HK103693A - Integrated circuit with an electroconductive flat element - Google Patents
Integrated circuit with an electroconductive flat elementInfo
- Publication number
- HK103693A HK103693A HK1036/93A HK103693A HK103693A HK 103693 A HK103693 A HK 103693A HK 1036/93 A HK1036/93 A HK 1036/93A HK 103693 A HK103693 A HK 103693A HK 103693 A HK103693 A HK 103693A
- Authority
- HK
- Hong Kong
- Prior art keywords
- conductor runs
- surface element
- substrate
- electrical structures
- integrated circuit
- Prior art date
Links
- 239000004020 conductor Substances 0.000 abstract 9
- 239000000758 substrate Substances 0.000 abstract 4
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Storage Device Security (AREA)
- Non-Volatile Memory (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3537590 | 1985-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HK103693A true HK103693A (en) | 1993-10-08 |
Family
ID=6284190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HK1036/93A HK103693A (en) | 1985-10-22 | 1993-09-30 | Integrated circuit with an electroconductive flat element |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4941034A (xx) |
| EP (1) | EP0221351B1 (xx) |
| JP (1) | JP2520857B2 (xx) |
| KR (1) | KR870004519A (xx) |
| AT (1) | ATE67897T1 (xx) |
| DE (1) | DE3681689D1 (xx) |
| HK (1) | HK103693A (xx) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2617979B1 (fr) * | 1987-07-10 | 1989-11-10 | Thomson Semiconducteurs | Dispositif de detection de la depassivation d'un circuit integre |
| US4933898A (en) * | 1989-01-12 | 1990-06-12 | General Instrument Corporation | Secure integrated circuit chip with conductive shield |
| US5468990A (en) * | 1993-07-22 | 1995-11-21 | National Semiconductor Corp. | Structures for preventing reverse engineering of integrated circuits |
| US5369299A (en) * | 1993-07-22 | 1994-11-29 | National Semiconductor Corporation | Tamper resistant integrated circuit structure |
| WO1996016445A1 (en) * | 1994-11-23 | 1996-05-30 | Motorola Ltd. | Integrated circuit structure with security feature |
| DE19633549C2 (de) * | 1996-08-20 | 2002-07-11 | Infineon Technologies Ag | Integrierte Schaltung mit einer sich zumindest teilweise über einen Sägekanal hinweg erstreckenden Schutzschicht |
| JP2002543621A (ja) | 1999-05-03 | 2002-12-17 | インフィネオン テクノロジース アクチエンゲゼルシャフト | 多次元に積層されたチップステープルを保安するための方法および装置 |
| US6885522B1 (en) * | 1999-05-28 | 2005-04-26 | Fujitsu Limited | Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation |
| DE10120520A1 (de) * | 2001-04-26 | 2002-11-14 | Infineon Technologies Ag | Halbleiterbauelement und Herstellungsverfahren |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3632436A (en) * | 1969-07-11 | 1972-01-04 | Rca Corp | Contact system for semiconductor devices |
| US3681147A (en) * | 1970-01-22 | 1972-08-01 | Ibm | Method for masking semiconductor regions for ion implantation |
| US3714521A (en) * | 1971-07-26 | 1973-01-30 | Rca Corp | Semiconductor device or monolithic integrated circuit with tungsten interconnections |
| JPS5232270A (en) * | 1975-09-05 | 1977-03-11 | Hitachi Ltd | Passivation film formaion by sputtering |
| JPS5562764A (en) * | 1978-11-01 | 1980-05-12 | Mitsubishi Electric Corp | Semiconductor device |
| DE2926874A1 (de) * | 1979-07-03 | 1981-01-22 | Siemens Ag | Verfahren zum herstellen von niederohmigen, diffundierten bereichen bei der silizium-gate-technologie |
| FR2471051A1 (fr) * | 1979-11-30 | 1981-06-12 | Dassault Electronique | Circuit integre a transistors mos protege contre l'analyse et carte comprenant un tel circuit |
| WO1981002222A1 (en) * | 1980-01-21 | 1981-08-06 | Mostek Corp | Composit gate interconnect structure |
| JPS56126969A (en) * | 1980-03-11 | 1981-10-05 | Toshiba Corp | Integrated circuit device |
| JPS57117268A (en) * | 1981-01-14 | 1982-07-21 | Toshiba Corp | Semiconductor device |
| GB2097581A (en) * | 1981-04-24 | 1982-11-03 | Hitachi Ltd | Shielding semiconductor integrated circuit devices from light |
| EP0085117A1 (de) * | 1982-01-28 | 1983-08-10 | Mannesmann Kienzle GmbH | Schaltungsanordnung zur Sicherung von Daten in volatilen Schreib-Lese-Speichern (RAM) |
| JPS59191353A (ja) * | 1983-04-15 | 1984-10-30 | Hitachi Ltd | 多層配線構造を有する電子装置 |
| JPS601846A (ja) * | 1983-06-18 | 1985-01-08 | Toshiba Corp | 多層配線構造の半導体装置とその製造方法 |
| JPS6079748A (ja) * | 1983-10-06 | 1985-05-07 | Sanyo Electric Co Ltd | 半導体集積回路の多層配線構造 |
-
1986
- 1986-10-02 DE DE86113573T patent/DE3681689D1/de not_active Expired - Fee Related
- 1986-10-02 AT AT86113573T patent/ATE67897T1/de not_active IP Right Cessation
- 1986-10-02 EP EP86113573A patent/EP0221351B1/de not_active Expired - Lifetime
- 1986-10-20 JP JP61249406A patent/JP2520857B2/ja not_active Expired - Lifetime
- 1986-10-22 KR KR1019860008830A patent/KR870004519A/ko not_active Application Discontinuation
-
1988
- 1988-07-05 US US07/218,493 patent/US4941034A/en not_active Expired - Fee Related
-
1993
- 1993-09-30 HK HK1036/93A patent/HK103693A/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62101050A (ja) | 1987-05-11 |
| ATE67897T1 (de) | 1991-10-15 |
| EP0221351B1 (de) | 1991-09-25 |
| KR870004519A (ko) | 1987-05-11 |
| JP2520857B2 (ja) | 1996-07-31 |
| DE3681689D1 (en) | 1991-10-31 |
| US4941034A (en) | 1990-07-10 |
| EP0221351A1 (de) | 1987-05-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |