GB821841A - Method of manufacturing electrical circuit components - Google Patents

Method of manufacturing electrical circuit components

Info

Publication number
GB821841A
GB821841A GB1725/56A GB172556A GB821841A GB 821841 A GB821841 A GB 821841A GB 1725/56 A GB1725/56 A GB 1725/56A GB 172556 A GB172556 A GB 172556A GB 821841 A GB821841 A GB 821841A
Authority
GB
United Kingdom
Prior art keywords
foil
portions
base
grooves
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1725/56A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ROBERT JAMES MALCOLM
Original Assignee
ROBERT JAMES MALCOLM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ROBERT JAMES MALCOLM filed Critical ROBERT JAMES MALCOLM
Publication of GB821841A publication Critical patent/GB821841A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

821,841. Printed circuits. MALCOLM, R. J. Jan. 18, 1956 [Jan. 18, 1955], No. 1725/56. Class 37. A printed circuit is made by moulding an insulating base 10 with a plurality of grooves 121 and holes 15 corresponding to the location of the connectors and terminals of the circuit to be formed, covering the base with metal foil 19 having a reactivatable adhesive coating 20 on its underside, pressing the foil against the base using a flexible sheet 21 so that portions of the foil are forced into the grooves and sheared from the portions 19b which are then removed, and reactivating the adhesive to bond the foil in the grooves. The holes 15 may be surrounded by indentations 15c in which foil portions 19c are bonded, the portions 19a being forced through the holes 15 and sheared against the edges 15a, 15b. The unrequired portions 19a, 19b of the foil may be removed by brushing or blowing, and the base may then be immersed in a solvent for the adhesive 20 to form a bond between the base and the foil in the grooves and indentations. Alternatively the adhesive may be reactivated by heat. Components and external connections may be secured to the circuit by dip-soldering.
GB1725/56A 1955-01-18 1956-01-18 Method of manufacturing electrical circuit components Expired GB821841A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US821841XA 1955-01-18 1955-01-18

Publications (1)

Publication Number Publication Date
GB821841A true GB821841A (en) 1959-10-14

Family

ID=22169573

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1725/56A Expired GB821841A (en) 1955-01-18 1956-01-18 Method of manufacturing electrical circuit components

Country Status (1)

Country Link
GB (1) GB821841A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1515382B1 (en) * 1961-03-03 1969-10-23 Electrolux Process for the production of electrical components
GB2126428A (en) * 1982-09-03 1984-03-21 Fluke Mfg Co Inc Molded circuit board and manufacturing method therefor
EP0271164A2 (en) * 1986-12-09 1988-06-15 Philips Patentverwaltung GmbH Tool for manufacturing a circuit pattern of an electrical circuit board by cutting of a copper plate and the circuit pattern of an electric circuit board which is suitable for work with the tool

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1515382B1 (en) * 1961-03-03 1969-10-23 Electrolux Process for the production of electrical components
GB2126428A (en) * 1982-09-03 1984-03-21 Fluke Mfg Co Inc Molded circuit board and manufacturing method therefor
US4604799A (en) * 1982-09-03 1986-08-12 John Fluke Mfg. Co., Inc. Method of making molded circuit board
EP0271164A2 (en) * 1986-12-09 1988-06-15 Philips Patentverwaltung GmbH Tool for manufacturing a circuit pattern of an electrical circuit board by cutting of a copper plate and the circuit pattern of an electric circuit board which is suitable for work with the tool
EP0271164A3 (en) * 1986-12-09 1989-02-08 Philips Patentverwaltung Gmbh Tool for manufacturing a circuit pattern of an electrical circuit board by cutting of a copper plate and the circuit pattern of an electric circuit board which is suitable for work with the tool

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