GB907734A - Method of soldering silicon or silicon alloy - Google Patents

Method of soldering silicon or silicon alloy

Info

Publication number
GB907734A
GB907734A GB1936560A GB1936560A GB907734A GB 907734 A GB907734 A GB 907734A GB 1936560 A GB1936560 A GB 1936560A GB 1936560 A GB1936560 A GB 1936560A GB 907734 A GB907734 A GB 907734A
Authority
GB
United Kingdom
Prior art keywords
silicon
soldering
solder
alloy
silicon alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1936560A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of GB907734A publication Critical patent/GB907734A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/282—Zn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A solder consisting of Al up to 21% and/or Cu up to 18.2%, impurities less than 3.2% and Zn the remainder is used to solder silicon or silicon alloy bodies together or to tin a silicon or silicon alloy body prior to soldering it to another metal using a conventional solder. A second solder consisting of Al up to 17.2% and/or Cu up to 4.6%, Zn 12-41.6%, impurities less than 2.1% and p Sn the remainder may be applied to the tinned body prior to the application of the conventional solder.
GB1936560A 1959-06-06 1960-06-01 Method of soldering silicon or silicon alloy Expired GB907734A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1827659 1959-06-06
JP2360760 1960-05-06

Publications (1)

Publication Number Publication Date
GB907734A true GB907734A (en) 1962-10-10

Family

ID=26354925

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1936560A Expired GB907734A (en) 1959-06-06 1960-06-01 Method of soldering silicon or silicon alloy

Country Status (1)

Country Link
GB (1) GB907734A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138633A (en) * 1983-04-16 1984-10-24 Toshiba Kk Bonding semiconductor chips to a lead frame
GB2289056A (en) * 1994-04-26 1995-11-08 Johnson Matthey Plc Methods and materials for brazing aluminium
CN103302417A (en) * 2013-06-03 2013-09-18 北京科技大学 Zn-Al-Cu based brazing filler metal and preparation method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138633A (en) * 1983-04-16 1984-10-24 Toshiba Kk Bonding semiconductor chips to a lead frame
GB2289056A (en) * 1994-04-26 1995-11-08 Johnson Matthey Plc Methods and materials for brazing aluminium
CN103302417A (en) * 2013-06-03 2013-09-18 北京科技大学 Zn-Al-Cu based brazing filler metal and preparation method thereof
CN103302417B (en) * 2013-06-03 2015-08-26 北京科技大学 Zn-Al-Cu based brazing filler metal and preparation method thereof

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