HK1048196B - 用於切割半導體封裝器件的處理系統 - Google Patents
用於切割半導體封裝器件的處理系統Info
- Publication number
- HK1048196B HK1048196B HK03100353.8A HK03100353A HK1048196B HK 1048196 B HK1048196 B HK 1048196B HK 03100353 A HK03100353 A HK 03100353A HK 1048196 B HK1048196 B HK 1048196B
- Authority
- HK
- Hong Kong
- Prior art keywords
- cutting
- semiconductor package
- package device
- handler system
- handler
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Dicing (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2000-0079284A KR100396982B1 (ko) | 2000-12-20 | 2000-12-20 | 반도체패키지 적재 테이블장치 |
KR10-2000-0079282A KR100385876B1 (ko) | 2000-12-20 | 2000-12-20 | 반도체 패키지장치 절단용 핸들러 시스템 |
Publications (2)
Publication Number | Publication Date |
---|---|
HK1048196A1 HK1048196A1 (en) | 2003-03-21 |
HK1048196B true HK1048196B (zh) | 2005-09-02 |
Family
ID=26638651
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK03100353.8A HK1048196B (zh) | 2000-12-20 | 2003-01-15 | 用於切割半導體封裝器件的處理系統 |
HK06112371A HK1091947A1 (en) | 2000-12-20 | 2006-11-10 | Semiconductor package-loading table and semiconductor package handler comprising the same |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK06112371A HK1091947A1 (en) | 2000-12-20 | 2006-11-10 | Semiconductor package-loading table and semiconductor package handler comprising the same |
Country Status (8)
Country | Link |
---|---|
US (1) | US6446354B1 (zh) |
JP (1) | JP3699661B2 (zh) |
CN (1) | CN1208824C (zh) |
GB (1) | GB2370411B (zh) |
HK (2) | HK1048196B (zh) |
IT (1) | ITTO20010347A1 (zh) |
SG (2) | SG129308A1 (zh) |
TW (1) | TW495866B (zh) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4649059B2 (ja) * | 2001-05-25 | 2011-03-09 | アピックヤマダ株式会社 | ワーク搬送装置及びダイシング装置 |
SG111091A1 (en) * | 2002-10-29 | 2005-05-30 | Advanced Systems Automation | Handler for semiconductor singulation and method therefor |
KR20050063359A (ko) * | 2003-12-22 | 2005-06-28 | 한미반도체 주식회사 | 반도체 패키지 이송 메카니즘 및 이송방법 |
CN100470758C (zh) * | 2004-05-07 | 2009-03-18 | 韩美半导体株式会社 | 用于制造半导体封装的切割和处理*** |
WO2006025622A1 (en) * | 2004-08-31 | 2006-03-09 | Hanmi Semiconductor Co., Ltd. | A sawing apparatus and a control method for manufacturing processes of semiconductor package |
KR100596505B1 (ko) * | 2004-09-08 | 2006-07-05 | 삼성전자주식회사 | 소잉/소팅 시스템 |
US8011058B2 (en) * | 2006-10-31 | 2011-09-06 | Asm Assembly Automation Ltd | Singulation handler system for electronic packages |
KR100904496B1 (ko) * | 2007-02-09 | 2009-06-24 | 한미반도체 주식회사 | 반도체 패키지 가공시스템 및 반도체 패키지 가공방법 |
KR101108591B1 (ko) * | 2007-03-16 | 2012-01-31 | 도호쿠 세이키 고교 가부시키카이샤 | 위치 보정 기능을 갖는 핸들러 및 미검사 디바이스의 측정 소켓에 대한 로딩 방법 |
US8978673B2 (en) * | 2007-08-09 | 2015-03-17 | Asm Assembly Automation Ltd | Megasonic cleaning system |
CN101802997B (zh) * | 2007-09-14 | 2011-12-07 | 韩美半导体株式会社 | 切割与加工存储卡的装置 |
US8167524B2 (en) * | 2007-11-16 | 2012-05-01 | Asm Assembly Automation Ltd | Handling system for inspecting and sorting electronic components |
NL2001790C2 (nl) * | 2008-07-11 | 2010-01-12 | Fico Bv | Inrichting en werkwijze voor het zagen van elektronische componenten. |
JP5457660B2 (ja) * | 2008-11-07 | 2014-04-02 | アピックヤマダ株式会社 | 切断方法及び切断装置 |
US8037996B2 (en) * | 2009-01-05 | 2011-10-18 | Asm Assembly Automation Ltd | Transfer apparatus for handling electronic components |
US7975710B2 (en) * | 2009-07-06 | 2011-07-12 | Asm Assembly Automation Ltd | Acoustic cleaning system for electronic components |
US8251422B2 (en) * | 2010-03-29 | 2012-08-28 | Asm Assembly Automation Ltd | Apparatus for transferring electronic components in stages |
CN102107192A (zh) * | 2010-12-01 | 2011-06-29 | 铜陵三佳科技股份有限公司 | 半导体封装设备下模面擦洗装置 |
CN102290356B (zh) * | 2011-09-02 | 2012-11-21 | 四川卫士通信息安全平台技术有限公司 | 一种适用于bga芯片贴片焊接后进行封装保护的方法 |
KR101414690B1 (ko) * | 2013-04-22 | 2014-07-08 | 한미반도체 주식회사 | 반도체 스트립 절단장치 |
JP6000902B2 (ja) | 2013-06-24 | 2016-10-05 | Towa株式会社 | 電子部品用の収容治具、その製造方法及び個片化装置 |
KR20160001004A (ko) | 2014-06-26 | 2016-01-06 | 삼성전자주식회사 | 피치 조절 유닛, 피치 조절유닛을 구비하는 추출 장치 및 테스트 핸들러 |
KR101820667B1 (ko) * | 2015-10-14 | 2018-01-22 | 한미반도체 주식회사 | 반도체 패키지 처리장치 |
KR102440451B1 (ko) * | 2016-01-29 | 2022-09-06 | 한미반도체 주식회사 | 반도체 패키지 처리장치 |
JP6952515B2 (ja) | 2017-06-30 | 2021-10-20 | Towa株式会社 | ワーク搬送装置、電子部品の製造装置、ワーク搬送方法、および、電子部品の製造方法 |
CN108817962A (zh) * | 2018-07-24 | 2018-11-16 | 米亚索乐装备集成(福建)有限公司 | 一种卷材裁切装置 |
CN110391156A (zh) * | 2019-04-23 | 2019-10-29 | 南宁聚信众信息技术咨询有限公司 | 一种基于芯片封装技术的稳定性高的分拣设备 |
CN110176415B (zh) * | 2019-05-07 | 2021-11-05 | 资兴市慧华电子有限公司 | 一种具有吸嘴拆装便捷功能的清洁型芯片分拣设备 |
JP7154195B2 (ja) * | 2019-07-26 | 2022-10-17 | Towa株式会社 | 切断装置及び切断品の製造方法 |
KR102331363B1 (ko) * | 2020-06-19 | 2021-11-29 | 리노정밀(주) | 검사 장치용 지그 블록 절단 장치 |
CN113787006B (zh) * | 2021-09-15 | 2022-09-06 | 扬州爱迪秀自动化科技有限公司 | 一种双工位陶瓷电容分拣装置 |
CN114545188A (zh) * | 2022-03-02 | 2022-05-27 | 深圳市卓晶微智能机器人科技有限公司 | 一种适用性强的半导体测试设备 |
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JPH01121136A (ja) * | 1987-11-06 | 1989-05-12 | Canon Inc | 物品供給装置 |
US5232463A (en) | 1988-03-05 | 1993-08-03 | Deutsche Itt Industries Gmbh | Apparatus for manufacturing a semiconductor device |
JPH01289134A (ja) * | 1988-05-16 | 1989-11-21 | Seiko Epson Corp | 半導体装置のダイ収納トレイ |
US5446584A (en) * | 1989-09-11 | 1995-08-29 | Kensington Laboratories, Inc. | Compact specimen processing station |
JP2644912B2 (ja) * | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
JP2596217Y2 (ja) | 1991-06-21 | 1999-06-07 | 山形日本電気株式会社 | 切断成形装置 |
US5766360A (en) * | 1992-03-27 | 1998-06-16 | Kabushiki Kaisha Toshiba | Substrate processing apparatus and substrate processing method |
JPH06252241A (ja) * | 1993-03-02 | 1994-09-09 | Toshiba Corp | 半導体製造装置 |
JP3274906B2 (ja) * | 1993-05-07 | 2002-04-15 | 芝浦メカトロニクス株式会社 | 半導体樹脂封止装置 |
JPH0798361A (ja) * | 1993-06-19 | 1995-04-11 | Tokyo Electron Ltd | 被検査体の収納具及びプローブ装置 |
JPH07171754A (ja) * | 1993-12-20 | 1995-07-11 | Disco Abrasive Syst Ltd | 外観検査機能付きダイシング装置 |
JPH07241870A (ja) * | 1994-03-01 | 1995-09-19 | Mitsubishi Materials Corp | 電子部品の樹脂封止装置 |
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JPH0843482A (ja) * | 1994-08-01 | 1996-02-16 | Tokyo Electron Ltd | 温調装置 |
JPH0964148A (ja) * | 1995-08-18 | 1997-03-07 | Shinkawa Ltd | ウェーハリングの供給・返送装置 |
JPH0983196A (ja) * | 1995-09-11 | 1997-03-28 | Yamagata Casio Co Ltd | 電子部品搭載装置 |
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JPH09197001A (ja) * | 1996-01-16 | 1997-07-31 | Oki Electric Ind Co Ltd | Ic試験用ソケットのハンダくず除去装置 |
JPH09312309A (ja) * | 1996-05-22 | 1997-12-02 | Hitachi Ltd | モールド方法およびモールドユニットならびにタブレット |
US5679055A (en) * | 1996-05-31 | 1997-10-21 | Memc Electronic Materials, Inc. | Automated wafer lapping system |
JPH1038967A (ja) * | 1996-07-24 | 1998-02-13 | Advantest Corp | Ic位置決装置 |
JPH10117092A (ja) * | 1996-10-08 | 1998-05-06 | Toshiba Corp | 部品供給装置 |
JP3019005B2 (ja) * | 1996-10-16 | 2000-03-13 | 日本電気株式会社 | Lsiハンドラ |
KR19980042662A (ko) * | 1996-11-22 | 1998-08-17 | 윌리엄비.켐플러 | 집적 회로 칩 패키징 방법 |
JPH10232263A (ja) * | 1997-02-19 | 1998-09-02 | Nippon Haiburitsuto:Kk | 集積回路の検査装置および検査用導電体 |
US6090176A (en) * | 1997-03-18 | 2000-07-18 | Kabushiki Kaisha Toshiba | Sample transferring method and sample transfer supporting apparatus |
US6036582A (en) * | 1997-06-06 | 2000-03-14 | Ebara Corporation | Polishing apparatus |
JP4002645B2 (ja) * | 1997-11-25 | 2007-11-07 | アピックヤマダ株式会社 | 半導体装置切断収納装置 |
JP3338352B2 (ja) * | 1997-11-26 | 2002-10-28 | シャープ株式会社 | ダイボンダーおよびワイヤーボンダーならびにそれらを用いる半導体装置の製造方法 |
JPH11223656A (ja) * | 1998-02-06 | 1999-08-17 | Jsr Corp | 被検査物の位置決め方法、および、それが用いられる検査装置 |
JP2000040728A (ja) * | 1998-07-22 | 2000-02-08 | Nippon Asm Kk | ウェハ搬送機構 |
JP2000111613A (ja) * | 1998-10-07 | 2000-04-21 | Nippon Eng Kk | バーンインボード用ローダアンローダ装置 |
JP3605302B2 (ja) * | 1998-10-26 | 2004-12-22 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US6137303A (en) * | 1998-12-14 | 2000-10-24 | Sony Corporation | Integrated testing method and apparatus for semiconductor test operations processing |
JP2000232080A (ja) * | 1999-02-10 | 2000-08-22 | Disco Abrasive Syst Ltd | 被加工物の分割システム及びペレットの移し替え装置 |
-
2001
- 2001-03-22 GB GB0107260A patent/GB2370411B/en not_active Expired - Fee Related
- 2001-03-29 CN CNB011095148A patent/CN1208824C/zh not_active Expired - Fee Related
- 2001-04-11 IT IT2001TO000347A patent/ITTO20010347A1/it unknown
- 2001-04-13 US US09/834,557 patent/US6446354B1/en not_active Expired - Fee Related
- 2001-04-20 SG SG200503722A patent/SG129308A1/en unknown
- 2001-04-20 SG SG200102266A patent/SG98444A1/en unknown
- 2001-04-26 JP JP2001129146A patent/JP3699661B2/ja not_active Expired - Fee Related
- 2001-05-23 TW TW090112356A patent/TW495866B/zh not_active IP Right Cessation
-
2003
- 2003-01-15 HK HK03100353.8A patent/HK1048196B/zh not_active IP Right Cessation
-
2006
- 2006-11-10 HK HK06112371A patent/HK1091947A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW495866B (en) | 2002-07-21 |
ITTO20010347A1 (it) | 2002-10-11 |
JP3699661B2 (ja) | 2005-09-28 |
CN1208824C (zh) | 2005-06-29 |
JP2002214288A (ja) | 2002-07-31 |
ITTO20010347A0 (it) | 2001-04-11 |
SG129308A1 (en) | 2007-02-26 |
GB2370411B (en) | 2003-08-13 |
GB0107260D0 (en) | 2001-05-16 |
US6446354B1 (en) | 2002-09-10 |
GB2370411A (en) | 2002-06-26 |
SG98444A1 (en) | 2003-09-19 |
US20020073575A1 (en) | 2002-06-20 |
CN1360345A (zh) | 2002-07-24 |
HK1091947A1 (en) | 2007-01-26 |
HK1048196A1 (en) | 2003-03-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20090329 |