HK1036354A1 - Ic chip, head suspension assembly with the ic chip, manufacturing method of the ic chip and manufacturing method of the head suspension assembly. - Google Patents
Ic chip, head suspension assembly with the ic chip, manufacturing method of the ic chip and manufacturing method of the head suspension assembly.Info
- Publication number
- HK1036354A1 HK1036354A1 HK01106741A HK01106741A HK1036354A1 HK 1036354 A1 HK1036354 A1 HK 1036354A1 HK 01106741 A HK01106741 A HK 01106741A HK 01106741 A HK01106741 A HK 01106741A HK 1036354 A1 HK1036354 A1 HK 1036354A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- chip
- manufacturing
- suspension assembly
- head suspension
- head
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31373899A JP2001134916A (en) | 1999-11-04 | 1999-11-04 | Ic chip, head suspension assembly, and manufacturing method for manufacturing the head suspension assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1036354A1 true HK1036354A1 (en) | 2001-12-28 |
Family
ID=18044942
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK01106741A HK1036354A1 (en) | 1999-11-04 | 2001-09-25 | Ic chip, head suspension assembly with the ic chip, manufacturing method of the ic chip and manufacturing method of the head suspension assembly. |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2001134916A (en) |
CN (1) | CN1188839C (en) |
HK (1) | HK1036354A1 (en) |
SG (1) | SG90178A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3660640B2 (en) | 2001-07-02 | 2005-06-15 | アルプス電気株式会社 | Chip-on-suspension type magnetic head and manufacturing method thereof |
JP2007227965A (en) * | 2007-04-25 | 2007-09-06 | Athlete Fa Kk | Bonding method |
JP2008307710A (en) | 2007-06-12 | 2008-12-25 | Canon Inc | Inkjet recording head, method for manufacturing inkjet recording head and mounting tool for inkjet recording head |
WO2011132648A1 (en) | 2010-04-20 | 2011-10-27 | 日東電工株式会社 | Film for back surface of flip-chip semiconductor, dicing-tape-integrated film for back surface of semiconductor, process for producing semiconductor device, and flip-chip semiconductor device |
JP5681376B2 (en) * | 2010-04-20 | 2015-03-04 | 日東電工株式会社 | Manufacturing method of semiconductor device and flip chip type semiconductor device |
JP5681375B2 (en) * | 2010-04-20 | 2015-03-04 | 日東電工株式会社 | Manufacturing method of semiconductor device and flip chip type semiconductor device |
JP5681377B2 (en) * | 2010-04-20 | 2015-03-04 | 日東電工株式会社 | Manufacturing method of semiconductor device and flip chip type semiconductor device |
JP6379447B2 (en) * | 2013-04-16 | 2018-08-29 | 凸版印刷株式会社 | IC chip mounting method |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0765322A (en) * | 1993-08-27 | 1995-03-10 | Sanyo Electric Co Ltd | Floating type thin film head and its production |
JPH0845017A (en) * | 1994-07-13 | 1996-02-16 | Samsung Electron Co Ltd | Production of magnetic head |
JPH08138223A (en) * | 1994-11-10 | 1996-05-31 | Hitachi Ltd | Production of thin-film magnetic head slider |
US5867888A (en) * | 1996-10-08 | 1999-02-09 | International Business Machines Corporation | Magnetic head/silicon chip integration method |
-
1999
- 1999-11-04 JP JP31373899A patent/JP2001134916A/en not_active Withdrawn
-
2000
- 2000-10-12 SG SG200005851A patent/SG90178A1/en unknown
- 2000-11-03 CN CNB001338153A patent/CN1188839C/en not_active Expired - Fee Related
-
2001
- 2001-09-25 HK HK01106741A patent/HK1036354A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1295319A (en) | 2001-05-16 |
JP2001134916A (en) | 2001-05-18 |
CN1188839C (en) | 2005-02-09 |
SG90178A1 (en) | 2002-07-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20081102 |