HK1185850A1 - Electronic component transfer apparatus and taping unit - Google Patents

Electronic component transfer apparatus and taping unit

Info

Publication number
HK1185850A1
HK1185850A1 HK13113419.1A HK13113419A HK1185850A1 HK 1185850 A1 HK1185850 A1 HK 1185850A1 HK 13113419 A HK13113419 A HK 13113419A HK 1185850 A1 HK1185850 A1 HK 1185850A1
Authority
HK
Hong Kong
Prior art keywords
electronic component
transfer apparatus
component transfer
taping unit
taping
Prior art date
Application number
HK13113419.1A
Other languages
Chinese (zh)
Inventor
白石成
的場隆行
Original Assignee
上野精機株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上野精機株式會社 filed Critical 上野精機株式會社
Publication of HK1185850A1 publication Critical patent/HK1185850A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
    • B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
HK13113419.1A 2011-02-09 2013-12-02 Electronic component transfer apparatus and taping unit HK1185850A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/000716 WO2012107956A1 (en) 2011-02-09 2011-02-09 Electronic component transfer apparatus and taping unit

Publications (1)

Publication Number Publication Date
HK1185850A1 true HK1185850A1 (en) 2014-02-28

Family

ID=46638202

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13113419.1A HK1185850A1 (en) 2011-02-09 2013-12-02 Electronic component transfer apparatus and taping unit

Country Status (5)

Country Link
JP (1) JP5674060B2 (en)
CN (1) CN103339031B (en)
HK (1) HK1185850A1 (en)
TW (1) TWI525732B (en)
WO (1) WO2012107956A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014087485A1 (en) * 2012-12-04 2014-06-12 上野精機株式会社 Electronic component conveyance device and taping unit
WO2014112041A1 (en) * 2013-01-15 2014-07-24 上野精機株式会社 Posture correction device, electronic component conveyance device, and electronic component transfer device
TWI494576B (en) * 2013-12-03 2015-08-01 Tohoku Seiki Ind Co Ltd IC processor
WO2015151276A1 (en) * 2014-04-04 2015-10-08 上野精機株式会社 Housing unit and electronic component conveyance device
JP5835825B1 (en) * 2014-11-19 2015-12-24 上野精機株式会社 Carrier tape traveling device and electronic component conveying device
JP6816383B2 (en) * 2016-05-26 2021-01-20 Tdk株式会社 Electronic component transport method, inspection method and manufacturing method
WO2018225151A1 (en) 2017-06-06 2018-12-13 ヤマハ発動機株式会社 Component mounting device
TWI644837B (en) * 2017-11-14 2018-12-21 陳子忠 Parallel method for packaging electronic components and coating adhesive on carrier tape and
JP7016761B2 (en) * 2018-04-11 2022-02-07 ワイエイシイガーター株式会社 Tape feeder
JP7359594B2 (en) * 2019-08-23 2023-10-11 太陽誘電株式会社 Taping device and taping method
CN111891792B (en) * 2020-08-25 2022-05-13 重庆鼎佳绝缘材料有限公司 Asynchronous chip mounter for foam

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5969939A (en) * 1982-10-15 1984-04-20 Toshiba Corp Method and apparatus for wire bonding
JPH07263517A (en) * 1994-03-24 1995-10-13 Hitachi Electron Eng Co Ltd Positioning apparatus for ic socket
JP2000100858A (en) * 1998-09-18 2000-04-07 Shibaura Mechatronics Corp Component mounting device and calibrating method of imaging offset in device thereof
JP2002347710A (en) * 2001-05-28 2002-12-04 Yayoi Kk Carrier tape and traveling and driving device for the same
JP2003095211A (en) * 2001-09-18 2003-04-03 Shin Etsu Polymer Co Ltd Manufacturing method and manufacturing apparatus for embossed carrier tape
JP4202102B2 (en) * 2002-12-03 2008-12-24 上野精機株式会社 Taping device for semiconductor device
JP2004288715A (en) * 2003-03-19 2004-10-14 Nec Machinery Corp Die bonder
JP2006244559A (en) * 2005-03-01 2006-09-14 Ricoh Co Ltd Method for adjusting mounting position of print coil substrate and device therefor
WO2007015300A1 (en) * 2005-08-04 2007-02-08 Ueno Seiki Co., Ltd. Equipment for manufacturing electronic component, and method and program for controlling equipment for manufacturing electronic component
JP4848160B2 (en) * 2005-09-08 2011-12-28 株式会社 東京ウエルズ Appearance inspection device
JP2007179389A (en) * 2005-12-28 2007-07-12 Nikon Corp Photographing device
JP5233009B2 (en) * 2007-11-12 2013-07-10 日東工業株式会社 Chip loading means
JP2009154889A (en) * 2007-12-25 2009-07-16 Canon Machinery Inc Part feeding device and taping apparatus
JP2011011748A (en) * 2009-06-30 2011-01-20 Tesetsuku:Kk Taping apparatus

Also Published As

Publication number Publication date
CN103339031A (en) 2013-10-02
JP5674060B2 (en) 2015-02-25
WO2012107956A1 (en) 2012-08-16
TW201246425A (en) 2012-11-16
TWI525732B (en) 2016-03-11
JPWO2012107956A1 (en) 2014-07-03
CN103339031B (en) 2016-01-20

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20200208