ID16181A - Alat semi konduktor dengan permukaan terbelah - Google Patents

Alat semi konduktor dengan permukaan terbelah

Info

Publication number
ID16181A
ID16181A IDP963876A ID963876A ID16181A ID 16181 A ID16181 A ID 16181A ID P963876 A IDP963876 A ID P963876A ID 963876 A ID963876 A ID 963876A ID 16181 A ID16181 A ID 16181A
Authority
ID
Indonesia
Prior art keywords
conductors
tools
semi
surface surface
tools conductors
Prior art date
Application number
IDP963876A
Other languages
English (en)
Inventor
Etsuo Morita
Hiroji Kawai
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP33719295A external-priority patent/JPH09181392A/ja
Priority claimed from JP34381395A external-priority patent/JP3700227B2/ja
Application filed by Sony Corp filed Critical Sony Corp
Publication of ID16181A publication Critical patent/ID16181A/id

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/0201Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/0201Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H01S5/0202Cleaving

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
IDP963876A 1995-12-25 1996-02-23 Alat semi konduktor dengan permukaan terbelah ID16181A (id)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP33719295A JPH09181392A (ja) 1995-12-25 1995-12-25 半導体発光装置の製造方法
JP34381395A JP3700227B2 (ja) 1995-12-28 1995-12-28 半導体レーザの製造方法

Publications (1)

Publication Number Publication Date
ID16181A true ID16181A (id) 1997-09-11

Family

ID=26575701

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP963876A ID16181A (id) 1995-12-25 1996-02-23 Alat semi konduktor dengan permukaan terbelah

Country Status (5)

Country Link
US (1) US5753966A (id)
KR (1) KR100415522B1 (id)
CN (1) CN1104766C (id)
ID (1) ID16181A (id)
MY (1) MY132539A (id)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6809010B1 (en) * 1996-02-29 2004-10-26 Kyocera Corporation Sapphire single crystal, semiconductor laser diode using the same for substrate, and method for manufacturing the same
US5972730A (en) * 1996-09-26 1999-10-26 Kabushiki Kaisha Toshiba Nitride based compound semiconductor light emitting device and method for producing the same
US6542526B1 (en) * 1996-10-30 2003-04-01 Hitachi, Ltd. Optical information processor and semiconductor light emitting device suitable for the same
KR100218275B1 (ko) * 1997-05-09 1999-09-01 윤종용 벌크형 1트랜지스터 구조의 강유전체 메모리소자
JP3822976B2 (ja) * 1998-03-06 2006-09-20 ソニー株式会社 半導体装置およびその製造方法
EP1256135A1 (de) * 2000-02-15 2002-11-13 Osram Opto Semiconductors GmbH Strahlungsemittierendes halbleiterbauelement und verfahren zu dessen herstellung
DE10006738C2 (de) * 2000-02-15 2002-01-17 Osram Opto Semiconductors Gmbh Lichtemittierendes Bauelement mit verbesserter Lichtauskopplung und Verfahren zu seiner Herstellung
DE10039433B4 (de) * 2000-08-11 2017-10-26 Osram Opto Semiconductors Gmbh Halbleiterchip für die Optoelektronik
US6791119B2 (en) * 2001-02-01 2004-09-14 Cree, Inc. Light emitting diodes including modifications for light extraction
JP2002289955A (ja) * 2001-03-23 2002-10-04 Sharp Corp 半導体レーザ素子とその製造方法および光学式情報再生装置
JP3705791B2 (ja) * 2002-03-14 2005-10-12 株式会社東芝 半導体発光素子および半導体発光装置
JP4948307B2 (ja) * 2006-07-31 2012-06-06 三洋電機株式会社 半導体レーザ素子およびその製造方法
JP4832221B2 (ja) * 2006-09-01 2011-12-07 パナソニック株式会社 半導体レーザ装置の製造方法
JP2009200478A (ja) * 2008-01-21 2009-09-03 Sanyo Electric Co Ltd 半導体レーザ素子およびその製造方法
JP6077201B2 (ja) * 2011-08-11 2017-02-08 昭和電工株式会社 発光ダイオードおよびその製造方法
US9748338B2 (en) * 2012-06-29 2017-08-29 Intel Corporation Preventing isolation leakage in III-V devices

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5604763A (en) * 1994-04-20 1997-02-18 Toyoda Gosei Co., Ltd. Group III nitride compound semiconductor laser diode and method for producing same

Also Published As

Publication number Publication date
KR100415522B1 (ko) 2004-05-20
US5753966A (en) 1998-05-19
CN1158017A (zh) 1997-08-27
KR970054998A (ko) 1997-07-31
CN1104766C (zh) 2003-04-02
MY132539A (en) 2007-10-31

Similar Documents

Publication Publication Date Title
DE69619739T2 (de) Montagewerkzeug
DE59510981D1 (de) Bohrfutter
DE69612854T2 (de) Spannfutter
DE69617003T2 (de) Handwerkzeug
DE69533127D1 (de) Kühlkörper
DK0811111T3 (da) Borehulsværktøj
DE59605540D1 (de) Werkzeugträger
ID16181A (id) Alat semi konduktor dengan permukaan terbelah
DE69400349D1 (de) Oberflächenverbinder
DE59609022D1 (de) Verbindungssubstrat
DE69619106D1 (de) Homogenes kühlsubstrat
DE69610518T2 (de) Perkussionsfläche
DE69841941D1 (de) Drehbohrmeissel mit klauenzähnen
FI964116A0 (fi) Työväline
KR970004465U (ko) 공구 조립체
ID21717A (id) Hidrosiklon dengan alat pencipta turbulensi
KR960036887U (ko) 화물 자동차용 작업대
KR970025872U (ko) 표면실장용 반도체
FR2740308B3 (fr) Porte-piece ameliore
KR970000772U (ko) 작업지시서 고정구
KR970012355U (ko) 로보트
KR970027999U (ko) 공구 설치대
LT2325B (lt) Sarmines fosfatazes substratas
IT238902Y1 (it) Utensile igienico-odontoiatrico
ATA89295A (de) Montagehilfswerkzeug