GB9204703D0 - Electron beam lithography and a system therefor - Google Patents
Electron beam lithography and a system thereforInfo
- Publication number
- GB9204703D0 GB9204703D0 GB929204703A GB9204703A GB9204703D0 GB 9204703 D0 GB9204703 D0 GB 9204703D0 GB 929204703 A GB929204703 A GB 929204703A GB 9204703 A GB9204703 A GB 9204703A GB 9204703 D0 GB9204703 D0 GB 9204703D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- electron beam
- beam lithography
- system therefor
- therefor
- lithography
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000609 electron-beam lithography Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/7045—Hybrid exposures, i.e. multiple exposures of the same area using different types of exposure apparatus, e.g. combining projection, proximity, direct write, interferometric, UV, x-ray or particle beam
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
- H01J37/3045—Object or beam position registration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/304—Controlling tubes
- H01J2237/30433—System calibration
- H01J2237/30438—Registration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3175—Lithography
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Analytical Chemistry (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Electron Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR920000208 | 1992-01-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
GB9204703D0 true GB9204703D0 (en) | 1992-04-15 |
GB2263335A GB2263335A (en) | 1993-07-21 |
Family
ID=19327690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9204703A Withdrawn GB2263335A (en) | 1992-01-09 | 1992-03-04 | Optically aligned electron beam lithography |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPH05259046A (en) |
GB (1) | GB2263335A (en) |
IT (1) | IT1254518B (en) |
TW (1) | TW208757B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3141732B2 (en) * | 1995-07-05 | 2001-03-05 | 株式会社日立製作所 | Charged particle beam equipment |
JP2000114137A (en) * | 1998-09-30 | 2000-04-21 | Advantest Corp | Electron beam exposure system and aligning method |
FR2792065B1 (en) * | 1999-04-09 | 2001-07-13 | Centre Nat Etd Spatiales | INSTALLATION AND METHOD FOR OBSERVING TWO IDENTICAL SPECIMENS |
JP6195349B2 (en) | 2013-04-26 | 2017-09-13 | キヤノン株式会社 | Drawing apparatus, drawing method, and article manufacturing method |
DE102019128860A1 (en) * | 2019-10-25 | 2020-11-26 | Carl Zeiss Smt Gmbh | Method for measuring a structure and substrate for semiconductor lithography |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1291575A (en) * | 1969-07-03 | 1972-10-04 | Texas Instruments Ltd | Methods and apparatus for the production of semiconductor devices by electron-beam patterning and devices produced thereby |
DE2702448C2 (en) * | 1977-01-20 | 1982-12-16 | Siemens AG, 1000 Berlin und 8000 München | Method for positioning a workpiece provided with a mark relative to a scanning field or to a mask |
US4385838A (en) * | 1980-01-19 | 1983-05-31 | Nippon Kogaku K. K. | Alignment device |
-
1992
- 1992-02-20 TW TW081101268A patent/TW208757B/zh active
- 1992-03-04 GB GB9204703A patent/GB2263335A/en not_active Withdrawn
- 1992-03-06 IT ITMI920530A patent/IT1254518B/en active
- 1992-03-19 JP JP4064085A patent/JPH05259046A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
IT1254518B (en) | 1995-09-25 |
ITMI920530A0 (en) | 1992-03-06 |
ITMI920530A1 (en) | 1993-09-06 |
JPH05259046A (en) | 1993-10-08 |
GB2263335A (en) | 1993-07-21 |
TW208757B (en) | 1993-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |