IL160393A0 - Method for supplying divided gas to a chamber from a gas supply apparatus equipped with a flow rate control system - Google Patents

Method for supplying divided gas to a chamber from a gas supply apparatus equipped with a flow rate control system

Info

Publication number
IL160393A0
IL160393A0 IL16039303A IL16039303A IL160393A0 IL 160393 A0 IL160393 A0 IL 160393A0 IL 16039303 A IL16039303 A IL 16039303A IL 16039303 A IL16039303 A IL 16039303A IL 160393 A0 IL160393 A0 IL 160393A0
Authority
IL
Israel
Prior art keywords
chamber
flow rate
control system
supply apparatus
rate control
Prior art date
Application number
IL16039303A
Other languages
English (en)
Original Assignee
Fujikin Kk
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikin Kk, Tokyo Electron Ltd filed Critical Fujikin Kk
Publication of IL160393A0 publication Critical patent/IL160393A0/xx

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • G05D7/0641—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means
    • G05D7/0664—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means the plurality of throttling means being arranged for the control of a plurality of diverging flows from a single flow
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7722—Line condition change responsive valves
    • Y10T137/7758—Pilot or servo controlled
    • Y10T137/7759—Responsive to change in rate of fluid flow
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7722—Line condition change responsive valves
    • Y10T137/7758—Pilot or servo controlled
    • Y10T137/7761—Electrically actuated valve

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Flow Control (AREA)
IL16039303A 2002-06-03 2003-01-20 Method for supplying divided gas to a chamber from a gas supply apparatus equipped with a flow rate control system IL160393A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002161086A JP3856730B2 (ja) 2002-06-03 2002-06-03 流量制御装置を備えたガス供給設備からのチャンバーへのガス分流供給方法。
PCT/JP2003/000437 WO2003102707A1 (fr) 2002-06-03 2003-01-20 Procede pour acheminer un gaz entre une installation d'acheminement de gaz equipee d'un regulateur de debit et une chambre, tout en le divisant

Publications (1)

Publication Number Publication Date
IL160393A0 true IL160393A0 (en) 2004-07-25

Family

ID=29706569

Family Applications (2)

Application Number Title Priority Date Filing Date
IL16039303A IL160393A0 (en) 2002-06-03 2003-01-20 Method for supplying divided gas to a chamber from a gas supply apparatus equipped with a flow rate control system
IL160393A IL160393A (en) 2002-06-03 2004-02-13 A method of supplying gas divided into a cell from a gas supply device equipped with a flow rate control system

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL160393A IL160393A (en) 2002-06-03 2004-02-13 A method of supplying gas divided into a cell from a gas supply device equipped with a flow rate control system

Country Status (9)

Country Link
US (1) US7059363B2 (xx)
EP (1) EP1521154A1 (xx)
JP (1) JP3856730B2 (xx)
KR (1) KR100556195B1 (xx)
CN (1) CN100426169C (xx)
CA (1) CA2457986A1 (xx)
IL (2) IL160393A0 (xx)
TW (1) TW565756B (xx)
WO (1) WO2003102707A1 (xx)

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JP4351495B2 (ja) * 2003-07-16 2009-10-28 株式会社堀場エステック 流量比率制御装置
US7072743B2 (en) * 2004-03-09 2006-07-04 Mks Instruments, Inc. Semiconductor manufacturing gas flow divider system and method
JP4550507B2 (ja) * 2004-07-26 2010-09-22 株式会社日立ハイテクノロジーズ プラズマ処理装置
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JP2008526887A (ja) 2005-01-10 2008-07-24 ユニバーシティ オブ コネチカット カンナビノイド受容体に作用する新規なヘテロピロール類似体
US20060288934A1 (en) * 2005-06-22 2006-12-28 Tokyo Electron Limited Electrode assembly and plasma processing apparatus
US9520276B2 (en) 2005-06-22 2016-12-13 Tokyo Electron Limited Electrode assembly and plasma processing apparatus
CN100466164C (zh) * 2005-12-08 2009-03-04 北京圆合电子技术有限责任公司 一种真空腔室的充气***
US20070151668A1 (en) * 2006-01-04 2007-07-05 Tokyo Electron Limited Gas supply system, substrate processing apparatus, and gas supply method
JP4895167B2 (ja) * 2006-01-31 2012-03-14 東京エレクトロン株式会社 ガス供給装置，基板処理装置，ガス供給方法
JP2007208085A (ja) * 2006-02-03 2007-08-16 Hitachi High-Technologies Corp プラズマ処理装置及びその分流比検定方法
US7896967B2 (en) * 2006-02-06 2011-03-01 Tokyo Electron Limited Gas supply system, substrate processing apparatus and gas supply method
JP4911984B2 (ja) * 2006-02-08 2012-04-04 東京エレクトロン株式会社 ガス供給装置，基板処理装置，ガス供給方法及びシャワーヘッド
JP4814706B2 (ja) 2006-06-27 2011-11-16 株式会社フジキン 流量比可変型流体供給装置
US20080078746A1 (en) * 2006-08-15 2008-04-03 Noriiki Masuda Substrate processing system, gas supply unit, method of substrate processing, computer program, and storage medium
JP4642115B2 (ja) * 2006-12-12 2011-03-02 株式会社堀場エステック 流量比率制御装置
JP4598044B2 (ja) * 2007-10-29 2010-12-15 シーケーディ株式会社 流量検定故障診断装置、流量検定故障診断方法及び流量検定故障診断プログラム
JP5192214B2 (ja) * 2007-11-02 2013-05-08 東京エレクトロン株式会社 ガス供給装置、基板処理装置および基板処理方法
JP5054500B2 (ja) * 2007-12-11 2012-10-24 株式会社フジキン 圧力制御式流量基準器
JP5011195B2 (ja) * 2008-04-10 2012-08-29 東京エレクトロン株式会社 流体分流供給ユニット
AU2009281170B2 (en) * 2008-08-13 2013-01-31 Shell Internationale Research Maatschappij B.V. Method for controlling a gas flow between a plurality of gas streams
WO2011021539A1 (ja) * 2009-08-20 2011-02-24 東京エレクトロン株式会社 プラズマ処理装置とプラズマ処理方法
CN103003924B (zh) * 2010-06-28 2015-07-08 东京毅力科创株式会社 等离子体处理装置及方法
KR20130093597A (ko) * 2010-08-02 2013-08-22 바젤 폴리올레핀 게엠베하 유체 흐름들을 혼합하고 분할하는 방법 및 장치
JP2013093514A (ja) * 2011-10-27 2013-05-16 Sharp Corp 気相成長装置
JP2013098233A (ja) * 2011-10-28 2013-05-20 Sharp Corp 気相成長装置
JP5881467B2 (ja) * 2012-02-29 2016-03-09 株式会社フジキン ガス分流供給装置及びこれを用いたガス分流供給方法
JP6037707B2 (ja) * 2012-08-07 2016-12-07 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理装置の診断方法
US9454158B2 (en) 2013-03-15 2016-09-27 Bhushan Somani Real time diagnostics for flow controller systems and methods
DE102014110159A1 (de) * 2014-07-18 2016-01-21 Krones Aktiengesellschaft Verfahren und Vorrichtung zum Befüllen eines Behälters mit einem Füllprodukt
CN105576268B (zh) 2014-10-08 2019-02-15 通用电气公司 用于控制流量比的***和方法
US10658222B2 (en) 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
TW201634738A (zh) * 2015-01-22 2016-10-01 應用材料股份有限公司 用於在空間上分離之原子層沉積腔室的經改良注射器
KR101652469B1 (ko) * 2015-02-27 2016-08-30 주식회사 유진테크 다중 가스 제공 방법 및 다중 가스 제공 장치
US9904299B2 (en) 2015-04-08 2018-02-27 Tokyo Electron Limited Gas supply control method
US10957561B2 (en) * 2015-07-30 2021-03-23 Lam Research Corporation Gas delivery system
KR102339509B1 (ko) * 2015-09-11 2021-12-16 히타치 긴조쿠 가부시키가이샤 질량 유량 제어 장치
US10192751B2 (en) 2015-10-15 2019-01-29 Lam Research Corporation Systems and methods for ultrahigh selective nitride etch
US10497542B2 (en) 2016-01-04 2019-12-03 Daniel T. Mudd Flow control showerhead with integrated flow restrictors for improved gas delivery to a semiconductor process
US10825659B2 (en) 2016-01-07 2020-11-03 Lam Research Corporation Substrate processing chamber including multiple gas injection points and dual injector
US10651015B2 (en) 2016-02-12 2020-05-12 Lam Research Corporation Variable depth edge ring for etch uniformity control
US10147588B2 (en) 2016-02-12 2018-12-04 Lam Research Corporation System and method for increasing electron density levels in a plasma of a substrate processing system
US10699878B2 (en) 2016-02-12 2020-06-30 Lam Research Corporation Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring
US10438833B2 (en) 2016-02-16 2019-10-08 Lam Research Corporation Wafer lift ring system for wafer transfer
US10410832B2 (en) 2016-08-19 2019-09-10 Lam Research Corporation Control of on-wafer CD uniformity with movable edge ring and gas injection adjustment
US10279942B1 (en) * 2017-01-17 2019-05-07 Rodney Laible Automatic detection system for detecting disruptions in the flow to a dispensing apparatus
US10365665B2 (en) 2017-01-17 2019-07-30 Rodney Laible Automatic detection system for detecting disruptions in the flow to a dispensing apparatus
CN110234965B (zh) * 2017-02-10 2020-10-27 株式会社富士金 流量测定方法以及流量测定装置
US10983537B2 (en) 2017-02-27 2021-04-20 Flow Devices And Systems Inc. Systems and methods for flow sensor back pressure adjustment for mass flow controller
JP6912947B2 (ja) * 2017-06-14 2021-08-04 川崎重工業株式会社 油圧システム
JP7122102B2 (ja) 2017-11-08 2022-08-19 東京エレクトロン株式会社 ガス供給システム及びガス供給方法
JP7044629B2 (ja) * 2018-05-18 2022-03-30 株式会社堀場エステック 流体制御装置、及び、流量比率制御装置
JP7068062B2 (ja) * 2018-06-18 2022-05-16 株式会社堀場製作所 流体制御装置、及び、流量比率制御装置
CN113632038A (zh) * 2019-04-25 2021-11-09 株式会社富士金 流量控制装置
CN112378950B (zh) * 2020-10-14 2022-11-22 上海交通大学 一种用于模拟高温气体传热特性的实验设备

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JP3291161B2 (ja) 1995-06-12 2002-06-10 株式会社フジキン 圧力式流量制御装置
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Also Published As

Publication number Publication date
KR20040024869A (ko) 2004-03-22
CN100426169C (zh) 2008-10-15
TW565756B (en) 2003-12-11
JP3856730B2 (ja) 2006-12-13
US20050005994A1 (en) 2005-01-13
CN1543596A (zh) 2004-11-03
IL160393A (en) 2009-02-11
TW200307863A (en) 2003-12-16
JP2004005308A (ja) 2004-01-08
WO2003102707A1 (fr) 2003-12-11
CA2457986A1 (en) 2003-12-11
US7059363B2 (en) 2006-06-13
EP1521154A1 (en) 2005-04-06
KR100556195B1 (ko) 2006-03-03

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FF Patent granted