HK1167927A1 - Re-sticking apparatus and sorting re-sticking method - Google Patents

Re-sticking apparatus and sorting re-sticking method

Info

Publication number
HK1167927A1
HK1167927A1 HK12108524.4A HK12108524A HK1167927A1 HK 1167927 A1 HK1167927 A1 HK 1167927A1 HK 12108524 A HK12108524 A HK 12108524A HK 1167927 A1 HK1167927 A1 HK 1167927A1
Authority
HK
Hong Kong
Prior art keywords
sticking
sorting
sticking apparatus
sticking method
Prior art date
Application number
HK12108524.4A
Other languages
Chinese (zh)
Inventor
原佳明
Original Assignee
上野精機株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上野精機株式會社 filed Critical 上野精機株式會社
Publication of HK1167927A1 publication Critical patent/HK1167927A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Labeling Devices (AREA)
HK12108524.4A 2009-07-17 2012-08-31 Re-sticking apparatus and sorting re-sticking method HK1167927A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/003386 WO2011007397A1 (en) 2009-07-17 2009-07-17 Re-sticking apparatus and sorting re-sticking method

Publications (1)

Publication Number Publication Date
HK1167927A1 true HK1167927A1 (en) 2012-12-14

Family

ID=42299112

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12108524.4A HK1167927A1 (en) 2009-07-17 2012-08-31 Re-sticking apparatus and sorting re-sticking method

Country Status (4)

Country Link
JP (1) JP4462638B1 (en)
CN (1) CN102473665B (en)
HK (1) HK1167927A1 (en)
WO (1) WO2011007397A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103229610B (en) * 2010-11-30 2016-01-20 上野精机株式会社 The holding device of electronic component, testing fixture and sorter
CN104103551A (en) * 2013-04-11 2014-10-15 捷毅***股份有限公司 Crystal grain rearrangement machine
JP7108516B2 (en) * 2018-10-25 2022-07-28 リンテック株式会社 Sheet pasting method
EP4227981A1 (en) * 2022-02-15 2023-08-16 Nexperia B.V. Curved wafer stage

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6160527A (en) * 1984-08-31 1986-03-28 Hitachi Ltd Loader/unloader device
JP2003017549A (en) * 2001-07-02 2003-01-17 Toshiba Corp Apparatus and method for transferring semiconductor device between adhesive sheets
JP4538843B2 (en) * 2004-03-05 2010-09-08 澁谷工業株式会社 How to apply adhesive tape for die bonding
EP1941536B8 (en) * 2005-10-26 2019-06-19 Kulicke and Soffa (Switzerland) Management GmbH Method and device for the placement of electronic components, in particular semiconductor chips, on a substrate
WO2007083360A1 (en) * 2006-01-17 2007-07-26 Ueno Seiki Co., Ltd. Semiconductor fabrication device and fabrication method

Also Published As

Publication number Publication date
CN102473665A (en) 2012-05-23
JPWO2011007397A1 (en) 2012-12-20
JP4462638B1 (en) 2010-05-12
WO2011007397A1 (en) 2011-01-20
CN102473665B (en) 2014-11-19

Similar Documents

Publication Publication Date Title
GB0914650D0 (en) Apparatus and method
GB0823419D0 (en) Sorting method and apparatus
GB0921440D0 (en) Apparatus and method
GB2475315B (en) Inspection apparatus and method
GB0901034D0 (en) Apparatus and method
GB0902880D0 (en) Apparatus and method
GB0917600D0 (en) Testing apparatus and method
GB201014816D0 (en) Processing apparatus and method
GB201010581D0 (en) Test apparatus and method
IL218738A0 (en) Inspection method and apparatus
GB0901257D0 (en) Apparatus and method
EP2490815A4 (en) An apparatus and method for size reduction
GB0911730D0 (en) Method and apparatus
EP2241380A4 (en) Sorting method and sorting device
ZA201106893B (en) Application apparatus and method
GB2471736B (en) Packaging method and apparatus
GB0921706D0 (en) Method and apparatus
GB0911293D0 (en) Method and apparatus
GB0908736D0 (en) Method and apparatus
GB0905198D0 (en) Apparatus and method
HK1167927A1 (en) Re-sticking apparatus and sorting re-sticking method
GB0920543D0 (en) Apparatus and method
GB0917419D0 (en) Mounting apparatus and method
GB0904389D0 (en) Apparatus and method
GB0912104D0 (en) Guilding apparatus and method

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190715