GB733248A - Copper coating for ceramics - Google Patents

Copper coating for ceramics

Info

Publication number
GB733248A
GB733248A GB6952/53A GB695253A GB733248A GB 733248 A GB733248 A GB 733248A GB 6952/53 A GB6952/53 A GB 6952/53A GB 695253 A GB695253 A GB 695253A GB 733248 A GB733248 A GB 733248A
Authority
GB
United Kingdom
Prior art keywords
copper
inert gas
copper acetylacetonate
heat exchanger
vapour
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6952/53A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Erie Resistor Corp
Original Assignee
Erie Resistor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Erie Resistor Corp filed Critical Erie Resistor Corp
Publication of GB733248A publication Critical patent/GB733248A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

733,248. Coating with copper. ERIE RESISTOR CORPORATION. March 13, 1953 [March 27, 1952], No. 6952/53. Class 82 (2). Adherent, oxide-free, copper coatings are formed on titanate ceramic dielectrics by mixing an inert gas with copper acetylacetonate vapour at a temperature below the decomposition temperature of the latter, heating the ceramic surface to a temperature above such decomposition temperature, freeing the ceramic surface of adsorbed oxygen, and flowing the gas-vapour mixture into contact with the oxygen-free ceramic surface. Nitrogen, carbon dioxide, argon or other inert gas is fed from a chamber 5, Fig. 4, through a pressure regulator 6 and a heat exchange coil 7 to a mixing vessel 8 filled with crystals 9 of copper acetylacetonate. The heat exchanger 7 and vessel 8 are immersed in an oil bath 10 having a thermostatically controlled heater 11; the bath temperature may be 325-425‹ F. The inert gas carrying copper acetylacetonate vapour then passes through a heat exchanger 13a into a chamber 13 having a metal platen 14 carrying one or more ceramic discs 1; the heat exchanger 13a may be at 444‹ F. and the platen 14 may be heated to 750-850‹ F. by means of the induction coil 15 controlled by the thermo-couple 17 or by resistance heating. A trap 21 serves to condense unused copper acetylacetonate. Before passing copper acetylacetonate vapours over the discs 1, oxygen is removed from the latter by flushing with inert gas, the conduit 18 being provided to by-pass the vessel 8 for this purpose.
GB6952/53A 1952-03-27 1953-03-13 Copper coating for ceramics Expired GB733248A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US733248XA 1952-03-27 1952-03-27

Publications (1)

Publication Number Publication Date
GB733248A true GB733248A (en) 1955-07-06

Family

ID=22113066

Family Applications (1)

Application Number Title Priority Date Filing Date
GB6952/53A Expired GB733248A (en) 1952-03-27 1953-03-13 Copper coating for ceramics

Country Status (1)

Country Link
GB (1) GB733248A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1035872B (en) * 1955-12-31 1958-08-07 Siemens Ag Process for coating objects made of glass or ceramic with a solderable metal coating
DE1036481B (en) * 1955-12-30 1958-08-14 Ohio Commw Eng Co Method and device for the production of a metal coating on glass raw threads
DE1221520B (en) * 1955-07-07 1966-07-21 Union Carbide Corp Method and device for gas plating by means of a plating gas mixture obtained from a carrier gas generated by evaporation of a metal compound and a carrier gas heated to its vapor temperature
US3316518A (en) * 1962-02-02 1967-04-25 Siemens Ag Ceramic resistor contacted barrier-free with noble metal

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1221520B (en) * 1955-07-07 1966-07-21 Union Carbide Corp Method and device for gas plating by means of a plating gas mixture obtained from a carrier gas generated by evaporation of a metal compound and a carrier gas heated to its vapor temperature
DE1036481B (en) * 1955-12-30 1958-08-14 Ohio Commw Eng Co Method and device for the production of a metal coating on glass raw threads
DE1035872B (en) * 1955-12-31 1958-08-07 Siemens Ag Process for coating objects made of glass or ceramic with a solderable metal coating
US3316518A (en) * 1962-02-02 1967-04-25 Siemens Ag Ceramic resistor contacted barrier-free with noble metal

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