GB975827A - A semi-conductor arrangement - Google Patents

A semi-conductor arrangement

Info

Publication number
GB975827A
GB975827A GB1095961A GB1095961A GB975827A GB 975827 A GB975827 A GB 975827A GB 1095961 A GB1095961 A GB 1095961A GB 1095961 A GB1095961 A GB 1095961A GB 975827 A GB975827 A GB 975827A
Authority
GB
United Kingdom
Prior art keywords
soldered
semi
alloyed
electrodes
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1095961A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of GB975827A publication Critical patent/GB975827A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
    • B65B51/10—Applying or generating heat or pressure or combinations thereof
    • B65B51/14—Applying or generating heat or pressure or combinations thereof by reciprocating or oscillating members
    • B65B51/148—Hand-operated members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B67/00—Apparatus or devices facilitating manual packaging operations; Sack holders
    • B65B67/08—Wrapping of articles
    • B65B67/10—Wrapping-tables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Package Closures (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Die Bonding (AREA)

Abstract

975,827. Semi-conductor devices. SIEMENSSCHUCKERTWERKE A.G. March 24, 1961 [March 24, 1960], No. 10959/61. Heading H1K. A semi-conductor device has two electrodes alloyed to opposing surfaces of a semi-conductor body 1, the electrodes being attached to two terminal members which are in turn attached to the inner surface of a hollow insulating body to form a space enclosing the device. The length of the electrical surface leakage path is arbitrarily determined by choice of the dimensions of the insulating body. In one embodiment alloyed electrodes 2, 3 are alloyed or soldered to tungsten, molybdenum or tantalum blocks 4, 5 and a ceramic cylinder 8 is soldered to the latter using a solder containing titanium or zirconium, or by premetallizing the ceramic surface. The resulting enclosure is preferably gas-tight. In another arrangement (Fig. 2, not shown), a small block of tungsten is soldered to each of the alloyed electrodes, a flexible molybdenum disc is soldered to each tungsten block, and a copper block is soldered to each disc, the periphery of each disc being attached to the insulating cylinder to act as a diaphragm. If a P-N junction in the semi-conductor body intersects the outer periphery of the body (Fig. 3), the periphery may be bevelled to prevent both sides of the junction touching the insulating tube. The cylinder may be stepped so as to partially project over the edges of the terminal blocks. The soldering and electrode alloying operations may be carried out in a single step. A plurality of devices may be clamped between bus-bars to form a high-power rectifying circuit (Figs. 4 to 7, not shown), each terminal being first clamped to a finned cooling block, or itself being provided with fins. If desired, a fuse may be connected in series with each device.
GB1095961A 1960-03-24 1961-03-24 A semi-conductor arrangement Expired GB975827A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES0067712 1960-03-24
CA859031 1962-09-28

Publications (1)

Publication Number Publication Date
GB975827A true GB975827A (en) 1964-11-18

Family

ID=25673420

Family Applications (2)

Application Number Title Priority Date Filing Date
GB1095961A Expired GB975827A (en) 1960-03-24 1961-03-24 A semi-conductor arrangement
GB4086062A Expired GB974827A (en) 1960-03-24 1962-10-29 Heat sealing and severing apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB4086062A Expired GB974827A (en) 1960-03-24 1962-10-29 Heat sealing and severing apparatus

Country Status (3)

Country Link
CH (1) CH396215A (en)
DE (1) DE1250562B (en)
GB (2) GB975827A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2004776A1 (en) * 1969-02-03 1970-09-03 Gen Electric Semiconductor component
DE3143335A1 (en) * 1981-10-31 1983-05-11 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Semiconductor device
WO2013030001A1 (en) * 2011-08-26 2013-03-07 Robert Bosch Gmbh Semiconductor component with a heat sink
EP3382753A1 (en) * 2017-03-30 2018-10-03 Siemens Aktiengesellschaft Insulation for a multi-layer electrical circuit and method for producing an insulation

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1614640B1 (en) * 1967-10-26 1971-12-02 Siemens Ag RECTIFIER ARRANGEMENT
GB8801245D0 (en) * 1988-01-20 1988-02-17 Lightfoot G Packaging apparatus & method
US5177931A (en) * 1989-11-20 1993-01-12 Latter Melvin R Modified sealing machine
ITMI20060303A1 (en) * 2006-02-20 2007-08-21 Colibri System Spa MACHINE TO COVER ARTICLES OF VARIOUS TYPE

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2004776A1 (en) * 1969-02-03 1970-09-03 Gen Electric Semiconductor component
DE3143335A1 (en) * 1981-10-31 1983-05-11 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Semiconductor device
WO2013030001A1 (en) * 2011-08-26 2013-03-07 Robert Bosch Gmbh Semiconductor component with a heat sink
EP3382753A1 (en) * 2017-03-30 2018-10-03 Siemens Aktiengesellschaft Insulation for a multi-layer electrical circuit and method for producing an insulation

Also Published As

Publication number Publication date
CH396215A (en) 1965-07-31
GB974827A (en) 1964-11-11
DE1250562B (en)

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