GB1099874A - Semi-conductor devices for high currents - Google Patents

Semi-conductor devices for high currents

Info

Publication number
GB1099874A
GB1099874A GB1597065A GB1597065A GB1099874A GB 1099874 A GB1099874 A GB 1099874A GB 1597065 A GB1597065 A GB 1597065A GB 1597065 A GB1597065 A GB 1597065A GB 1099874 A GB1099874 A GB 1099874A
Authority
GB
United Kingdom
Prior art keywords
lid
flanges
rings
joined
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1597065A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Norden Holding AB
Original Assignee
ASEA AB
Allmanna Svenska Elektriska AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASEA AB, Allmanna Svenska Elektriska AB filed Critical ASEA AB
Publication of GB1099874A publication Critical patent/GB1099874A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)

Abstract

1,099,874. Mounting semi-conductor devices' ALLM€NNA SVENSKA ELEKTRISKA A.B. April 14, 1965 [April 20, 19641, No. 15970/65. Heading H1K. A semi-conductor system comprises a hermetically sealed box comprising bottom, lid and insulating rings therebetween, the bottom and the lid being in contact with a semiconductor device, e.g. transistor, thyristor or diode, a cooling system in contact with the box and wherein the insulating rings have metal flanges attached thereto and joined to each other outside the rings. A thyristor incorporates a PNP silicon disc 1 having an Al layer soldered on the under side thereof and supported on a plate 2 of Mo, and overlayed with an Au-Sb layer 3. The system is hermetically sealed in a box formed by lid 5, bottom 4, rings 6 and 7 and flanges 8 and 9. The lid, bottom and flanges may be made of Cu, Mo, W, Fe/Ni or Fe/Co/Ni whilst the rings may be of porcelain or ceramic, each of the two parts of the box 5, 7 and 9, and 4, 6 and 8 being joined up by silver soldering whilst the flanges may be joined by cold-welding, soldering or high-frequency welding according to the proximity of the semi-conductor system. Cooling bodies 13 and 14, e.g. of Cu or Al are joined to the lid and the bottom by soldering or pressure contacts. Parts of a clamping device, items 19 to 27, for making the pressure contact are shown in the Figure (also Fig. 2, not shown). Electrical connections to the device are made through studs 28 and 29 whilst the gate electrode is connected by conductor 12, flanges 8 and 9 and contact 10.
GB1597065A 1964-04-20 1965-04-14 Semi-conductor devices for high currents Expired GB1099874A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE481564 1964-04-20

Publications (1)

Publication Number Publication Date
GB1099874A true GB1099874A (en) 1968-01-17

Family

ID=20265035

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1597065A Expired GB1099874A (en) 1964-04-20 1965-04-14 Semi-conductor devices for high currents

Country Status (7)

Country Link
BE (1) BE662743A (en)
CH (1) CH431731A (en)
FI (1) FI41178C (en)
FR (1) FR1430747A (en)
GB (1) GB1099874A (en)
NL (1) NL6504892A (en)
NO (1) NO118754B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3151113A1 (en) * 1980-12-24 1982-08-19 Jeumont-Schneider, 92811 Puteaux "ELECTRODES FOR PERFORMANCE SEMICONDUCTOR CELL"

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3457472A (en) * 1966-10-10 1969-07-22 Gen Electric Semiconductor devices adapted for pressure mounting
US3489957A (en) * 1967-09-07 1970-01-13 Power Semiconductors Inc Semiconductor device in a sealed package
DE2049012C3 (en) * 1970-09-30 1979-07-12 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Device for clamping a disk-shaped semiconductor component
KR970000281B1 (en) * 1991-12-30 1997-01-08 엘지전자 주식회사 Refreshing pin of magnetron

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3151113A1 (en) * 1980-12-24 1982-08-19 Jeumont-Schneider, 92811 Puteaux "ELECTRODES FOR PERFORMANCE SEMICONDUCTOR CELL"

Also Published As

Publication number Publication date
CH431731A (en) 1967-03-15
BE662743A (en) 1965-08-17
FI41178B (en) 1969-06-02
NO118754B (en) 1970-02-09
NL6504892A (en) 1965-10-21
FI41178C (en) 1969-09-10
FR1430747A (en) 1966-03-04

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