HK1075278A1 - Process for electroplating metallic and metal matrix composite foils - Google Patents

Process for electroplating metallic and metal matrix composite foils

Info

Publication number
HK1075278A1
HK1075278A1 HK05107489A HK05107489A HK1075278A1 HK 1075278 A1 HK1075278 A1 HK 1075278A1 HK 05107489 A HK05107489 A HK 05107489A HK 05107489 A HK05107489 A HK 05107489A HK 1075278 A1 HK1075278 A1 HK 1075278A1
Authority
HK
Hong Kong
Prior art keywords
metal matrix
matrix composite
composite foils
matrix composites
electroplating metallic
Prior art date
Application number
HK05107489A
Inventor
Palumbo Gino
Brooks Iain
Mccrea Jonathan
Hibbard Glenn
Gonzales Francisco
Tomantschger Klaus
Erb Uwe
Original Assignee
Integran Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integran Technologies Inc filed Critical Integran Technologies Inc
Publication of HK1075278A1 publication Critical patent/HK1075278A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/04Wires; Strips; Foils
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02Combined electrolytic and electrophoretic processes with charged materials
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04Electroplating with moving electrodes
    • C25D5/06Brush or pad plating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08Electroplating with moving electrolyte e.g. jet electroplating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18Electroplating using modulated, pulsed or reversing current
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20Electroplating using ultrasonics, vibrations
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/615Microstructure of the layers, e.g. mixed structure
    • C25D5/617Crystalline layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/67Electroplating to repair workpiece
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/04Tubes; Rings; Hollow bodies

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacture Of Switches (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

The invention relates to a process for forming coatings or free-standing deposits of nanocrystalline metals, metal alloys or metal matrix composites. The process employs drum plating or selective plating processes involving pulse electrodeposition and a non-stationary anode or cathode. Novel nanocrystalline metal matrix composites and micro components are disclosed as well. Also described is a process for forming micro components with grain sizes below 1,000nm.
HK05107489A 2002-06-25 2005-08-25 Process for electroplating metallic and metal matrix composite foils HK1075278A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2002/007023 WO2004001100A1 (en) 2002-06-25 2002-06-25 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents

Publications (1)

Publication Number Publication Date
HK1075278A1 true HK1075278A1 (en) 2005-12-09

Family

ID=29762587

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05107489A HK1075278A1 (en) 2002-06-25 2005-08-25 Process for electroplating metallic and metal matrix composite foils

Country Status (16)

Country Link
EP (2) EP1516076B1 (en)
JP (1) JP2005530926A (en)
KR (1) KR100890819B1 (en)
AT (1) ATE387522T1 (en)
AU (1) AU2002321112B2 (en)
BR (1) BR0215787B1 (en)
CA (1) CA2490464C (en)
DE (1) DE60225352T2 (en)
DK (1) DK1516076T3 (en)
ES (1) ES2301666T3 (en)
HK (1) HK1075278A1 (en)
IL (1) IL165904A0 (en)
MX (1) MXPA04011940A (en)
PT (1) PT1516076E (en)
WO (1) WO2004001100A1 (en)
ZA (1) ZA200410368B (en)

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Also Published As

Publication number Publication date
MXPA04011940A (en) 2005-03-31
CA2490464C (en) 2008-09-02
ES2301666T3 (en) 2008-07-01
EP1516076A1 (en) 2005-03-23
KR20050024394A (en) 2005-03-10
KR100890819B1 (en) 2009-04-06
CA2490464A1 (en) 2003-12-31
DK1516076T3 (en) 2008-06-23
EP1516076B1 (en) 2008-02-27
AU2002321112B2 (en) 2008-07-03
ZA200410368B (en) 2006-07-26
WO2004001100A1 (en) 2003-12-31
DE60225352D1 (en) 2008-04-10
ATE387522T1 (en) 2008-03-15
JP2005530926A (en) 2005-10-13
IL165904A0 (en) 2006-01-15
EP1826294A1 (en) 2007-08-29
BR0215787B1 (en) 2013-12-03
DE60225352T2 (en) 2008-06-12
PT1516076E (en) 2008-03-11
BR0215787A (en) 2005-03-01
AU2002321112A1 (en) 2004-01-06

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