HK1048721A1 - 用於保持處理期間印刷電路板的精確位置的方法和設備 - Google Patents

用於保持處理期間印刷電路板的精確位置的方法和設備

Info

Publication number
HK1048721A1
HK1048721A1 HK03100673.1A HK03100673A HK1048721A1 HK 1048721 A1 HK1048721 A1 HK 1048721A1 HK 03100673 A HK03100673 A HK 03100673A HK 1048721 A1 HK1048721 A1 HK 1048721A1
Authority
HK
Hong Kong
Prior art keywords
holding
circuit board
printed circuit
during processing
position during
Prior art date
Application number
HK03100673.1A
Other languages
English (en)
Inventor
T Ashton Augustus
Willshere Richard
Original Assignee
Speedline Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedline Technologies Inc filed Critical Speedline Technologies Inc
Publication of HK1048721A1 publication Critical patent/HK1048721A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
HK03100673.1A 1999-11-08 2003-01-27 用於保持處理期間印刷電路板的精確位置的方法和設備 HK1048721A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16393499P 1999-11-08 1999-11-08
PCT/US2000/042009 WO2001035708A2 (en) 1999-11-08 2000-11-08 Method and apparatus for holding a printed circuit board in a precise position during processing

Publications (1)

Publication Number Publication Date
HK1048721A1 true HK1048721A1 (zh) 2003-04-11

Family

ID=22592256

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03100673.1A HK1048721A1 (zh) 1999-11-08 2003-01-27 用於保持處理期間印刷電路板的精確位置的方法和設備

Country Status (5)

Country Link
EP (1) EP1228676B1 (zh)
AU (1) AU2752401A (zh)
DE (1) DE60011664T2 (zh)
HK (1) HK1048721A1 (zh)
WO (1) WO2001035708A2 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003063569A1 (en) * 2002-01-22 2003-07-31 Teradyne, Inc. Automated optical inspection system with staging conveyor
DE102004010918A1 (de) * 2004-03-05 2005-09-29 Siemens Ag Vorrichtung zum Handhaben von Substraten in einer Bestückvorrichtung
CN1940567B (zh) * 2005-09-30 2011-01-19 良瑞科技股份有限公司 用于电路板检测的输送夹持装置
TWI418271B (zh) * 2010-12-17 2013-12-01 Zhen Ding Technology Co Ltd 固持裝置
JP6151925B2 (ja) * 2013-02-06 2017-06-21 ヤマハ発動機株式会社 基板固定装置、基板作業装置および基板固定方法
US10723117B2 (en) 2015-04-07 2020-07-28 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10703089B2 (en) 2015-04-07 2020-07-07 Illinois Tool Works Inc. Edge lock assembly for a stencil printer
KR102581104B1 (ko) * 2018-01-02 2023-09-20 일리노이즈 툴 워크스 인코포레이티드 스텐실 프린터용 가장자리 잠금 조립체
CN109436664A (zh) * 2019-01-10 2019-03-08 北亚美亚电子科技（深圳）有限公司 一种多功能泛用型运输轨道
CN110035616B (zh) * 2019-04-25 2021-11-23 嵊州市鉴亭新材料科技有限公司 一种安装有柔性夹持体结构的pcb板加工用夹持装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62130596A (ja) * 1985-12-02 1987-06-12 三菱電機株式会社 電子部品自動組立装置
GB9102850D0 (en) * 1991-02-11 1991-03-27 Dek Printing Machines Ltd Workpiece support means
EP0768019B1 (en) * 1995-03-28 2003-06-04 Assembléon N.V. Method of positioning a printed circuit board in a component placement machine, and component placement machine for this method

Also Published As

Publication number Publication date
WO2001035708A3 (en) 2001-12-27
DE60011664T2 (de) 2005-09-08
WO2001035708A2 (en) 2001-05-17
EP1228676B1 (en) 2004-06-16
AU2752401A (en) 2001-06-06
EP1228676A2 (en) 2002-08-07
DE60011664D1 (de) 2004-07-22

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