GB9717631D0 - Semiconductor cooling - Google Patents

Semiconductor cooling

Info

Publication number
GB9717631D0
GB9717631D0 GB9717631A GB9717631A GB9717631D0 GB 9717631 D0 GB9717631 D0 GB 9717631D0 GB 9717631 A GB9717631 A GB 9717631A GB 9717631 A GB9717631 A GB 9717631A GB 9717631 D0 GB9717631 D0 GB 9717631D0
Authority
GB
United Kingdom
Prior art keywords
semiconductor cooling
semiconductor
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9717631A
Other versions
GB2328556A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University College Cardiff Consultants Ltd
Cardiff University
Original Assignee
University College Cardiff Consultants Ltd
Cardiff University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University College Cardiff Consultants Ltd, Cardiff University filed Critical University College Cardiff Consultants Ltd
Priority to GB9717631A priority Critical patent/GB2328556A/en
Publication of GB9717631D0 publication Critical patent/GB9717631D0/en
Publication of GB2328556A publication Critical patent/GB2328556A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB9717631A 1997-08-21 1997-08-21 Thermoelectric cooler for semiconductor devices Withdrawn GB2328556A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9717631A GB2328556A (en) 1997-08-21 1997-08-21 Thermoelectric cooler for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9717631A GB2328556A (en) 1997-08-21 1997-08-21 Thermoelectric cooler for semiconductor devices

Publications (2)

Publication Number Publication Date
GB9717631D0 true GB9717631D0 (en) 1997-10-22
GB2328556A GB2328556A (en) 1999-02-24

Family

ID=10817770

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9717631A Withdrawn GB2328556A (en) 1997-08-21 1997-08-21 Thermoelectric cooler for semiconductor devices

Country Status (1)

Country Link
GB (1) GB2328556A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10009899A1 (en) * 2000-03-01 2001-11-22 Jochen Straehle Integrated active semiconductor component cooling element has coupling coating between cooling element and semiconducting chip consisting of one or more layers of metallisation
CN106062545A (en) * 2014-02-27 2016-10-26 3M创新有限公司 Sub-ambient temperature vapor sensor and method of use

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3935610A1 (en) * 1989-10-26 1991-05-02 Messerschmitt Boelkow Blohm Monolithic semiconductor chip mfd. in micro-mechanical manner - has Peltier element over thin diaphragm, whose cold side lies on substrate island
DE4104327C2 (en) * 1991-02-13 1994-10-13 Fraunhofer Ges Forschung Device for heat dissipation in a chip by means of a cooling point designed as a Peltier element and method for production
US5714791A (en) * 1995-12-22 1998-02-03 International Business Machines Corporation On-chip Peltier cooling devices on a micromachined membrane structure

Also Published As

Publication number Publication date
GB2328556A (en) 1999-02-24

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)