IN2009CH01141A - - Google Patents

Info

Publication number
IN2009CH01141A
IN2009CH01141A IN1141CH2009A IN2009CH01141A IN 2009CH01141 A IN2009CH01141 A IN 2009CH01141A IN 1141CH2009 A IN1141CH2009 A IN 1141CH2009A IN 2009CH01141 A IN2009CH01141 A IN 2009CH01141A
Authority
IN
India
Application number
Inventor
Michelle Chretien
Naveen Chopra
Matthew A Heuft
Peter M Kazmaier
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of IN2009CH01141A publication Critical patent/IN2009CH01141A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
IN1141CH2009 2008-05-23 2009-05-18 IN2009CH01141A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/126,581 US7789935B2 (en) 2008-05-23 2008-05-23 Photochemical synthesis of metallic nanoparticles for ink applications

Publications (1)

Publication Number Publication Date
IN2009CH01141A true IN2009CH01141A (en) 2010-05-28

Family

ID=40940660

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1141CH2009 IN2009CH01141A (en) 2008-05-23 2009-05-18

Country Status (7)

Country Link
US (1) US7789935B2 (en)
EP (1) EP2123723B1 (en)
JP (1) JP5641274B2 (en)
KR (1) KR101446481B1 (en)
CN (1) CN101585984B (en)
CA (1) CA2666037C (en)
IN (1) IN2009CH01141A (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100830871B1 (en) * 2006-10-11 2008-05-21 삼성전기주식회사 Method for surface modification of nondispersible metal nanoparticles and modified metal nanoparticles for inkjet by the same method
US7976733B2 (en) * 2007-11-30 2011-07-12 Xerox Corporation Air stable copper nanoparticle ink and applications therefor
DE102008052586A1 (en) * 2008-10-21 2010-04-22 Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh Composition for producing optical elements with gradient structure
US7998239B1 (en) * 2008-11-20 2011-08-16 Sandia Corporation Alloy nanoparticle synthesis using ionizing radiation
US7857998B2 (en) * 2008-11-24 2010-12-28 E. I. Du Pont De Nemours And Company High conductivity polymer thick film silver conductor composition for use in RFID and other applications
US8067259B2 (en) * 2009-05-12 2011-11-29 Evident Technologies Method of producing high performance photovoltaic and thermoelectric nanostructured bulk and thin films
US8759421B2 (en) 2010-08-31 2014-06-24 Samsung Electronics Co., Ltd. Continuous process for preparing nanodispersions using an ultrasonic flow-through heat exchanger
US8657431B2 (en) 2011-03-17 2014-02-25 Xerox Corporation Phase change magnetic ink comprising carbon coated magnetic nanoparticles and process for preparing same
US8646896B2 (en) 2011-03-17 2014-02-11 Xerox Corporation Phase change magnetic ink comprising surfactant coated magnetic nanoparticles and process for preparing same
US8702217B2 (en) 2011-03-17 2014-04-22 Xerox Corporation Phase change magnetic ink comprising polymer coated magnetic nanoparticles and process for preparing same
US20120286502A1 (en) 2011-05-13 2012-11-15 Xerox Corporation Storage Stable Images
US10421127B2 (en) 2014-09-03 2019-09-24 Raytheon Company Method for forming lanthanide nanoparticles
EP3374194B1 (en) * 2015-11-13 2019-08-14 Exatec, LLC. Methods of printing with conductive paste
EP3354629A1 (en) * 2017-01-31 2018-08-01 Centre National De La Recherche Scientifique Material having a metal layer and a process for preparing this material
US10492297B2 (en) * 2017-02-22 2019-11-26 Xerox Corporation Hybrid nanosilver/liquid metal ink composition and uses thereof
US10800938B2 (en) * 2017-09-16 2020-10-13 Xerox Corporation Molecular organic reactive inks for conductive metal printing using photoinitiators
US10814659B2 (en) 2018-06-28 2020-10-27 Xerox Corporation Methods for printing conductive objects
CN111168079B (en) * 2020-01-15 2023-01-10 浙江工业大学 Method for synthesizing metal nanoparticles based on glass surface
US11492547B2 (en) 2020-06-04 2022-11-08 UbiQD, Inc. Low-PH nanoparticles and ligands

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2309575A1 (en) * 2000-05-26 2001-11-26 James E. Guillet Internally cross-linked macromolecules
AU3958102A (en) * 2000-12-15 2002-06-24 Univ Arizona Method for patterning metal using nanoparticle containing precursors
AUPR725601A0 (en) * 2001-08-24 2001-09-20 Commonwealth Scientific And Industrial Research Organisation Strain gauges
US7629017B2 (en) * 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
IL161622A0 (en) * 2001-11-01 2004-09-27 Yissum Res Dev Co Ink jet inks containing metal nanoparticles
US20030151028A1 (en) * 2002-02-14 2003-08-14 Lawrence Daniel P. Conductive flexographic and gravure ink
US6887297B2 (en) * 2002-11-08 2005-05-03 Wayne State University Copper nanocrystals and methods of producing same
US20040178391A1 (en) * 2003-01-29 2004-09-16 Conaghan Brian F. High conductivity inks with low minimum curing temperatures
JP2007524755A (en) 2003-04-02 2007-08-30 ノースウエスタン ユニバーシティ Nanoparticle growth control method
JP4636454B2 (en) * 2003-05-13 2011-02-23 三菱マテリアル株式会社 Manufacturing method and use of metal nanorods
CN1709617A (en) * 2004-06-18 2005-12-21 中国科学院兰州化学物理研究所 Method for preparing nano copper particle
JP2007070722A (en) * 2005-08-12 2007-03-22 Osaka Univ Method for forming metal nanoparticle
US20080085410A1 (en) * 2006-10-06 2008-04-10 General Electric Company Composition and associated method
KR20080088712A (en) * 2007-03-30 2008-10-06 삼성전자주식회사 Conductive ink composition and method of forming conductive pattern using the same
KR20100068278A (en) * 2007-10-15 2010-06-22 나노잉크, 인크. Lithography of nanoparticle based inks
US8062698B2 (en) * 2008-03-10 2011-11-22 Xerox Corporation Synthesis of conductive metal markings for chipless RFID applications

Also Published As

Publication number Publication date
KR20090122153A (en) 2009-11-26
KR101446481B1 (en) 2014-10-10
US20090288517A1 (en) 2009-11-26
EP2123723B1 (en) 2013-01-23
CA2666037C (en) 2013-10-08
JP5641274B2 (en) 2014-12-17
US7789935B2 (en) 2010-09-07
CN101585984B (en) 2013-12-04
CN101585984A (en) 2009-11-25
CA2666037A1 (en) 2009-11-23
EP2123723A1 (en) 2009-11-25
JP2009280812A (en) 2009-12-03

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