HK1244057A1 - 用於檢查電子器件的方法 - Google Patents
用於檢查電子器件的方法Info
- Publication number
- HK1244057A1 HK1244057A1 HK18103413.3A HK18103413A HK1244057A1 HK 1244057 A1 HK1244057 A1 HK 1244057A1 HK 18103413 A HK18103413 A HK 18103413A HK 1244057 A1 HK1244057 A1 HK 1244057A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- checking
- electronic component
- electronic
- component
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
- G01N23/18—Investigating the presence of flaws defects or foreign matter
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
- G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/14—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
- G06K7/1404—Methods for optical code recognition
- G06K7/1408—Methods for optical code recognition the method being specifically adapted for the type of code
- G06K7/1413—1D bar codes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
- G01N2223/6113—Specific applications or type of materials patterned objects; electronic devices printed circuit board [PCB]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/66—Specific applications or type of materials multiple steps inspection, e.g. coarse/fine
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10116—X-ray image
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Artificial Intelligence (AREA)
- Signal Processing (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015004650 | 2015-04-15 | ||
DE102015005641.7A DE102015005641A1 (de) | 2015-05-05 | 2015-05-05 | Verfahren zum Prüfen eines elektronischen Bauteils |
PCT/EP2016/000612 WO2016165828A1 (de) | 2015-04-15 | 2016-04-14 | Verfahren zum prüfen eines elektronischen bauteils |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1244057A1 true HK1244057A1 (zh) | 2018-07-27 |
Family
ID=55808541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK18103413.3A HK1244057A1 (zh) | 2015-04-15 | 2018-03-12 | 用於檢查電子器件的方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10571413B2 (zh) |
JP (1) | JP6535755B2 (zh) |
KR (1) | KR102121521B1 (zh) |
CN (1) | CN107592910B (zh) |
HK (1) | HK1244057A1 (zh) |
TW (1) | TW201643411A (zh) |
WO (1) | WO2016165828A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2574188B (en) * | 2018-04-11 | 2022-03-09 | E M & I Maritime Ltd | Inspection of hazardous area equipment |
US11188792B2 (en) | 2020-01-07 | 2021-11-30 | International Business Machines Corporation | Defect detection using multiple models |
KR20220133575A (ko) | 2021-03-25 | 2022-10-05 | 스템코 주식회사 | 광학 검사 장치 |
CN113252686B (zh) * | 2021-05-13 | 2021-12-17 | 中科长光精拓智能装备(苏州)有限公司 | 一种电子元件邦定方法 |
Family Cites Families (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2440146C3 (de) * | 1974-08-21 | 1981-05-14 | Siemens AG, 1000 Berlin und 8000 München | Röntgenuntersuchungsgerät mit einer Schichtaufnahmeeinrichtung |
US4365895A (en) * | 1980-12-03 | 1982-12-28 | Probex, Inc. | Method, apparatus and film strip of particular design for rapid test of a film processor |
EP0512620A3 (en) * | 1991-05-07 | 1995-07-05 | Koninklijke Philips Electronics N.V. | X-ray analysis apparatus |
IL101063A (en) * | 1992-02-25 | 1995-03-30 | Orbotech Ltd | Verification and repair station for pcbs |
JPH05329753A (ja) * | 1992-05-26 | 1993-12-14 | Hitachi Ltd | 自動生産ライン設備制御方式 |
JP3309322B2 (ja) * | 1992-08-21 | 2002-07-29 | 富士通株式会社 | プリント基板検査システム |
JPH0635225U (ja) * | 1992-10-20 | 1994-05-10 | 富士通テン株式会社 | 立体交差型生産ライン |
JPH07306165A (ja) * | 1994-05-12 | 1995-11-21 | Toshiba Corp | X線検査装置およびx線検査補修装置 |
US5963662A (en) * | 1996-08-07 | 1999-10-05 | Georgia Tech Research Corporation | Inspection system and method for bond detection and validation of surface mount devices |
JP3883153B2 (ja) * | 1998-04-10 | 2007-02-21 | 松下電器産業株式会社 | X線基板検査装置 |
JPH11330178A (ja) * | 1998-05-13 | 1999-11-30 | Advantest Corp | 表面検査装置および方法 |
JP2991204B2 (ja) * | 1998-12-25 | 1999-12-20 | 株式会社日立製作所 | 検査装置 |
JP3643722B2 (ja) * | 1999-03-25 | 2005-04-27 | 株式会社テクノエナミ | X線検査方法及びその装置 |
CA2296143A1 (fr) * | 2000-01-18 | 2001-07-18 | 9071 9410 Quebec Inc. | Systeme d'inspection optique |
SE0000314D0 (sv) * | 2000-01-31 | 2000-01-31 | Astrazeneca Ab | Apparatus and method for analysing |
US6725115B2 (en) * | 2000-05-08 | 2004-04-20 | Teradyne, Inc. | Dynamic testing of electronic assemblies |
AU2001270952A1 (en) * | 2000-06-30 | 2002-01-14 | Ilan Makmel | Probe, systems and methods for integrated circuit board testing |
US20040004482A1 (en) * | 2002-04-18 | 2004-01-08 | Photon Dynamics, Inc. | Industrial inspection using combination of functional testing and structural inspection |
US7042564B2 (en) * | 2002-08-08 | 2006-05-09 | Applied Materials, Israel, Ltd. | Wafer inspection methods and an optical inspection tool |
US6895565B2 (en) * | 2002-10-08 | 2005-05-17 | Agilent Technologies, Inc. | Methods for predicting board test coverage |
US6903360B2 (en) * | 2002-10-16 | 2005-06-07 | Agilent Technologies, Inc. | Method for detecting missing components at electrical board test using optoelectronic fixture-mounted sensors |
BRPI0413294B1 (pt) * | 2003-08-06 | 2019-01-02 | Bridger Tech Inc | dispositivo, método e sistema |
US7015492B2 (en) * | 2003-08-15 | 2006-03-21 | Asm International N.V. | Method and apparatus for mapping of wafers located inside a closed wafer cassette |
US7369644B2 (en) * | 2003-10-14 | 2008-05-06 | Mirtec Co., Ltd. | Printed circuit board inspection system combining X-ray inspection and visual inspection |
US7492449B2 (en) * | 2004-04-12 | 2009-02-17 | Georgia Tech Research Corporation | Inspection systems and methods |
US7366321B2 (en) * | 2004-06-18 | 2008-04-29 | Agilent Technologies, Inc. | System and method for performing automated optical inspection of objects |
JP2006189281A (ja) * | 2005-01-05 | 2006-07-20 | Hitachi High-Technologies Corp | 表面検査装置及び表面検査方法 |
US7705267B2 (en) * | 2005-06-30 | 2010-04-27 | Jon Heyl | Semiconductor failure analysis tool |
CN100514348C (zh) * | 2005-08-05 | 2009-07-15 | 深圳普诺玛商业安全设备有限公司 | 一种屠宰生产线识别及控制***及其识别方法 |
CN101370711A (zh) * | 2006-01-17 | 2009-02-18 | 诺瓦提斯公司 | 检测封装中是否存在眼用透镜的方法和装置 |
JP4746991B2 (ja) * | 2006-01-17 | 2011-08-10 | 株式会社サキコーポレーション | 被検査体の検査装置 |
KR20070081282A (ko) * | 2006-02-10 | 2007-08-16 | 삼성전자주식회사 | 반도체 디바이스 검사 장치 |
GB2438439A (en) * | 2006-05-27 | 2007-11-28 | X Tek Systems Ltd | An automatic x-ray inspection system |
US20080083816A1 (en) * | 2006-10-04 | 2008-04-10 | Leinbach Glen E | Statistical process control of solder paste stenciling using a replicated solder paste feature distributed across a printed circuit board |
TWI310983B (en) * | 2006-10-24 | 2009-06-11 | Au Optronics Corp | Integrated circuit structure, display module, and inspection method thereof |
US7991214B1 (en) * | 2007-04-18 | 2011-08-02 | Avaya Inc. | Method to enhance X-ray and optical images and locate nano-scale cracks in electric devices and components |
JP4404159B2 (ja) * | 2008-01-21 | 2010-01-27 | 凸版印刷株式会社 | 検査方法 |
GB0905006D0 (en) * | 2009-03-24 | 2009-05-06 | Rawlinson Paul | Testing and mounting IC's on PCB's |
JP4883131B2 (ja) * | 2009-04-17 | 2012-02-22 | パナソニック株式会社 | 電子部品実装方法 |
JP2011018696A (ja) * | 2009-07-07 | 2011-01-27 | Hitachi Ltd | 電子部品組立生産システム |
CN101759139B (zh) * | 2009-12-10 | 2013-06-12 | 江苏大学 | Mems微器件的表面改性处理方法及装置 |
GB201019537D0 (en) * | 2010-11-18 | 2010-12-29 | 20X20 Vision Ltd | PCB reflow inspection angled measurement |
JP2012184936A (ja) * | 2011-03-03 | 2012-09-27 | Shimadzu Corp | X線検査装置 |
CN102313744A (zh) * | 2011-03-29 | 2012-01-11 | 上海华碧检测技术有限公司 | 一种pcb板失效分析方法 |
WO2012174232A2 (en) * | 2011-06-15 | 2012-12-20 | New York University | Methods of identifying original and counterfeit articles using micro x-ray diffraction mapping |
US20140010952A1 (en) * | 2012-01-02 | 2014-01-09 | Noam ROSENSTEIN | Pcb repair of defective interconnects by deposition of conductive ink |
JP5912553B2 (ja) * | 2012-01-12 | 2016-04-27 | ヤマハ発動機株式会社 | プリント基板の複合検査装置 |
JP5776605B2 (ja) * | 2012-03-30 | 2015-09-09 | オムロン株式会社 | 基板検査結果の分析作業支援用の情報表示システムおよび分析作業の支援方法 |
CN102682166B (zh) * | 2012-05-09 | 2014-01-15 | 上海望友信息科技有限公司 | Smt设备快速制程***及方法 |
US9612284B2 (en) * | 2012-08-27 | 2017-04-04 | Futurewei Technologies, Inc. | System and method for hybrid board-level diagnostics |
US9733384B2 (en) * | 2013-10-03 | 2017-08-15 | System Square Inc. | Package inspection system |
KR101890281B1 (ko) * | 2016-08-18 | 2018-08-22 | 한국과학기술원 | 볼 그리드 어레이형 반도체 칩 패키지의 검사 방법 |
US10586318B2 (en) * | 2016-10-07 | 2020-03-10 | Raytheon Company | Automated model-based inspection system for screening electronic components |
-
2016
- 2016-04-14 CN CN201680021844.1A patent/CN107592910B/zh active Active
- 2016-04-14 US US15/564,311 patent/US10571413B2/en active Active
- 2016-04-14 JP JP2017550757A patent/JP6535755B2/ja active Active
- 2016-04-14 WO PCT/EP2016/000612 patent/WO2016165828A1/de active Application Filing
- 2016-04-14 KR KR1020177032972A patent/KR102121521B1/ko active IP Right Grant
- 2016-04-15 TW TW105111918A patent/TW201643411A/zh unknown
-
2018
- 2018-03-12 HK HK18103413.3A patent/HK1244057A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP6535755B2 (ja) | 2019-06-26 |
US10571413B2 (en) | 2020-02-25 |
CN107592910A (zh) | 2018-01-16 |
KR102121521B1 (ko) | 2020-06-29 |
US20180136145A1 (en) | 2018-05-17 |
WO2016165828A1 (de) | 2016-10-20 |
JP2018514760A (ja) | 2018-06-07 |
CN107592910B (zh) | 2021-08-13 |
TW201643411A (zh) | 2016-12-16 |
KR20170136634A (ko) | 2017-12-11 |
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