GB9313778D0 - Material for a printed wiring board - Google Patents
Material for a printed wiring boardInfo
- Publication number
- GB9313778D0 GB9313778D0 GB939313778A GB9313778A GB9313778D0 GB 9313778 D0 GB9313778 D0 GB 9313778D0 GB 939313778 A GB939313778 A GB 939313778A GB 9313778 A GB9313778 A GB 9313778A GB 9313778 D0 GB9313778 D0 GB 9313778D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- wiring board
- printed wiring
- printed
- board
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0215—Metallic fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20044592A JPH0621595A (en) | 1992-07-03 | 1992-07-03 | Material for printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
GB9313778D0 true GB9313778D0 (en) | 1993-08-18 |
GB2268630A GB2268630A (en) | 1994-01-12 |
Family
ID=16424422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9313778A Withdrawn GB2268630A (en) | 1992-07-03 | 1993-07-02 | Printed wiring board |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH0621595A (en) |
GB (1) | GB2268630A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1079593A (en) * | 1996-09-05 | 1998-03-24 | Tokin Corp | Magnetic prepreg, its manufacturing method and printed circuit board using it |
DE19802243A1 (en) * | 1998-01-22 | 1999-07-29 | Bosch Gmbh Robert | Multilayer substrate especially a multilayer circuit board with digital circuits |
CN103517559B (en) * | 2012-06-26 | 2016-08-03 | 深南电路有限公司 | The method of processing printed circuit board and printed circuit board (PCB) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2739494B2 (en) * | 1977-08-30 | 1980-10-16 | Fuba, Hans Kolbe & Co, 3202 Bad Salzuflen | Process for manufacturing electrical circuit boards |
FR2524247A1 (en) * | 1982-03-23 | 1983-09-30 | Thomson Csf | METHOD FOR MANUFACTURING PRINTED CIRCUITS WITH INDIVIDUAL CONDUCTIVE RIGID METAL SUPPORT |
US4491622A (en) * | 1982-04-19 | 1985-01-01 | Olin Corporation | Composites of glass-ceramic to metal seals and method of making the same |
GB2124035B (en) * | 1982-07-15 | 1985-07-31 | Standard Telephones Cables Ltd | Printed circuit boards |
SE437207B (en) * | 1983-12-13 | 1985-02-11 | Rolf Dahlberg | SAMPLE CARD WITH BEARING STRAIGHT IN THE FORM OF THERMAL DERIVATIVE METAL PLATE |
JPS60149196A (en) * | 1984-01-17 | 1985-08-06 | ソニー株式会社 | Printed board and method of producing same |
JPS60170287A (en) * | 1984-02-14 | 1985-09-03 | 信越化学工業株式会社 | Copper-lined laminated board |
GB2162694A (en) * | 1984-08-04 | 1986-02-05 | British Aerospace | Printed circuits |
DE3641202A1 (en) * | 1986-12-03 | 1988-06-16 | Standard Elektrik Lorenz Ag | METAL CORE BOARD AS A CARRIER FOR HF AND MICROWAVE CIRCUITS |
GB2240663A (en) * | 1990-01-12 | 1991-08-07 | Mitsubishi Cable Ind Ltd | Metal base wiring board |
-
1992
- 1992-07-03 JP JP20044592A patent/JPH0621595A/en active Pending
-
1993
- 1993-07-02 GB GB9313778A patent/GB2268630A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JPH0621595A (en) | 1994-01-28 |
GB2268630A (en) | 1994-01-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |