HK1042627A1 - 沈積傳導層於基板之程序 - Google Patents

沈積傳導層於基板之程序

Info

Publication number
HK1042627A1
HK1042627A1 HK02102596.2A HK02102596A HK1042627A1 HK 1042627 A1 HK1042627 A1 HK 1042627A1 HK 02102596 A HK02102596 A HK 02102596A HK 1042627 A1 HK1042627 A1 HK 1042627A1
Authority
HK
Hong Kong
Prior art keywords
substrate
conducting layer
depositing conducting
depositing
layer
Prior art date
Application number
HK02102596.2A
Other languages
English (en)
Inventor
Lochun Darren
Harrison David
John Ramsey Blue
Original Assignee
Rt Microwave Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB9826446.8A external-priority patent/GB9826446D0/en
Priority claimed from GBGB9826447.6A external-priority patent/GB9826447D0/en
Application filed by Rt Microwave Ltd filed Critical Rt Microwave Ltd
Publication of HK1042627A1 publication Critical patent/HK1042627A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
HK02102596.2A 1998-12-03 2002-04-08 沈積傳導層於基板之程序 HK1042627A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB9826446.8A GB9826446D0 (en) 1998-12-03 1998-12-03 Electrical battery interconnect device
GBGB9826447.6A GB9826447D0 (en) 1998-12-03 1998-12-03 Fabrication of a seeding layer to enable electroplating and electroless platingvia a lithographic printing process
PCT/GB1999/004064 WO2000033625A1 (en) 1998-12-03 1999-12-03 Process for depositing conducting layer on substrate

Publications (1)

Publication Number Publication Date
HK1042627A1 true HK1042627A1 (zh) 2002-08-16

Family

ID=26314771

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02102596.2A HK1042627A1 (zh) 1998-12-03 2002-04-08 沈積傳導層於基板之程序

Country Status (8)

Country Link
EP (1) EP1142456A1 (zh)
JP (1) JP2002531961A (zh)
CN (1) CN1242659C (zh)
AU (1) AU762686B2 (zh)
CA (1) CA2350506A1 (zh)
HK (1) HK1042627A1 (zh)
IL (1) IL143440A0 (zh)
WO (1) WO2000033625A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6413858B1 (en) 1999-08-27 2002-07-02 Micron Technology, Inc. Barrier and electroplating seed layer
GB0104982D0 (en) 2001-02-28 2001-04-18 Gill Steven Electrode
FR2825228B1 (fr) 2001-05-25 2003-09-19 Framatome Connectors Int Procede de fabrication d'un circuit imprime et antenne planaire fabriquee avec celui-ci
GB0117431D0 (en) * 2001-07-17 2001-09-12 Univ Brunel Method for printing conducting layer onto substrate
US6828713B2 (en) * 2002-07-30 2004-12-07 Agilent Technologies, Inc Resonator with seed layer
GB2394725A (en) * 2002-10-04 2004-05-05 Qinetiq Ltd Method of forming a magnetic information tag by electroless deposition
US20050241951A1 (en) * 2004-04-30 2005-11-03 Kenneth Crouse Selective catalytic activation of non-conductive substrates
US7255782B2 (en) 2004-04-30 2007-08-14 Kenneth Crouse Selective catalytic activation of non-conductive substrates
GB0413076D0 (en) 2004-06-11 2004-07-14 Medtronic Inc Deep brain stimulation of the Zona incerta
WO2010122918A1 (ja) * 2009-04-24 2010-10-28 住友電気工業株式会社 プリント配線板用基板、プリント配線板、及びそれらの製造方法
EP2740818B1 (en) * 2012-12-05 2016-03-30 ATOTECH Deutschland GmbH Method for manufacture of wire bondable and solderable surfaces on noble metal electrodes
JP6484218B2 (ja) 2014-03-20 2019-03-13 住友電気工業株式会社 プリント配線板用基板及びプリント配線板
CN106134298B (zh) 2014-03-27 2019-02-22 住友电气工业株式会社 印刷线路板用基板、印刷线路板以及制造印刷线路板用基板的方法
CN107211537A (zh) 2015-01-22 2017-09-26 住友电气工业株式会社 印刷线路板用基材、印刷线路板以及印刷线路板的制造方法
CN105405490A (zh) * 2015-12-23 2016-03-16 东洋油墨Sc控股株式会社 激光加工用导电性糊、导电性片材、信号布线的制造方法及电子设备
EP3530706B1 (en) 2018-02-27 2022-12-07 Fundación I + D Automoción y Mecatrónica Method for producing a conductive ink for offset printing and conductive ink thus produced

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3226256A (en) 1963-01-02 1965-12-28 Jr Frederick W Schneble Method of making printed circuits
DE2728465C2 (de) 1977-06-24 1982-04-22 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Gedruckte Schaltung
CA1326720C (en) 1987-12-31 1994-02-01 Michael John Modic Impact resistant blends of polar thermoplastic polymers and modified block copolymers
US5158645A (en) 1991-09-03 1992-10-27 International Business Machines, Inc. Method of external circuitization of a circuit panel
US5509557A (en) * 1994-01-24 1996-04-23 International Business Machines Corporation Depositing a conductive metal onto a substrate
JP2000511702A (ja) * 1996-06-12 2000-09-05 ブルーネル ユニバーシティ 電気回路

Also Published As

Publication number Publication date
CN1335045A (zh) 2002-02-06
WO2000033625A1 (en) 2000-06-08
CA2350506A1 (en) 2000-06-08
CN1242659C (zh) 2006-02-15
EP1142456A1 (en) 2001-10-10
AU1574600A (en) 2000-06-19
IL143440A0 (en) 2002-04-21
AU762686B2 (en) 2003-07-03
JP2002531961A (ja) 2002-09-24

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