HK1206869A1 - 半導體器件及其製造方法 - Google Patents
半導體器件及其製造方法Info
- Publication number
- HK1206869A1 HK1206869A1 HK15107383.3A HK15107383A HK1206869A1 HK 1206869 A1 HK1206869 A1 HK 1206869A1 HK 15107383 A HK15107383 A HK 15107383A HK 1206869 A1 HK1206869 A1 HK 1206869A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- manufacturing
- same
- semiconductor device
- semiconductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
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- H01L2225/06568—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking the devices decreasing in size, e.g. pyramidical stack
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
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- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L24/78—Apparatus for connecting with wire connectors
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
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- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Wire Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2013158233A JP6196092B2 (ja) | 2013-07-30 | 2013-07-30 | 半導体装置 |
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JP (1) | JP6196092B2 (zh) |
KR (1) | KR20150014867A (zh) |
CN (2) | CN109037184B (zh) |
HK (1) | HK1206869A1 (zh) |
TW (1) | TWI631680B (zh) |
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JP2017092212A (ja) * | 2015-11-09 | 2017-05-25 | 株式会社東芝 | 半導体装置およびその製造方法 |
JP6991014B2 (ja) | 2017-08-29 | 2022-01-12 | キオクシア株式会社 | 半導体装置 |
TWI739379B (zh) * | 2019-04-24 | 2021-09-11 | 日商新川股份有限公司 | 半導體裝置、半導體裝置的製造方法、以及打線接合裝置 |
CN110265378B (zh) * | 2019-06-19 | 2020-10-23 | 福建福顺半导体制造有限公司 | 一种电子元件 |
KR20210090521A (ko) * | 2020-01-10 | 2021-07-20 | 에스케이하이닉스 주식회사 | 본딩 와이어 분지 구조를 포함한 반도체 패키지 |
KR20220007444A (ko) | 2020-07-10 | 2022-01-18 | 삼성전자주식회사 | 패키지 기판 및 이를 포함하는 반도체 패키지 |
US12021063B2 (en) | 2021-01-28 | 2024-06-25 | Qualcomm Incorporated | Circular bond finger pad |
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JPS61105851A (ja) | 1984-10-30 | 1986-05-23 | Toshiba Corp | ワイヤボンデイング方法 |
JPH06103697B2 (ja) * | 1988-06-25 | 1994-12-14 | 日本電気株式会社 | コンパクトicのワイヤボンディング構造体 |
JP3662461B2 (ja) * | 1999-02-17 | 2005-06-22 | シャープ株式会社 | 半導体装置、およびその製造方法 |
JP2001156107A (ja) * | 1999-11-30 | 2001-06-08 | Rohm Co Ltd | Icチップ、およびこれの導体ワイヤ接続方法 |
JP4034932B2 (ja) * | 2000-12-15 | 2008-01-16 | 株式会社沖データ | 半導体装置、ledプリントヘッドおよびワイヤボンディング方法 |
JP2002237567A (ja) * | 2001-02-09 | 2002-08-23 | Nec Corp | 半導体装置 |
JP4149377B2 (ja) * | 2001-06-07 | 2008-09-10 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
JP4068974B2 (ja) * | 2003-01-22 | 2008-03-26 | 株式会社ルネサステクノロジ | 半導体装置 |
US6927156B2 (en) * | 2003-06-18 | 2005-08-09 | Intel Corporation | Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon |
JP4726640B2 (ja) * | 2006-01-20 | 2011-07-20 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP4967524B2 (ja) * | 2006-08-15 | 2012-07-04 | ヤマハ株式会社 | 半導体装置及びワイヤーボンディング方法 |
JP2008171927A (ja) * | 2007-01-10 | 2008-07-24 | Renesas Technology Corp | 半導体装置 |
JP2009043793A (ja) * | 2007-08-07 | 2009-02-26 | Panasonic Corp | 半導体装置、およびその半導体装置の製造方法 |
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JP6196092B2 (ja) | 2017-09-13 |
CN109037184B (zh) | 2022-05-03 |
KR20150014867A (ko) | 2015-02-09 |
CN109037184A (zh) | 2018-12-18 |
JP2015029022A (ja) | 2015-02-12 |
US10170402B2 (en) | 2019-01-01 |
CN104347549B (zh) | 2018-08-10 |
CN104347549A (zh) | 2015-02-11 |
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US20160163625A1 (en) | 2016-06-09 |
TW201505145A (zh) | 2015-02-01 |
TWI631680B (zh) | 2018-08-01 |
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