555B2 (en) | 2019-03-19 |
TW200930844A (en) | 2009-07-16 |
US10619260B2 (en) | 2020-04-14 |
JP2014194087A (ja) | 2014-10-09 |
TWI507571B (zh) | 2015-11-11 |
JP2010539335A (ja) | 2010-12-16 |
EP2205778B1 (de) | 2011-02-23 |
ATE499461T1 (de) | 2011-03-15 |
CN101815814B (zh) | 2012-05-16 |
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