HK1084190A1 - Nozzle assembly for applying a liquid to a substrate - Google Patents
Nozzle assembly for applying a liquid to a substrateInfo
- Publication number
- HK1084190A1 HK1084190A1 HK06104404.6A HK06104404A HK1084190A1 HK 1084190 A1 HK1084190 A1 HK 1084190A1 HK 06104404 A HK06104404 A HK 06104404A HK 1084190 A1 HK1084190 A1 HK 1084190A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- liquid
- substrate
- applying
- guide plate
- lower edge
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/005—Curtain coaters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
- B05D1/04—Processes for applying liquids or other fluent materials performed by spraying involving the use of an electrostatic field
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03D—APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS; ACCESSORIES THEREFOR
- G03D5/00—Liquid processing apparatus in which no immersion is effected; Washing apparatus in which no immersion is effected
- G03D5/04—Liquid processing apparatus in which no immersion is effected; Washing apparatus in which no immersion is effected using liquid sprays
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
- Nozzles (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10232984A DE10232984A1 (de) | 2002-07-19 | 2002-07-19 | Düsenanordnung zum Aufbringen einer Flüssigkeit auf ein Substrat |
PCT/EP2003/007494 WO2004010220A1 (de) | 2002-07-19 | 2003-07-10 | Düsenanordnung zum aufbringen einer flüssigkeit auf ein substrat |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1084190A1 true HK1084190A1 (en) | 2006-07-21 |
Family
ID=30010245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK06104404.6A HK1084190A1 (en) | 2002-07-19 | 2006-04-11 | Nozzle assembly for applying a liquid to a substrate |
Country Status (11)
Country | Link |
---|---|
US (1) | US7419549B2 (xx) |
EP (1) | EP1523695B1 (xx) |
JP (1) | JP4528614B2 (xx) |
KR (1) | KR100982586B1 (xx) |
CN (1) | CN100476582C (xx) |
AT (1) | ATE373836T1 (xx) |
CA (1) | CA2492825C (xx) |
DE (2) | DE10232984A1 (xx) |
HK (1) | HK1084190A1 (xx) |
TW (1) | TWI283193B (xx) |
WO (1) | WO2004010220A1 (xx) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004053337A1 (de) | 2004-11-04 | 2006-05-11 | Steag Hama Tech Ag | Verfahren und Vorrichtung zum Behandeln von Substraten und Düseneinheit hierfür |
CN103116251A (zh) * | 2013-01-18 | 2013-05-22 | 清华大学深圳研究生院 | 抗变形排孔显影喷嘴及其制备方法 |
JP5651819B1 (ja) * | 2014-03-11 | 2015-01-14 | 勝行 三好 | 多目的フィットネス装置 |
US10766802B2 (en) * | 2014-11-29 | 2020-09-08 | National Tsing Hua University | Flexible 3D freeform techniques |
CN104538332B (zh) * | 2014-12-12 | 2017-06-27 | 深圳市华星光电技术有限公司 | 一种湿制程机台的腔室结构 |
GB2560327B (en) * | 2017-03-07 | 2019-04-17 | Technijet Digital Ltd | Apparatus and method for spray treating fabric |
GB201819454D0 (en) * | 2018-11-29 | 2019-01-16 | Johnson Matthey Plc | Apparatus and method for coating substrates with washcoats |
CN215695356U (zh) * | 2021-04-16 | 2022-02-01 | 诺信公司 | 喷头组件、分配***、电极片材条带以及电极 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1023842B (it) * | 1974-08-08 | 1978-05-30 | Italsider Spa | Dispositivo perfezionato per insufflare una lama d aria contro un nastro rivestito da uno strato di materiale liquido, in particolare contro un nastro metallico rivestito da uno strato di zico fuso |
FR2540082B1 (fr) * | 1982-09-23 | 1987-02-06 | Vuillaume Andre | Appareil rinceur universel, notamment pour l'industrie papetiere, les convoyeurs a bande et analogues |
DE8812493U1 (de) * | 1988-10-04 | 1990-02-01 | Nordson Corp., Westlake, Ohio | Schlitzdüse |
DE3932779A1 (de) * | 1989-09-30 | 1991-04-11 | Schering Ag | Verfahren zum behandeln von gegenstaenden mit einer fluessigkeit, sowie vorrichtung zur durchfuehrung des verfahrens |
DE19652827A1 (de) * | 1996-12-18 | 1998-06-25 | Voith Sulzer Papiermasch Gmbh | Auftragwerk zum direkten oder indirekten Auftragen eines flüssigen oder pastösen Streichmediums auf eine laufende Materialbahn, insbesondere aus Papier oder Karton |
JPH10270336A (ja) * | 1997-03-27 | 1998-10-09 | Yuasa Seisakusho:Kk | 液体吐出装置 |
DE19755625A1 (de) * | 1997-12-15 | 1999-07-01 | Jagenberg Papiertech Gmbh | Schlitzdüse zum Beschichten von Materialbahnen, insbesondere Papier- oder Kartonbahnen mit Pigmentstreichfarbe |
JP3923676B2 (ja) * | 1999-04-21 | 2007-06-06 | 株式会社東芝 | 基板処理方法 |
JP3652596B2 (ja) * | 1999-10-25 | 2005-05-25 | 東京エレクトロン株式会社 | 液処理装置 |
US6364547B1 (en) * | 1999-10-25 | 2002-04-02 | Tokyo Electron Limited | Solution processing apparatus |
FI111562B (fi) * | 2002-01-16 | 2003-08-15 | Metso Paper Inc | Menetelmä ja laitteisto käsittelyaineen syöttämiseksi liikkuvalle pinnalle |
-
2002
- 2002-07-19 DE DE10232984A patent/DE10232984A1/de not_active Withdrawn
-
2003
- 2003-07-08 TW TW092118611A patent/TWI283193B/zh not_active IP Right Cessation
- 2003-07-10 US US10/522,563 patent/US7419549B2/en active Active
- 2003-07-10 JP JP2004522437A patent/JP4528614B2/ja not_active Expired - Fee Related
- 2003-07-10 CN CNB038172607A patent/CN100476582C/zh not_active Expired - Lifetime
- 2003-07-10 EP EP03764969A patent/EP1523695B1/de not_active Expired - Lifetime
- 2003-07-10 WO PCT/EP2003/007494 patent/WO2004010220A1/de active IP Right Grant
- 2003-07-10 CA CA2492825A patent/CA2492825C/en not_active Expired - Fee Related
- 2003-07-10 DE DE50308231T patent/DE50308231D1/de not_active Expired - Lifetime
- 2003-07-10 KR KR1020057000919A patent/KR100982586B1/ko active IP Right Grant
- 2003-07-10 AT AT03764969T patent/ATE373836T1/de not_active IP Right Cessation
-
2006
- 2006-04-11 HK HK06104404.6A patent/HK1084190A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1523695A1 (de) | 2005-04-20 |
TW200405826A (en) | 2004-04-16 |
JP2005537124A (ja) | 2005-12-08 |
WO2004010220A1 (de) | 2004-01-29 |
KR20050061439A (ko) | 2005-06-22 |
CA2492825C (en) | 2010-09-28 |
CN1688931A (zh) | 2005-10-26 |
US20050220931A1 (en) | 2005-10-06 |
JP4528614B2 (ja) | 2010-08-18 |
DE10232984A8 (de) | 2004-07-08 |
ATE373836T1 (de) | 2007-10-15 |
EP1523695B1 (de) | 2007-09-19 |
TWI283193B (en) | 2007-07-01 |
KR100982586B1 (ko) | 2010-09-15 |
CA2492825A1 (en) | 2004-01-29 |
CN100476582C (zh) | 2009-04-08 |
DE10232984A1 (de) | 2004-02-05 |
DE50308231D1 (de) | 2007-10-31 |
WO2004010220A8 (de) | 2005-04-21 |
US7419549B2 (en) | 2008-09-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20160710 |