HK1068838A1 - Method for integrating optical layers in a pcb forinter-board communications - Google Patents

Method for integrating optical layers in a pcb forinter-board communications

Info

Publication number
HK1068838A1
HK1068838A1 HK04110314A HK04110314A HK1068838A1 HK 1068838 A1 HK1068838 A1 HK 1068838A1 HK 04110314 A HK04110314 A HK 04110314A HK 04110314 A HK04110314 A HK 04110314A HK 1068838 A1 HK1068838 A1 HK 1068838A1
Authority
HK
Hong Kong
Prior art keywords
forinter
pcb
optical layers
board communications
integrating optical
Prior art date
Application number
HK04110314A
Other languages
English (en)
Inventor
Joseph A A M Tourne
Original Assignee
Viasystems Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Viasystems Group Inc filed Critical Viasystems Group Inc
Publication of HK1068838A1 publication Critical patent/HK1068838A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Integrated Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
HK04110314A 2001-07-06 2004-12-29 Method for integrating optical layers in a pcb forinter-board communications HK1068838A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US30338001P 2001-07-06 2001-07-06
PCT/US2002/019840 WO2003005616A2 (en) 2001-07-06 2002-06-24 System and method for integrating optical layers in a pcb for inter-board communications

Publications (1)

Publication Number Publication Date
HK1068838A1 true HK1068838A1 (en) 2005-05-06

Family

ID=23171822

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04110314A HK1068838A1 (en) 2001-07-06 2004-12-29 Method for integrating optical layers in a pcb forinter-board communications

Country Status (7)

Country Link
US (3) US6834131B2 (xx)
EP (1) EP1405446A4 (xx)
JP (1) JP3666752B2 (xx)
KR (1) KR20040035673A (xx)
CN (2) CN1281367C (xx)
HK (1) HK1068838A1 (xx)
WO (1) WO2003005616A2 (xx)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040035673A (ko) * 2001-07-06 2004-04-29 비아시스템즈 그룹, 인코포레이티드 보드간 통신을 위한 ｐｃｂ에의 광계층 집적 시스템 및집적방법
US7405364B2 (en) * 2002-12-30 2008-07-29 Intel Corporation Decoupled signal-power substrate architecture
DE10347331A1 (de) * 2003-10-10 2005-05-04 Univ Dortmund Verfahren zur Herstellung von elektrisch-optischen Leiterplatten mit Polysiloxanwellenleitern und ihre Verwendung
KR20050040589A (ko) * 2003-10-29 2005-05-03 삼성전기주식회사 광도파로가 형성된 인쇄회로 기판 및 그 제조 방법
TWI294258B (en) * 2004-08-03 2008-03-01 Rohm & Haas Elect Mat Methods of forming devices having optical functionality
JP2006072352A (ja) 2004-08-19 2006-03-16 Rohm & Haas Electronic Materials Llc プリント回路板を形成する方法
DE602005011393D1 (de) 2004-12-22 2009-01-15 Rohm & Haas Elect Mat Optische Trockenfilme und Verfahren zur Herstellung optischer Vorrichtungen mit Trockenfilmen
EP1674905B1 (en) 2004-12-22 2008-10-15 Rohm and Haas Electronic Materials, L.L.C. Methods of forming optical devices having polymeric layers
DE602005011394D1 (de) 2004-12-22 2009-01-15 Rohm & Haas Elect Mat Optische Trockenfilme und Verfahren zur Herstellung optischer Vorrichtungen mit Trockenfilmen
TWI283490B (en) * 2005-10-17 2007-07-01 Phoenix Prec Technology Corp Circuit board structure of integrated optoelectronic component
DE102005053202A1 (de) * 2005-11-08 2007-05-10 Comet Gmbh Vorrichtung zum Vorbereiten einer Mehrschicht-Leiterplatte auf das Bohren von Kontaktierungsbohrungen
US7496249B2 (en) * 2005-12-29 2009-02-24 Intel Corporation Optical and/or electrical communications fabrics in circuit boards and/or other composite structures
US20080044130A1 (en) * 2006-08-16 2008-02-21 Xyratex Technology Limited Optical printed circuit board, a method of making an optical printed circuit board and an optical waveguide
CN101568867B (zh) 2006-12-26 2011-04-20 三井化学株式会社 光电混载基板及其制造方法
JP2008166798A (ja) * 2006-12-31 2008-07-17 Rohm & Haas Electronic Materials Llc 光学的機能を有するプリント回路板の形成方法
US8009992B2 (en) 2007-06-11 2011-08-30 Hewlett-Packard Development Company, L.P. Optical interconnect
KR101531054B1 (ko) * 2008-09-12 2015-06-23 주식회사 엔씨소프트 통합 메시징 환경에서의 지리정보 전송장치 및 그 방법
AT12322U1 (de) * 2009-01-27 2012-03-15 Dcc Dev Circuits & Components Gmbh Verfahren zur herstellung einer mehrlagigen leiterplatte, haftverhinderungsmaterial sowie mehrlagige leiterplatte und verwendung eines derartigen verfahrens
US7949211B1 (en) 2010-02-26 2011-05-24 Corning Incorporated Modular active board subassemblies and printed wiring boards comprising the same
US8731343B2 (en) 2011-02-24 2014-05-20 Xyratex Technology Limited Optical printed circuit board, a method of making an optical printed circuit board and an optical waveguide
US9081137B2 (en) 2013-01-21 2015-07-14 International Business Machines Corporation Implementing embedded hybrid electrical-optical PCB construct
US10141623B2 (en) 2016-10-17 2018-11-27 International Business Machines Corporation Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board
CN111901963B (zh) * 2019-05-05 2022-01-04 诺沛半导体有限公司 在发光二极管载板上形成焊垫的方法
US11997800B2 (en) 2019-11-06 2024-05-28 Ttm Technologies, Inc. Systems and methods for removing undesired metal within vias from printed circuit boards

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972755A (en) * 1972-12-14 1976-08-03 The United States Of America As Represented By The Secretary Of The Navy Dielectric circuit board bonding
DE3910710A1 (de) * 1989-04-03 1990-10-04 Standard Elektrik Lorenz Ag Optisch-elektrische mehrfachverbindung
US5106211A (en) * 1991-02-14 1992-04-21 Hoechst Celanese Corp. Formation of polymer channel waveguides by excimer laser ablation and method of making same
US5263111A (en) * 1991-04-15 1993-11-16 Raychem Corporation Optical waveguide structures and formation methods
US6274391B1 (en) * 1992-10-26 2001-08-14 Texas Instruments Incorporated HDI land grid array packaged device having electrical and optical interconnects
US5685995A (en) * 1994-11-22 1997-11-11 Electro Scientific Industries, Inc. Method for laser functional trimming of films and devices
US5590456A (en) * 1994-12-07 1997-01-07 Lucent Technologies Inc. Apparatus for precise alignment and placement of optoelectric components
US5891795A (en) * 1996-03-18 1999-04-06 Motorola, Inc. High density interconnect substrate
DE69835962T2 (de) * 1997-12-11 2007-01-04 Ibiden Co., Ltd., Ogaki Verfahren zur herstellung einer mehrschichtigen gedruckten leiterplatte
US6185354B1 (en) * 1998-05-15 2001-02-06 Motorola, Inc. Printed circuit board having integral waveguide
DE19838519A1 (de) * 1998-08-25 2000-03-02 Bosch Gmbh Robert Leiterplatte und Verfahren zur Herstellung
US6684007B2 (en) * 1998-10-09 2004-01-27 Fujitsu Limited Optical coupling structures and the fabrication processes
US6611635B1 (en) * 1998-10-09 2003-08-26 Fujitsu Limited Opto-electronic substrates with electrical and optical interconnections and methods for making
GB2363522B (en) * 1999-02-23 2003-06-25 Ppc Electronic Ag Printed circuit board for electrical and optical signals and method for producing the same
TW460717B (en) * 1999-03-30 2001-10-21 Toppan Printing Co Ltd Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same
US6731857B2 (en) * 2001-03-29 2004-05-04 Shipley Company, L.L.C. Photodefinable composition, method of manufacturing an optical waveguide with the photodefinable composition, and optical waveguide formed therefrom
US6705124B2 (en) * 2001-06-04 2004-03-16 Lightwave Microsystems Corporation High-density plasma deposition process for fabricating a top clad for planar lightwave circuit devices
KR20040035673A (ko) * 2001-07-06 2004-04-29 비아시스템즈 그룹, 인코포레이티드 보드간 통신을 위한 ｐｃｂ에의 광계층 집적 시스템 및집적방법

Also Published As

Publication number Publication date
EP1405446A2 (en) 2004-04-07
US20060165345A1 (en) 2006-07-27
EP1405446A4 (en) 2006-07-19
JP2004535070A (ja) 2004-11-18
CN1524026A (zh) 2004-08-25
JP3666752B2 (ja) 2005-06-29
US20030006068A1 (en) 2003-01-09
KR20040035673A (ko) 2004-04-29
WO2003005616A3 (en) 2003-03-20
CN1870862A (zh) 2006-11-29
US7024086B2 (en) 2006-04-04
US20050129349A1 (en) 2005-06-16
CN1281367C (zh) 2006-10-25
WO2003005616A2 (en) 2003-01-16
US6834131B2 (en) 2004-12-21

Similar Documents

Publication Publication Date Title
HK1068838A1 (en) Method for integrating optical layers in a pcb forinter-board communications
EP1542045A4 (en) OPTICAL WAVEGUIDE AND METHOD FOR THE PRODUCTION THEREOF
AU2003234247A1 (en) Method for manufacturing clad components
HK1083650A1 (en) Method and apparatus for fabricating a light management substrates
EP1533284A4 (en) OPTICAL FIBER AND METHOD FOR MANUFACTURING THE SAME
EP1443345A4 (en) METHOD FOR MANUFACTURING OPTICAL DEVICE
GB2392412B (en) A method for manufacturing a constructional panel
GB0109295D0 (en) Optoelectronic devices and a method for producing the same
SG108851A1 (en) Method for manufacturing laminated board
GB2392908B (en) A method for manufacturing a sintered compact
IL143815A0 (en) Failure determination in a communication optical network
GB0118123D0 (en) A filter and a method for making a filter
EP1357404A4 (en) METHOD AND DEVICE FOR MANUFACTURING OPTICAL FIBER
AU2001277481A1 (en) Method for providing a program module in a communications system
GB0215194D0 (en) A communication apparatus and method
AU2002357087A1 (en) Method for manufacturing a mat
GB2384208B (en) A method for manufacturing a sintered piece
AU2002341850A1 (en) A method for implementing fast type checking
GB0127153D0 (en) Trial run module on hand checking method
EP1394581A4 (en) METHOD OF MANUFACTURING A OPTICAL WAVEGUIDE
AU2003212204A8 (en) Fiber optic communication module and method for operating such a module
AU2001277843A1 (en) Method for aligning optical components
GB0120303D0 (en) Communication method
GB2381161B (en) A communication method and apparatus
AU2003253757A8 (en) A compact waveguide filter and method

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20170624