GB688461A - Improvements in or relating to the manufacture of electric circuits - Google Patents

Improvements in or relating to the manufacture of electric circuits

Info

Publication number
GB688461A
GB688461A GB22192/48A GB2219248A GB688461A GB 688461 A GB688461 A GB 688461A GB 22192/48 A GB22192/48 A GB 22192/48A GB 2219248 A GB2219248 A GB 2219248A GB 688461 A GB688461 A GB 688461A
Authority
GB
United Kingdom
Prior art keywords
mesh
moulding
circuit
severed
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB22192/48A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Erie Resistor Corp
Original Assignee
Erie Resistor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Erie Resistor Corp filed Critical Erie Resistor Corp
Publication of GB688461A publication Critical patent/GB688461A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

688,461. Printed circuits. ERIE RESISTOR CORPORATION. Aug. 23, 1948 [Sept. 23, 1947], No. 22192/48. Class 36. An electric circuit is made by positioning previously manufactured circuit components on a metal mesh which forms the circuit interconnections and has provision for receiving and holding the components, and moulding plastic around the whole. The mesh may include portions which make unwanted connections, but which hold the mesh together during handling, and these portions may be severed either before or after moulding. In this manner a number of different circuits may be made from the same basic mesh. Fig. 1 shows a mesh 1 having buses 3, 7, terminals 4a-c and 8a-e, leads 5a-e and 9a-e terminating in clips, and additional connections 11a, b. To make the circuit shown in Fig. 3, resistors and condensers 12a-e are inserted in the clips, and plastic moulded around the circuit. Leads 9b, d and bus sections 3b, c are severed before moulding, and after moulding the unwanted terminals 4b-d and 8b-e are broken off. Alternatively, the plastic is moulded so that the mesh is exposed at various points, and the unwanted connections may be severed at those points after moulding. A mesh may be arranged to include valve sockets of the type described in Specification 688,530. The mesh may either be a sheet metal stamping or a metallised coating applied to a sheet of insulating material.
GB22192/48A 1947-09-23 1948-08-23 Improvements in or relating to the manufacture of electric circuits Expired GB688461A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US688461XA 1947-09-23 1947-09-23

Publications (1)

Publication Number Publication Date
GB688461A true GB688461A (en) 1953-03-11

Family

ID=22085087

Family Applications (1)

Application Number Title Priority Date Filing Date
GB22192/48A Expired GB688461A (en) 1947-09-23 1948-08-23 Improvements in or relating to the manufacture of electric circuits

Country Status (1)

Country Link
GB (1) GB688461A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3040213A (en) * 1956-11-15 1962-06-19 Corning Glass Works Composite glaceramic articles and method of making
EP2237649A2 (en) * 2009-03-30 2010-10-06 Phoenix Contact GmbH & Co. KG Filter, in particular for filtering electromagnetic interference
WO2018006894A1 (en) * 2016-07-04 2018-01-11 Kiekert Ag Method for producing an electric component carrier for automobile applications

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3040213A (en) * 1956-11-15 1962-06-19 Corning Glass Works Composite glaceramic articles and method of making
EP2237649A2 (en) * 2009-03-30 2010-10-06 Phoenix Contact GmbH & Co. KG Filter, in particular for filtering electromagnetic interference
WO2018006894A1 (en) * 2016-07-04 2018-01-11 Kiekert Ag Method for producing an electric component carrier for automobile applications
CN109417853A (en) * 2016-07-04 2019-03-01 开开特股份公司 For manufacturing the method for being used for the electrical components carrier of automobile application
CN109417853B (en) * 2016-07-04 2022-05-31 开开特股份公司 Method for producing an electrical component carrier for automotive applications

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