HK1065641A1 - Use of diverse materials in air-cavity packaging of electronic devices - Google Patents
Use of diverse materials in air-cavity packaging of electronic devicesInfo
- Publication number
- HK1065641A1 HK1065641A1 HK04108226A HK04108226A HK1065641A1 HK 1065641 A1 HK1065641 A1 HK 1065641A1 HK 04108226 A HK04108226 A HK 04108226A HK 04108226 A HK04108226 A HK 04108226A HK 1065641 A1 HK1065641 A1 HK 1065641A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- sidewalls
- base
- lid
- die
- temperature
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 2
- 238000004806 packaging method and process Methods 0.000 title 1
- 238000005476 soldering Methods 0.000 abstract 3
- 208000013201 Stress fracture Diseases 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Packages (AREA)
- Casings For Electric Apparatus (AREA)
- Packaging Frangible Articles (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Organic Insulating Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/904,583 US6511866B1 (en) | 2001-07-12 | 2001-07-12 | Use of diverse materials in air-cavity packaging of electronic devices |
PCT/US2002/019501 WO2003007362A1 (en) | 2001-07-12 | 2002-06-19 | Use of diverse materials in air-cavity packaging of electronic devices |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1065641A1 true HK1065641A1 (en) | 2005-02-25 |
Family
ID=25419388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK04108226A HK1065641A1 (en) | 2001-07-12 | 2004-10-20 | Use of diverse materials in air-cavity packaging of electronic devices |
Country Status (17)
Country | Link |
---|---|
US (1) | US6511866B1 (de) |
EP (1) | EP1415335B1 (de) |
JP (1) | JP4362366B2 (de) |
KR (1) | KR100815740B1 (de) |
CN (1) | CN1266751C (de) |
AT (1) | ATE343851T1 (de) |
AU (1) | AU2002310466B2 (de) |
CA (1) | CA2453003C (de) |
DE (1) | DE60215669T2 (de) |
HK (1) | HK1065641A1 (de) |
IL (1) | IL159727A0 (de) |
MA (1) | MA26134A1 (de) |
MX (1) | MXPA04000248A (de) |
MY (1) | MY122915A (de) |
PL (1) | PL205553B1 (de) |
TW (1) | TW554504B (de) |
WO (1) | WO2003007362A1 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4848539B2 (ja) * | 2001-08-23 | 2011-12-28 | Dowaメタルテック株式会社 | 放熱板およびパワー半導体モジュール、icパッケージ |
JP2003139593A (ja) * | 2001-11-07 | 2003-05-14 | Hitachi Ltd | 車載電子機器および熱式流量計 |
JP3537417B2 (ja) * | 2001-12-25 | 2004-06-14 | 株式会社東芝 | 半導体装置およびその製造方法 |
SG157957A1 (en) * | 2003-01-29 | 2010-01-29 | Interplex Qlp Inc | Package for integrated circuit die |
US7948069B2 (en) * | 2004-01-28 | 2011-05-24 | International Rectifier Corporation | Surface mountable hermetically sealed package |
US7075174B2 (en) * | 2004-02-26 | 2006-07-11 | Agere Systems Inc. | Semiconductor packaging techniques for use with non-ceramic packages |
US7030472B2 (en) * | 2004-04-01 | 2006-04-18 | Agere Systems Inc. | Integrated circuit device having flexible leadframe |
US8648977B2 (en) | 2004-06-02 | 2014-02-11 | Applied Materials, Inc. | Methods and apparatus for providing a floating seal having an isolated sealing surface for chamber doors |
KR100716041B1 (ko) | 2004-06-02 | 2007-05-09 | 어플라이드 머티어리얼스, 인코포레이티드 | 챔버를 밀봉하기 위한 방법 및 장치 |
US7429790B2 (en) * | 2005-10-24 | 2008-09-30 | Freescale Semiconductor, Inc. | Semiconductor structure and method of manufacture |
US7446411B2 (en) * | 2005-10-24 | 2008-11-04 | Freescale Semiconductor, Inc. | Semiconductor structure and method of assembly |
US7683480B2 (en) * | 2006-03-29 | 2010-03-23 | Freescale Semiconductor, Inc. | Methods and apparatus for a reduced inductance wirebond array |
EP2141973A1 (de) * | 2008-07-02 | 2010-01-06 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Verfahren zur Bereitstellung leitfähiger Strukturen in einem mehrschichtigen Foliensystem und mehrschichtiges Foliensystem damit |
US9293350B2 (en) * | 2008-10-28 | 2016-03-22 | Stats Chippac Ltd. | Semiconductor package system with cavity substrate and manufacturing method therefor |
US8110445B2 (en) * | 2009-05-06 | 2012-02-07 | Infineon Technologies Ag | High power ceramic on copper package |
US8013429B2 (en) | 2009-07-14 | 2011-09-06 | Infineon Technologies Ag | Air cavity package with copper heat sink and ceramic window frame |
US8759965B2 (en) * | 2009-10-14 | 2014-06-24 | Stmicroelectronics, Inc. | Modular low stress package technology |
US8564968B1 (en) | 2011-05-10 | 2013-10-22 | Triquint Semiconductor, Inc. | Air cavity package including a package lid having at least one protrusion configured to facilitate coupling of the package lid with a package wall |
US8907467B2 (en) | 2012-03-28 | 2014-12-09 | Infineon Technologies Ag | PCB based RF-power package window frame |
EP3146560A4 (de) * | 2014-05-23 | 2018-04-18 | Materion Corporation | Lufthohlraumverpackung |
US10015882B1 (en) | 2015-01-05 | 2018-07-03 | Qorvo Us, Inc. | Modular semiconductor package |
US10468399B2 (en) | 2015-03-31 | 2019-11-05 | Cree, Inc. | Multi-cavity package having single metal flange |
DE102015209892A1 (de) * | 2015-05-29 | 2016-12-01 | Rolls-Royce Deutschland Ltd & Co Kg | Adaptives Flugzeugtriebwerk und Flugzeug mit einem adaptiven Triebwerk |
US9629246B2 (en) | 2015-07-28 | 2017-04-18 | Infineon Technologies Ag | PCB based semiconductor package having integrated electrical functionality |
US9997476B2 (en) | 2015-10-30 | 2018-06-12 | Infineon Technologies Ag | Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange |
US10225922B2 (en) | 2016-02-18 | 2019-03-05 | Cree, Inc. | PCB based semiconductor package with impedance matching network elements integrated therein |
US10115605B2 (en) | 2016-07-06 | 2018-10-30 | Rjr Technologies, Inc. | Vacuum assisted sealing processes and systems for increasing air cavity package manufacturing rates |
US11791251B2 (en) | 2021-07-29 | 2023-10-17 | Qorvo Us, Inc. | High power laminate RF package |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3693239A (en) * | 1969-07-25 | 1972-09-26 | Sidney Dix | A method of making a micromodular package |
JPS57177583A (en) * | 1981-04-14 | 1982-11-01 | Int Standard Electric Corp | Holl effect device |
US4594770A (en) * | 1982-07-15 | 1986-06-17 | Olin Corporation | Method of making semiconductor casing |
US4831212A (en) * | 1986-05-09 | 1989-05-16 | Nissin Electric Company, Limited | Package for packing semiconductor devices and process for producing the same |
MY104152A (en) * | 1988-08-12 | 1994-02-28 | Mitsui Chemicals Inc | Processes for producing semiconductor devices. |
US5278429A (en) * | 1989-12-19 | 1994-01-11 | Fujitsu Limited | Semiconductor device having improved adhesive structure and method of producing same |
US5270262A (en) * | 1991-02-28 | 1993-12-14 | National Semiconductor Corporation | O-ring package |
US5436492A (en) * | 1992-06-23 | 1995-07-25 | Sony Corporation | Charge-coupled device image sensor |
US5598034A (en) * | 1992-07-22 | 1997-01-28 | Vlsi Packaging Corporation | Plastic packaging of microelectronic circuit devices |
JP3197073B2 (ja) * | 1992-10-06 | 2001-08-13 | 治夫 嵐 | 太陽熱受熱器 |
US5773377A (en) | 1993-12-22 | 1998-06-30 | Crystalline Materials Corporation | Low temperature sintered, resistive aluminum nitride ceramics |
US6339191B1 (en) * | 1994-03-11 | 2002-01-15 | Silicon Bandwidth Inc. | Prefabricated semiconductor chip carrier |
US6323550B1 (en) * | 1995-06-06 | 2001-11-27 | Analog Devices, Inc. | Package for sealing an integrated circuit die |
US5837935A (en) * | 1996-02-26 | 1998-11-17 | Ford Motor Company | Hermetic seal for an electronic component having a secondary chamber |
US5793104A (en) * | 1996-02-29 | 1998-08-11 | Lsi Logic Corporation | Apparatus for forming electrical connections between a semiconductor die and a semiconductor package |
US5787578A (en) | 1996-07-09 | 1998-08-04 | International Business Machines Corporation | Method of selectively depositing a metallic layer on a ceramic substrate |
US5943558A (en) * | 1996-09-23 | 1999-08-24 | Communications Technology, Inc. | Method of making an assembly package having an air tight cavity and a product made by the method |
US6037193A (en) * | 1997-01-31 | 2000-03-14 | International Business Machines Corporation | Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity |
US6117705A (en) * | 1997-04-18 | 2000-09-12 | Amkor Technology, Inc. | Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate |
US5869883A (en) | 1997-09-26 | 1999-02-09 | Stanley Wang, President Pantronix Corp. | Packaging of semiconductor circuit in pre-molded plastic package |
US5893726A (en) * | 1997-12-15 | 1999-04-13 | Micron Technology, Inc. | Semiconductor package with pre-fabricated cover and method of fabrication |
JP3652488B2 (ja) * | 1997-12-18 | 2005-05-25 | Tdk株式会社 | 樹脂パッケージの製造方法 |
US6204454B1 (en) * | 1997-12-27 | 2001-03-20 | Tdk Corporation | Wiring board and process for the production thereof |
EP0951068A1 (de) * | 1998-04-17 | 1999-10-20 | Interuniversitair Micro-Elektronica Centrum Vzw | Herstellungsverfahren für eine Mikrostruktur mit Innenraum |
US6303986B1 (en) * | 1998-07-29 | 2001-10-16 | Silicon Light Machines | Method of and apparatus for sealing an hermetic lid to a semiconductor die |
US6265246B1 (en) * | 1999-07-23 | 2001-07-24 | Agilent Technologies, Inc. | Microcap wafer-level package |
US6384353B1 (en) * | 2000-02-01 | 2002-05-07 | Motorola, Inc. | Micro-electromechanical system device |
US6384473B1 (en) * | 2000-05-16 | 2002-05-07 | Sandia Corporation | Microelectronic device package with an integral window |
US6291263B1 (en) * | 2000-06-13 | 2001-09-18 | Siliconware Precision Industries Co., Ltd. | Method of fabricating an integrated circuit package having a core-hollowed encapsulation body |
-
2001
- 2001-07-12 US US09/904,583 patent/US6511866B1/en not_active Expired - Lifetime
-
2002
- 2002-06-19 JP JP2003513031A patent/JP4362366B2/ja not_active Expired - Lifetime
- 2002-06-19 WO PCT/US2002/019501 patent/WO2003007362A1/en active IP Right Grant
- 2002-06-19 EP EP02737544A patent/EP1415335B1/de not_active Expired - Lifetime
- 2002-06-19 CA CA002453003A patent/CA2453003C/en not_active Expired - Lifetime
- 2002-06-19 MX MXPA04000248A patent/MXPA04000248A/es active IP Right Grant
- 2002-06-19 PL PL368717A patent/PL205553B1/pl unknown
- 2002-06-19 DE DE60215669T patent/DE60215669T2/de not_active Expired - Lifetime
- 2002-06-19 KR KR1020047000468A patent/KR100815740B1/ko active IP Right Grant
- 2002-06-19 CN CNB028139313A patent/CN1266751C/zh not_active Expired - Fee Related
- 2002-06-19 IL IL15972702A patent/IL159727A0/xx active IP Right Grant
- 2002-06-19 AU AU2002310466A patent/AU2002310466B2/en not_active Ceased
- 2002-06-19 AT AT02737544T patent/ATE343851T1/de not_active IP Right Cessation
- 2002-06-26 TW TW091114084A patent/TW554504B/zh not_active IP Right Cessation
- 2002-07-11 MY MYPI20022642A patent/MY122915A/en unknown
-
2004
- 2004-02-09 MA MA27521A patent/MA26134A1/fr unknown
- 2004-10-20 HK HK04108226A patent/HK1065641A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1415335A4 (de) | 2005-12-21 |
EP1415335B1 (de) | 2006-10-25 |
US6511866B1 (en) | 2003-01-28 |
MXPA04000248A (es) | 2004-05-04 |
TW554504B (en) | 2003-09-21 |
IL159727A0 (en) | 2004-06-20 |
CN1266751C (zh) | 2006-07-26 |
CA2453003C (en) | 2009-12-22 |
JP4362366B2 (ja) | 2009-11-11 |
PL205553B1 (pl) | 2010-04-30 |
JP2004535675A (ja) | 2004-11-25 |
DE60215669D1 (de) | 2006-12-07 |
US20030013234A1 (en) | 2003-01-16 |
KR20040036898A (ko) | 2004-05-03 |
DE60215669T2 (de) | 2007-08-23 |
PL368717A1 (en) | 2005-04-04 |
AU2002310466B2 (en) | 2006-07-20 |
WO2003007362A1 (en) | 2003-01-23 |
MY122915A (en) | 2006-05-31 |
KR100815740B1 (ko) | 2008-03-20 |
CN1526162A (zh) | 2004-09-01 |
MA26134A1 (fr) | 2004-04-01 |
EP1415335A1 (de) | 2004-05-06 |
CA2453003A1 (en) | 2003-01-23 |
ATE343851T1 (de) | 2006-11-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20210619 |