HK1068838A1 - Method for integrating optical layers in a pcb forinter-board communications - Google Patents
Method for integrating optical layers in a pcb forinter-board communicationsInfo
- Publication number
- HK1068838A1 HK1068838A1 HK04110314A HK04110314A HK1068838A1 HK 1068838 A1 HK1068838 A1 HK 1068838A1 HK 04110314 A HK04110314 A HK 04110314A HK 04110314 A HK04110314 A HK 04110314A HK 1068838 A1 HK1068838 A1 HK 1068838A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- forinter
- pcb
- optical layers
- board communications
- integrating optical
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Optical Integrated Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US30338001P | 2001-07-06 | 2001-07-06 | |
PCT/US2002/019840 WO2003005616A2 (en) | 2001-07-06 | 2002-06-24 | System and method for integrating optical layers in a pcb for inter-board communications |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1068838A1 true HK1068838A1 (en) | 2005-05-06 |
Family
ID=23171822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK04110314A HK1068838A1 (en) | 2001-07-06 | 2004-12-29 | Method for integrating optical layers in a pcb forinter-board communications |
Country Status (7)
Country | Link |
---|---|
US (3) | US6834131B2 (ja) |
EP (1) | EP1405446A4 (ja) |
JP (1) | JP3666752B2 (ja) |
KR (1) | KR20040035673A (ja) |
CN (2) | CN1281367C (ja) |
HK (1) | HK1068838A1 (ja) |
WO (1) | WO2003005616A2 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1281367C (zh) * | 2001-07-06 | 2006-10-25 | 惠亚集团公司 | 对用于电路板间通信的pcb中的光层进行集成的方法 |
US7405364B2 (en) * | 2002-12-30 | 2008-07-29 | Intel Corporation | Decoupled signal-power substrate architecture |
DE10347331A1 (de) * | 2003-10-10 | 2005-05-04 | Univ Dortmund | Verfahren zur Herstellung von elektrisch-optischen Leiterplatten mit Polysiloxanwellenleitern und ihre Verwendung |
KR20050040589A (ko) * | 2003-10-29 | 2005-05-03 | 삼성전기주식회사 | 광도파로가 형성된 인쇄회로 기판 및 그 제조 방법 |
TWI294258B (en) * | 2004-08-03 | 2008-03-01 | Rohm & Haas Elect Mat | Methods of forming devices having optical functionality |
JP2006072352A (ja) | 2004-08-19 | 2006-03-16 | Rohm & Haas Electronic Materials Llc | プリント回路板を形成する方法 |
JP2006184902A (ja) | 2004-12-22 | 2006-07-13 | Rohm & Haas Electronic Materials Llc | 光学デバイスを形成する方法 |
EP1674903B1 (en) | 2004-12-22 | 2008-12-03 | Rohm and Haas Electronic Materials, L.L.C. | Optical dry-films and methods of forming optical devices with dry-films |
EP1674904B1 (en) | 2004-12-22 | 2008-12-03 | Rohm and Haas Electronic Materials, L.L.C. | Optical dry-films and methods of forming optical devices with dry-films |
TWI283490B (en) * | 2005-10-17 | 2007-07-01 | Phoenix Prec Technology Corp | Circuit board structure of integrated optoelectronic component |
DE102005053202A1 (de) * | 2005-11-08 | 2007-05-10 | Comet Gmbh | Vorrichtung zum Vorbereiten einer Mehrschicht-Leiterplatte auf das Bohren von Kontaktierungsbohrungen |
US7496249B2 (en) * | 2005-12-29 | 2009-02-24 | Intel Corporation | Optical and/or electrical communications fabrics in circuit boards and/or other composite structures |
US20080044130A1 (en) * | 2006-08-16 | 2008-02-21 | Xyratex Technology Limited | Optical printed circuit board, a method of making an optical printed circuit board and an optical waveguide |
JP5512131B2 (ja) | 2006-12-26 | 2014-06-04 | 三井化学株式会社 | 光電気混載基板およびその製造方法 |
TWI343226B (en) * | 2006-12-31 | 2011-06-01 | Rohm & Haas Elect Mat | Printed circuit boards having optical functionality and methods forming the same |
US8009992B2 (en) | 2007-06-11 | 2011-08-30 | Hewlett-Packard Development Company, L.P. | Optical interconnect |
KR101531054B1 (ko) * | 2008-09-12 | 2015-06-23 | 주식회사 엔씨소프트 | 통합 메시징 환경에서의 지리정보 전송장치 및 그 방법 |
AT12322U1 (de) * | 2009-01-27 | 2012-03-15 | Dcc Dev Circuits & Components Gmbh | Verfahren zur herstellung einer mehrlagigen leiterplatte, haftverhinderungsmaterial sowie mehrlagige leiterplatte und verwendung eines derartigen verfahrens |
US7949211B1 (en) | 2010-02-26 | 2011-05-24 | Corning Incorporated | Modular active board subassemblies and printed wiring boards comprising the same |
US8731343B2 (en) | 2011-02-24 | 2014-05-20 | Xyratex Technology Limited | Optical printed circuit board, a method of making an optical printed circuit board and an optical waveguide |
US9081137B2 (en) | 2013-01-21 | 2015-07-14 | International Business Machines Corporation | Implementing embedded hybrid electrical-optical PCB construct |
US10141623B2 (en) | 2016-10-17 | 2018-11-27 | International Business Machines Corporation | Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board |
CN111901963B (zh) * | 2019-05-05 | 2022-01-04 | 诺沛半导体有限公司 | 在发光二极管载板上形成焊垫的方法 |
CN114731758A (zh) | 2019-11-06 | 2022-07-08 | 迅达科技公司 | 用于从印刷电路板去除过孔内的不想要的金属的***和方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3972755A (en) * | 1972-12-14 | 1976-08-03 | The United States Of America As Represented By The Secretary Of The Navy | Dielectric circuit board bonding |
DE3910710A1 (de) * | 1989-04-03 | 1990-10-04 | Standard Elektrik Lorenz Ag | Optisch-elektrische mehrfachverbindung |
US5106211A (en) * | 1991-02-14 | 1992-04-21 | Hoechst Celanese Corp. | Formation of polymer channel waveguides by excimer laser ablation and method of making same |
US5263111A (en) * | 1991-04-15 | 1993-11-16 | Raychem Corporation | Optical waveguide structures and formation methods |
US6274391B1 (en) * | 1992-10-26 | 2001-08-14 | Texas Instruments Incorporated | HDI land grid array packaged device having electrical and optical interconnects |
US5685995A (en) * | 1994-11-22 | 1997-11-11 | Electro Scientific Industries, Inc. | Method for laser functional trimming of films and devices |
US5590456A (en) * | 1994-12-07 | 1997-01-07 | Lucent Technologies Inc. | Apparatus for precise alignment and placement of optoelectric components |
US5891795A (en) * | 1996-03-18 | 1999-04-06 | Motorola, Inc. | High density interconnect substrate |
WO1999030542A1 (fr) * | 1997-12-11 | 1999-06-17 | Ibiden Co., Ltd. | Procede de fabrication d'une carte a circuit imprime multicouche |
US6185354B1 (en) * | 1998-05-15 | 2001-02-06 | Motorola, Inc. | Printed circuit board having integral waveguide |
DE19838519A1 (de) * | 1998-08-25 | 2000-03-02 | Bosch Gmbh Robert | Leiterplatte und Verfahren zur Herstellung |
US6611635B1 (en) * | 1998-10-09 | 2003-08-26 | Fujitsu Limited | Opto-electronic substrates with electrical and optical interconnections and methods for making |
US6684007B2 (en) * | 1998-10-09 | 2004-01-27 | Fujitsu Limited | Optical coupling structures and the fabrication processes |
WO2000050946A1 (de) * | 1999-02-23 | 2000-08-31 | Ppc Electronic Ag | Leiterplatte für electrische und optische signale sowie verfahren zu deren herstellung |
TW460717B (en) * | 1999-03-30 | 2001-10-21 | Toppan Printing Co Ltd | Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same |
US6731857B2 (en) * | 2001-03-29 | 2004-05-04 | Shipley Company, L.L.C. | Photodefinable composition, method of manufacturing an optical waveguide with the photodefinable composition, and optical waveguide formed therefrom |
US6705124B2 (en) * | 2001-06-04 | 2004-03-16 | Lightwave Microsystems Corporation | High-density plasma deposition process for fabricating a top clad for planar lightwave circuit devices |
CN1281367C (zh) * | 2001-07-06 | 2006-10-25 | 惠亚集团公司 | 对用于电路板间通信的pcb中的光层进行集成的方法 |
-
2002
- 2002-06-24 CN CNB028136446A patent/CN1281367C/zh not_active Expired - Fee Related
- 2002-06-24 EP EP02739953A patent/EP1405446A4/en not_active Withdrawn
- 2002-06-24 CN CNA2006100785695A patent/CN1870862A/zh active Pending
- 2002-06-24 WO PCT/US2002/019840 patent/WO2003005616A2/en active Application Filing
- 2002-06-24 KR KR10-2004-7000162A patent/KR20040035673A/ko not_active Application Discontinuation
- 2002-06-24 JP JP2003511455A patent/JP3666752B2/ja not_active Expired - Fee Related
- 2002-06-25 US US10/179,758 patent/US6834131B2/en not_active Expired - Lifetime
-
2004
- 2004-12-17 US US11/016,146 patent/US7024086B2/en not_active Expired - Fee Related
- 2004-12-29 HK HK04110314A patent/HK1068838A1/xx not_active IP Right Cessation
-
2006
- 2006-03-14 US US11/375,320 patent/US20060165345A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US7024086B2 (en) | 2006-04-04 |
WO2003005616A3 (en) | 2003-03-20 |
US20050129349A1 (en) | 2005-06-16 |
CN1524026A (zh) | 2004-08-25 |
JP2004535070A (ja) | 2004-11-18 |
EP1405446A4 (en) | 2006-07-19 |
WO2003005616A2 (en) | 2003-01-16 |
US20030006068A1 (en) | 2003-01-09 |
KR20040035673A (ko) | 2004-04-29 |
US20060165345A1 (en) | 2006-07-27 |
JP3666752B2 (ja) | 2005-06-29 |
CN1870862A (zh) | 2006-11-29 |
CN1281367C (zh) | 2006-10-25 |
US6834131B2 (en) | 2004-12-21 |
EP1405446A2 (en) | 2004-04-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20170624 |