HK1048196B - 用於切割半導體封裝器件的處理系統 - Google Patents

用於切割半導體封裝器件的處理系統

Info

Publication number
HK1048196B
HK1048196B HK03100353.8A HK03100353A HK1048196B HK 1048196 B HK1048196 B HK 1048196B HK 03100353 A HK03100353 A HK 03100353A HK 1048196 B HK1048196 B HK 1048196B
Authority
HK
Hong Kong
Prior art keywords
cutting
semiconductor package
package device
handler system
handler
Prior art date
Application number
HK03100353.8A
Other languages
English (en)
Other versions
HK1048196A1 (en
Inventor
羅益均
Original Assignee
株式會社韓美
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR10-2000-0079284A external-priority patent/KR100396982B1/ko
Priority claimed from KR10-2000-0079282A external-priority patent/KR100385876B1/ko
Application filed by 株式會社韓美 filed Critical 株式會社韓美
Publication of HK1048196A1 publication Critical patent/HK1048196A1/xx
Publication of HK1048196B publication Critical patent/HK1048196B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Dicing (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
HK03100353.8A 2000-12-20 2003-01-15 用於切割半導體封裝器件的處理系統 HK1048196B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2000-0079284A KR100396982B1 (ko) 2000-12-20 2000-12-20 반도체패키지 적재 테이블장치
KR10-2000-0079282A KR100385876B1 (ko) 2000-12-20 2000-12-20 반도체 패키지장치 절단용 핸들러 시스템

Publications (2)

Publication Number Publication Date
HK1048196A1 HK1048196A1 (en) 2003-03-21
HK1048196B true HK1048196B (zh) 2005-09-02

Family

ID=26638651

Family Applications (2)

Application Number Title Priority Date Filing Date
HK03100353.8A HK1048196B (zh) 2000-12-20 2003-01-15 用於切割半導體封裝器件的處理系統
HK06112371A HK1091947A1 (en) 2000-12-20 2006-11-10 Semiconductor package-loading table and semiconductor package handler comprising the same

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK06112371A HK1091947A1 (en) 2000-12-20 2006-11-10 Semiconductor package-loading table and semiconductor package handler comprising the same

Country Status (8)

Country Link
US (1) US6446354B1 (zh)
JP (1) JP3699661B2 (zh)
CN (1) CN1208824C (zh)
GB (1) GB2370411B (zh)
HK (2) HK1048196B (zh)
IT (1) ITTO20010347A1 (zh)
SG (2) SG129308A1 (zh)
TW (1) TW495866B (zh)

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CN100470758C (zh) * 2004-05-07 2009-03-18 韩美半导体株式会社 用于制造半导体封装的切割和处理***
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US8011058B2 (en) * 2006-10-31 2011-09-06 Asm Assembly Automation Ltd Singulation handler system for electronic packages
KR100904496B1 (ko) * 2007-02-09 2009-06-24 한미반도체 주식회사 반도체 패키지 가공시스템 및 반도체 패키지 가공방법
KR101108591B1 (ko) * 2007-03-16 2012-01-31 도호쿠 세이키 고교 가부시키카이샤 위치 보정 기능을 갖는 핸들러 및 미검사 디바이스의 측정 소켓에 대한 로딩 방법
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CN102290356B (zh) * 2011-09-02 2012-11-21 四川卫士通信息安全平台技术有限公司 一种适用于bga芯片贴片焊接后进行封装保护的方法
KR101414690B1 (ko) * 2013-04-22 2014-07-08 한미반도체 주식회사 반도체 스트립 절단장치
JP6000902B2 (ja) 2013-06-24 2016-10-05 Ｔｏｗａ株式会社 電子部品用の収容治具、その製造方法及び個片化装置
KR20160001004A (ko) 2014-06-26 2016-01-06 삼성전자주식회사 피치 조절 유닛, 피치 조절유닛을 구비하는 추출 장치 및 테스트 핸들러
KR101820667B1 (ko) * 2015-10-14 2018-01-22 한미반도체 주식회사 반도체 패키지 처리장치
KR102440451B1 (ko) * 2016-01-29 2022-09-06 한미반도체 주식회사 반도체 패키지 처리장치
JP6952515B2 (ja) 2017-06-30 2021-10-20 Ｔｏｗａ株式会社 ワーク搬送装置、電子部品の製造装置、ワーク搬送方法、および、電子部品の製造方法
CN108817962A (zh) * 2018-07-24 2018-11-16 米亚索乐装备集成（福建）有限公司 一种卷材裁切装置
CN110391156A (zh) * 2019-04-23 2019-10-29 南宁聚信众信息技术咨询有限公司 一种基于芯片封装技术的稳定性高的分拣设备
CN110176415B (zh) * 2019-05-07 2021-11-05 资兴市慧华电子有限公司 一种具有吸嘴拆装便捷功能的清洁型芯片分拣设备
JP7154195B2 (ja) * 2019-07-26 2022-10-17 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
KR102331363B1 (ko) * 2020-06-19 2021-11-29 리노정밀(주) 검사 장치용 지그 블록 절단 장치
CN113787006B (zh) * 2021-09-15 2022-09-06 扬州爱迪秀自动化科技有限公司 一种双工位陶瓷电容分拣装置
CN114545188A (zh) * 2022-03-02 2022-05-27 深圳市卓晶微智能机器人科技有限公司 一种适用性强的半导体测试设备

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Also Published As

Publication number Publication date
TW495866B (en) 2002-07-21
ITTO20010347A1 (it) 2002-10-11
JP3699661B2 (ja) 2005-09-28
CN1208824C (zh) 2005-06-29
JP2002214288A (ja) 2002-07-31
ITTO20010347A0 (it) 2001-04-11
SG129308A1 (en) 2007-02-26
GB2370411B (en) 2003-08-13
GB0107260D0 (en) 2001-05-16
US6446354B1 (en) 2002-09-10
GB2370411A (en) 2002-06-26
SG98444A1 (en) 2003-09-19
US20020073575A1 (en) 2002-06-20
CN1360345A (zh) 2002-07-24
HK1091947A1 (en) 2007-01-26
HK1048196A1 (en) 2003-03-21

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20090329