IE871336L - Pressure sensitive adhesive tape for masking areas of a¹printed circuit board - Google Patents

Pressure sensitive adhesive tape for masking areas of a¹printed circuit board

Info

Publication number
IE871336L
IE871336L IE871336A IE133687A IE871336L IE 871336 L IE871336 L IE 871336L IE 871336 A IE871336 A IE 871336A IE 133687 A IE133687 A IE 133687A IE 871336 L IE871336 L IE 871336L
Authority
IE
Ireland
Prior art keywords
sensitive adhesive
covering material
circuit board
seconds
temperatures
Prior art date
Application number
IE871336A
Original Assignee
Waterford Res And Dev Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Waterford Res And Dev Ltd filed Critical Waterford Res And Dev Ltd
Priority to IE871336A priority Critical patent/IE871336L/en
Priority to DE19873721194 priority patent/DE3721194A1/en
Priority to JP62249672A priority patent/JPS63301285A/en
Priority to LU87069A priority patent/LU87069A1/en
Priority to US07/196,510 priority patent/US4917926A/en
Priority to EP88304582A priority patent/EP0292304B1/en
Priority to DE8888304582T priority patent/DE3867707D1/en
Priority to AT88304582T priority patent/ATE71649T1/en
Publication of IE871336L publication Critical patent/IE871336L/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Pressure-sensitive adhesive tape for covering selected zones of an object, such as a circuit board, during high-temperature working operations, for example soldering, comprises a polymer film coated with a pressure-sensitive adhesive, where the film and adhesive are resistant to temperatures of up to 250@C for a period of up to 5 seconds and both are soluble in a fluorocarbon solvent such as trichlorotrifluoroethane. In particular, the film and the adhesive are resistant to temperatures of up to 260@C for a period of up to 25 seconds. The polymer film, which represents a novel, self-supporting film, can expediently contain a polymethacrylate (for example polybutyl methacrylate), ethylcellulose or polyvinylpyrrolidone. A covering material for electronic components, containing a polymeric material which is soluble in a fluorocarbon solvent and is resistant to temperatures of up to 250@C for a period of up to 5 seconds, where the covering material is in the form of a) a continuous roll of a tape, b) shaped pieces or c) a solution or dispersion. What is described is a process comprising applying the covering material to an electronic component, carrying out the high-temperature working operation and subsequently washing the component in a fluorocarbon solvent in order to dissolve the covering material. [DE3721194A1]
IE871336A 1987-05-21 1987-05-21 Pressure sensitive adhesive tape for masking areas of a¹printed circuit board IE871336L (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
IE871336A IE871336L (en) 1987-05-21 1987-05-21 Pressure sensitive adhesive tape for masking areas of a¹printed circuit board
DE19873721194 DE3721194A1 (en) 1987-05-21 1987-06-26 Soluble tape and soluble film
JP62249672A JPS63301285A (en) 1987-05-21 1987-10-02 Soluble tape and film
LU87069A LU87069A1 (en) 1987-05-21 1987-12-10 SOLUBLE TAPE AND SOLUBLE FILM
US07/196,510 US4917926A (en) 1987-05-21 1988-05-20 Soluble tape and film
EP88304582A EP0292304B1 (en) 1987-05-21 1988-05-20 Soluble tape and film and masking method using them
DE8888304582T DE3867707D1 (en) 1987-05-21 1988-05-20 SOLUBLE TAPE AND FILM AND MASKING METHOD USING THE SAME.
AT88304582T ATE71649T1 (en) 1987-05-21 1988-05-20 SOLUBLE TAPE AND FILM AND MASKING PROCESSES USING SAME.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IE871336A IE871336L (en) 1987-05-21 1987-05-21 Pressure sensitive adhesive tape for masking areas of a¹printed circuit board

Publications (1)

Publication Number Publication Date
IE871336L true IE871336L (en) 1988-11-21

Family

ID=11025711

Family Applications (1)

Application Number Title Priority Date Filing Date
IE871336A IE871336L (en) 1987-05-21 1987-05-21 Pressure sensitive adhesive tape for masking areas of a¹printed circuit board

Country Status (4)

Country Link
JP (1) JPS63301285A (en)
DE (1) DE3721194A1 (en)
IE (1) IE871336L (en)
LU (1) LU87069A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3290206A (en) * 1965-06-14 1966-12-06 Minnesota Mining & Mfg Curl resistant laminate
JPS4994747A (en) * 1972-11-17 1974-09-09
JPS5714673A (en) * 1980-06-30 1982-01-25 Nitto Electric Ind Co Ltd Pressure sensitive adhesive composition for surface protecting sheet
JPS5757104A (en) * 1980-09-24 1982-04-06 Hitachi Ltd Plate-shaped work automatic feeding holding equipment
JPS58201873A (en) * 1982-05-18 1983-11-24 Nitto Electric Ind Co Ltd Preparation of surface protective sheet

Also Published As

Publication number Publication date
LU87069A1 (en) 1988-06-13
JPS63301285A (en) 1988-12-08
DE3721194A1 (en) 1988-12-01

Similar Documents

Publication Publication Date Title
EP0252451A3 (en) Substrate of hybrid ic, method of forming a circuit pattern and apparatus of forming the same
EP0166624A3 (en) Ultrathin chemically resistant marker and method of producing therefor
CA2021580A1 (en) Polysiloxane-grafted copolymer topical binder composition with novel fluorochemical comonomer and method of coating therewith
MY107097A (en) Moisture indicating ink and package having same.
MY127834A (en) Temporary attachment adhesive tape for multilayer ceramic capacitor and method for producing multilayer ceramic capacitor
US4917926A (en) Soluble tape and film
IE871336L (en) Pressure sensitive adhesive tape for masking areas of a¹printed circuit board
IE823104L (en) Adhesive tapes
ATE29146T1 (en) SELF-ADHESIVE MATERIAL AND METHOD OF PRODUCTION.
JPS56125471A (en) Pressure-sensitive adhesive composition
AT351885B (en) PROCESS FOR THE PRODUCTION OF METALLOPHOBE (METAL-REPELLENT) SURFACES ON OBJECTS, IN PARTICULAR FOR THE PRODUCTION OF BASE MATERIAL FOR PRINTED CIRCUITS
EP0324599A3 (en) Process for preparing polymeric materials for application to printed circuits
GB1474247A (en) Provision of solder-stop protection for conductor paths on circuit boards
US4601934A (en) Masking of electrical printed circuit boards
JPS5462238A (en) Detackifier for adhesive film
EP0292304B1 (en) Soluble tape and film and masking method using them
JPS5521468A (en) Manufacture of pressure-sensitive adhesive sheet having colored adhesive layer
GB2004499A (en) Transferring coatings of adhesives to laminates
GR3019177T3 (en) Wallpaper adhesives
JPS55115483A (en) Production of adhesive tape for labelling
EP0400801A3 (en) Polymeric film
JPS5649782A (en) Production of pressure-sensitive adhesive sheet or tape
JPS5430231A (en) Manufacture of pressuresensitive adhesive tape
JPS56112982A (en) Size composition and processing method
JPS5371139A (en) Hot-melt adhesive compositions