IE871336L - Pressure sensitive adhesive tape for masking areas of a¹printed circuit board - Google Patents
Pressure sensitive adhesive tape for masking areas of a¹printed circuit boardInfo
- Publication number
- IE871336L IE871336L IE871336A IE133687A IE871336L IE 871336 L IE871336 L IE 871336L IE 871336 A IE871336 A IE 871336A IE 133687 A IE133687 A IE 133687A IE 871336 L IE871336 L IE 871336L
- Authority
- IE
- Ireland
- Prior art keywords
- sensitive adhesive
- covering material
- circuit board
- seconds
- temperatures
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/224—Anti-weld compositions; Braze stop-off compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Pressure-sensitive adhesive tape for covering selected zones of an object, such as a circuit board, during high-temperature working operations, for example soldering, comprises a polymer film coated with a pressure-sensitive adhesive, where the film and adhesive are resistant to temperatures of up to 250@C for a period of up to 5 seconds and both are soluble in a fluorocarbon solvent such as trichlorotrifluoroethane. In particular, the film and the adhesive are resistant to temperatures of up to 260@C for a period of up to 25 seconds. The polymer film, which represents a novel, self-supporting film, can expediently contain a polymethacrylate (for example polybutyl methacrylate), ethylcellulose or polyvinylpyrrolidone. A covering material for electronic components, containing a polymeric material which is soluble in a fluorocarbon solvent and is resistant to temperatures of up to 250@C for a period of up to 5 seconds, where the covering material is in the form of a) a continuous roll of a tape, b) shaped pieces or c) a solution or dispersion. What is described is a process comprising applying the covering material to an electronic component, carrying out the high-temperature working operation and subsequently washing the component in a fluorocarbon solvent in order to dissolve the covering material.
[DE3721194A1]
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IE871336A IE871336L (en) | 1987-05-21 | 1987-05-21 | Pressure sensitive adhesive tape for masking areas of a¹printed circuit board |
DE19873721194 DE3721194A1 (en) | 1987-05-21 | 1987-06-26 | Soluble tape and soluble film |
JP62249672A JPS63301285A (en) | 1987-05-21 | 1987-10-02 | Soluble tape and film |
LU87069A LU87069A1 (en) | 1987-05-21 | 1987-12-10 | SOLUBLE TAPE AND SOLUBLE FILM |
US07/196,510 US4917926A (en) | 1987-05-21 | 1988-05-20 | Soluble tape and film |
EP88304582A EP0292304B1 (en) | 1987-05-21 | 1988-05-20 | Soluble tape and film and masking method using them |
DE8888304582T DE3867707D1 (en) | 1987-05-21 | 1988-05-20 | SOLUBLE TAPE AND FILM AND MASKING METHOD USING THE SAME. |
AT88304582T ATE71649T1 (en) | 1987-05-21 | 1988-05-20 | SOLUBLE TAPE AND FILM AND MASKING PROCESSES USING SAME. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IE871336A IE871336L (en) | 1987-05-21 | 1987-05-21 | Pressure sensitive adhesive tape for masking areas of a¹printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
IE871336L true IE871336L (en) | 1988-11-21 |
Family
ID=11025711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IE871336A IE871336L (en) | 1987-05-21 | 1987-05-21 | Pressure sensitive adhesive tape for masking areas of a¹printed circuit board |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS63301285A (en) |
DE (1) | DE3721194A1 (en) |
IE (1) | IE871336L (en) |
LU (1) | LU87069A1 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3290206A (en) * | 1965-06-14 | 1966-12-06 | Minnesota Mining & Mfg | Curl resistant laminate |
JPS4994747A (en) * | 1972-11-17 | 1974-09-09 | ||
JPS5714673A (en) * | 1980-06-30 | 1982-01-25 | Nitto Electric Ind Co Ltd | Pressure sensitive adhesive composition for surface protecting sheet |
JPS5757104A (en) * | 1980-09-24 | 1982-04-06 | Hitachi Ltd | Plate-shaped work automatic feeding holding equipment |
JPS58201873A (en) * | 1982-05-18 | 1983-11-24 | Nitto Electric Ind Co Ltd | Preparation of surface protective sheet |
-
1987
- 1987-05-21 IE IE871336A patent/IE871336L/en unknown
- 1987-06-26 DE DE19873721194 patent/DE3721194A1/en not_active Withdrawn
- 1987-10-02 JP JP62249672A patent/JPS63301285A/en active Pending
- 1987-12-10 LU LU87069A patent/LU87069A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
LU87069A1 (en) | 1988-06-13 |
JPS63301285A (en) | 1988-12-08 |
DE3721194A1 (en) | 1988-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0252451A3 (en) | Substrate of hybrid ic, method of forming a circuit pattern and apparatus of forming the same | |
EP0166624A3 (en) | Ultrathin chemically resistant marker and method of producing therefor | |
CA2021580A1 (en) | Polysiloxane-grafted copolymer topical binder composition with novel fluorochemical comonomer and method of coating therewith | |
MY107097A (en) | Moisture indicating ink and package having same. | |
MY127834A (en) | Temporary attachment adhesive tape for multilayer ceramic capacitor and method for producing multilayer ceramic capacitor | |
US4917926A (en) | Soluble tape and film | |
IE871336L (en) | Pressure sensitive adhesive tape for masking areas of a¹printed circuit board | |
IE823104L (en) | Adhesive tapes | |
ATE29146T1 (en) | SELF-ADHESIVE MATERIAL AND METHOD OF PRODUCTION. | |
JPS56125471A (en) | Pressure-sensitive adhesive composition | |
AT351885B (en) | PROCESS FOR THE PRODUCTION OF METALLOPHOBE (METAL-REPELLENT) SURFACES ON OBJECTS, IN PARTICULAR FOR THE PRODUCTION OF BASE MATERIAL FOR PRINTED CIRCUITS | |
EP0324599A3 (en) | Process for preparing polymeric materials for application to printed circuits | |
GB1474247A (en) | Provision of solder-stop protection for conductor paths on circuit boards | |
US4601934A (en) | Masking of electrical printed circuit boards | |
JPS5462238A (en) | Detackifier for adhesive film | |
EP0292304B1 (en) | Soluble tape and film and masking method using them | |
JPS5521468A (en) | Manufacture of pressure-sensitive adhesive sheet having colored adhesive layer | |
GB2004499A (en) | Transferring coatings of adhesives to laminates | |
GR3019177T3 (en) | Wallpaper adhesives | |
JPS55115483A (en) | Production of adhesive tape for labelling | |
EP0400801A3 (en) | Polymeric film | |
JPS5649782A (en) | Production of pressure-sensitive adhesive sheet or tape | |
JPS5430231A (en) | Manufacture of pressuresensitive adhesive tape | |
JPS56112982A (en) | Size composition and processing method | |
JPS5371139A (en) | Hot-melt adhesive compositions |