GB914839A - A semi-conductor arrangement - Google Patents

A semi-conductor arrangement

Info

Publication number
GB914839A
GB914839A GB2287261A GB2287261A GB914839A GB 914839 A GB914839 A GB 914839A GB 2287261 A GB2287261 A GB 2287261A GB 2287261 A GB2287261 A GB 2287261A GB 914839 A GB914839 A GB 914839A
Authority
GB
United Kingdom
Prior art keywords
copper wires
semi
copper
june
molybdenum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2287261A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DES69069A external-priority patent/DE1141029B/en
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of GB914839A publication Critical patent/GB914839A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4922—Bases or plates or solder therefor having a heterogeneous or anisotropic structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Arc-Extinguishing Devices That Are Switches (AREA)
  • Die Bonding (AREA)

Abstract

914,839. Semi-conductor devices. SIEMENS-SCHUCKERTWEBKE A.G. June 23, 1961 [June 23, 1960; Dec. 30, 1960], No. 22872/61. Class 37. A semi-conductor device which, as shown in the drawings, is a rectifier consisting of a silicon plate 2 containing a PN junction supported between molybdenum plates 4, 7 by aluminium and gold layers respectively, is attached to terminal member 14 and copper block 12, by members 10, 11 which are assembled in mosaic fashion from a number of individual non- fixedly connected elements. The molybdenum plates are provided with iron nickel alloy layers 5, 8 and members 10, 11 consist of copper wires 9<SP>1</SP> (Fig. 2) held together by an aluminium or iron-nickel ring. The copper wires are tinned at their ends to permit welding to the molybdenum plate and oxidized at their sides to prevent them sticking together. The connecting device may be made by spinning a tube on to a bundle of copper wire so as to grip them closely and then cutting a section. In an alternative embodiment the copper wires are set in either a yielding resin or one which splits open allowing the individual copper wires to move freely.
GB2287261A 1960-06-23 1961-06-23 A semi-conductor arrangement Expired GB914839A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES69069A DE1141029B (en) 1960-06-23 1960-06-23 Semiconductor device and method for its manufacture
DES71897A DE1153461B (en) 1960-06-23 1960-12-30 Semiconductor device

Publications (1)

Publication Number Publication Date
GB914839A true GB914839A (en) 1963-01-09

Family

ID=25996125

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2287261A Expired GB914839A (en) 1960-06-23 1961-06-23 A semi-conductor arrangement

Country Status (5)

Country Link
BE (1) BE605338A (en)
CH (1) CH390401A (en)
DE (1) DE1153461B (en)
FR (1) FR1296802A (en)
GB (1) GB914839A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2221792A (en) * 1988-08-10 1990-02-14 Marconi Electronic Devices Connections for semiconductor devices
US5262718A (en) * 1985-08-05 1993-11-16 Raychem Limited Anisotropically electrically conductive article
US5631447A (en) * 1988-02-05 1997-05-20 Raychem Limited Uses of uniaxially electrically conductive articles
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4385310A (en) * 1978-03-22 1983-05-24 General Electric Company Structured copper strain buffer
JPS6142430B2 (en) * 1979-03-08 1986-09-20 Gen Electric
DE2936816A1 (en) * 1979-08-17 1981-03-26 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau High current silicon semiconductor cooling system - has wires soldered to metallised islands on surface of silicon disc, extending outwards
SE420964B (en) * 1980-03-27 1981-11-09 Asea Ab COMPOSITION MATERIAL AND SET FOR ITS MANUFACTURING
DE102012200278A1 (en) * 2012-01-11 2013-07-11 Robert Bosch Gmbh Unpackaged power semiconductor e.g. FET for use in circuit carrier, has electrical conductive individual-conductors extending transverse to surface area, where part of each conductor is connected with surface area in end region

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL208617A (en) * 1955-05-10 1900-01-01
US2806187A (en) * 1955-11-08 1957-09-10 Westinghouse Electric Corp Semiconductor rectifier device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5262718A (en) * 1985-08-05 1993-11-16 Raychem Limited Anisotropically electrically conductive article
US5631447A (en) * 1988-02-05 1997-05-20 Raychem Limited Uses of uniaxially electrically conductive articles
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
US5678287A (en) * 1988-02-05 1997-10-21 Raychem Limited Uses of uniaxially electrically conductive articles
GB2221792A (en) * 1988-08-10 1990-02-14 Marconi Electronic Devices Connections for semiconductor devices
GB2221792B (en) * 1988-08-10 1992-02-12 Marconi Electronic Devices Electrical connections for semiconductor devices

Also Published As

Publication number Publication date
DE1153461B (en) 1963-08-29
BE605338A (en) 1961-10-16
FR1296802A (en) 1962-06-22
CH390401A (en) 1965-04-15

Similar Documents

Publication Publication Date Title
GB876133A (en) Improvements in or relating to high power semiconductor rectifiers
GB914839A (en) A semi-conductor arrangement
GB838167A (en) Electrical semiconductor device
GB871307A (en) Transistor with double collector
GB901239A (en) A semi-conductor device
GB970895A (en) Semi-conductor arrangements enclosed in housings
GB1066446A (en) Electrical semiconductor arrangement
GB1064251A (en) Stress-sensing devices
SE307197B (en)
GB965289A (en) Diffused junction type silicon rectifier units
GB959520A (en) Improvements in methods of producing semi-conductor devices
GB903476A (en) Electrical semiconductor device
FR1335381A (en) Nickel based brazing alloy
NL6413575A (en)
GB1017423A (en) Improvements in semiconductor devices
GB879390A (en) Improvements in or relating to semi-conductor devices
JPS5613767A (en) Semiconductor device
JPS572560A (en) High voltage semiconductor device
GB869680A (en) Improvements relating to semi-conductor devices
GB708054A (en) Improvements in or relating to mounting arrangements for devices employing semi-conductor rectifiers
GB912701A (en) Improvements in and relating to electrical semi-conductor device connections
GB1055074A (en) Terminating coil ends with lead-out wires
GB983623A (en) Improvements relating to semi-conductor devices
JPS5687350A (en) Semiconductor device
JPS5366369A (en) Semiconductor device