GB864121A - Improvements in or relating to semi-conductor devices - Google Patents

Improvements in or relating to semi-conductor devices

Info

Publication number
GB864121A
GB864121A GB3678260A GB3678260A GB864121A GB 864121 A GB864121 A GB 864121A GB 3678260 A GB3678260 A GB 3678260A GB 3678260 A GB3678260 A GB 3678260A GB 864121 A GB864121 A GB 864121A
Authority
GB
United Kingdom
Prior art keywords
electrode
foil
gold
disc
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3678260A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of GB864121A publication Critical patent/GB864121A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Bipolar Transistors (AREA)
  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

864,121. Semi-conductor devices. SIEMENSSCHUCKERTWERKE A.G. April 25, 1957 [April 26, 1956], No. 36782/60. Divided out of 864,120. Class 37. A semi-conductor device comprises a monocrystalline semi-conductor wafer with a first electrode and an associated PN junction extending over the whole of one face and the edges and a smaller electrode on the other face. A rectifier of this type, Fig. 1, comprises base electrode 3, of aluminium foil, P-type silicon disc 2, a gold antimony junction forming electrode foil 4 and a supporting member 5. The parts are assembled and heated to alloy the electrodes to the disc and to member 5. Alternatively member 5, the coefficient of expansion of which is preferably matched to that of the disc, is subsequently soldered to electrode 4. The member may be provided with coolant channels or cooling fins or attached to a massive copper block. If the disc is thin enough and the gold foil extends beyond its edges the gold creeps up the edges during alloying automatically. If not, a thin annular gold-antimony foil is placed on the periphery of the upper surface and joins with the main foil during alloying. A transistor, Fig. 2, comprising concentric circular and annular base electrodes 3a, 3b, annular emitter 6, and collector electrode 4, is formed by a similar process. The subject-matter of this Application is divided out of Specification 864,120.
GB3678260A 1956-04-26 1957-04-25 Improvements in or relating to semi-conductor devices Expired GB864121A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES48482A DE1046782B (en) 1956-04-26 1956-04-26 Semiconductor arrangement with a disk-shaped, essentially monocrystalline semiconductor base

Publications (1)

Publication Number Publication Date
GB864121A true GB864121A (en) 1961-03-29

Family

ID=7486876

Family Applications (2)

Application Number Title Priority Date Filing Date
GB1329357A Expired GB864120A (en) 1956-04-26 1957-04-25 Improvements in or relating to semi-conductor devices
GB3678260A Expired GB864121A (en) 1956-04-26 1957-04-25 Improvements in or relating to semi-conductor devices

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB1329357A Expired GB864120A (en) 1956-04-26 1957-04-25 Improvements in or relating to semi-conductor devices

Country Status (6)

Country Link
CH (1) CH352410A (en)
DE (1) DE1046782B (en)
FR (1) FR1173654A (en)
GB (2) GB864120A (en)
NL (2) NL6401835A (en)
SE (1) SE308930B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2221344B (en) * 1988-07-01 1992-12-23 Mitsubishi Electric Corp Semiconductor device and production method therefor

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1105522B (en) * 1958-11-12 1961-04-27 Licentia Gmbh Transistor with a disk-shaped semiconductor body
US3063879A (en) * 1959-02-26 1962-11-13 Westinghouse Electric Corp Configuration for semiconductor devices
DE2412924C3 (en) * 1974-03-18 1981-09-17 Kausov, Sergej Fedorovič, Moskva Method of manufacturing a semiconductor diode

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL180221B (en) * 1952-07-29 Charbonnages Ste Chimique PROCESS FOR PREPARING A POLYAMINOAMIDE HARDENING AGENT FOR EPOXY RESINS; PROCESS FOR PREPARING A WATER DIVIDED HARDENING AGENT; PROCESS FOR PREPARING AN EPOXY RESIN COMPOSITION CONTAINING SUCH HARDENING AGENT AND AN OBJECT FACING A COATING LAYER OBTAINED FROM SUCH EPOXY RESIN COMPOSITION.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2221344B (en) * 1988-07-01 1992-12-23 Mitsubishi Electric Corp Semiconductor device and production method therefor
US5324981A (en) * 1988-07-01 1994-06-28 Mitsubishi Denki Kabushiki Kaisha Field effect transistor device with contact in groove
US5434094A (en) * 1988-07-01 1995-07-18 Mitsubishi Denki Kabushiki Kaisha Method of producing a field effect transistor

Also Published As

Publication number Publication date
CH352410A (en) 1961-02-28
NL6401835A (en) 1966-09-26
GB864120A (en) 1961-03-29
NL216645A (en)
DE1046782B (en) 1958-12-18
SE308930B (en) 1969-03-03
FR1173654A (en) 1959-02-27

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