GB555844A - Improvements in soft solders and in the production of same - Google Patents
Improvements in soft solders and in the production of sameInfo
- Publication number
- GB555844A GB555844A GB467342A GB467342A GB555844A GB 555844 A GB555844 A GB 555844A GB 467342 A GB467342 A GB 467342A GB 467342 A GB467342 A GB 467342A GB 555844 A GB555844 A GB 555844A
- Authority
- GB
- United Kingdom
- Prior art keywords
- per cent
- tin
- lead
- silver
- eutectic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
555,844. Solders. BRITISH NON-FERROUS METALS RESEARCH ASSOCIATION, and GUETERBOCK, P. G. J. April 9, 1942, No. 4673. [Class 82 (i)] Soft solders consist of lead, 11-62 per cent. of tin, and silver in an amount from 0.2 per cent. up to 1.75 per cent. for a tin content of 11-32 per cent., diminishing to a maximum of 1.3 per cent. for the maximum tin content; or of lead, 11-55 per cent. of tin, silver as above, and antimony in an amount from 0.25 per cent. up to 0.4 per cent. for the minimum tin content increasing to from 1.4 per cent. up to 1.8 per cent. for a tin content of 32 per cent. and over. The solders may be made by adding to a tin-leadsilver eutectic or to a tin-lead-antimony-silver eutectic one or more of the following: lead, a lead-silver eutectic, and a lead-silver-tin eutectic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB467342A GB555844A (en) | 1942-04-09 | 1942-04-09 | Improvements in soft solders and in the production of same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB467342A GB555844A (en) | 1942-04-09 | 1942-04-09 | Improvements in soft solders and in the production of same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB555844A true GB555844A (en) | 1943-09-09 |
Family
ID=9781615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB467342A Expired GB555844A (en) | 1942-04-09 | 1942-04-09 | Improvements in soft solders and in the production of same |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB555844A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0507718A1 (en) * | 1991-04-04 | 1992-10-07 | International Business Machines Corporation | Low lead content Pb-Sn-Ag-Sb solder alloy useful in an interconnect metallization structure |
-
1942
- 1942-04-09 GB GB467342A patent/GB555844A/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0507718A1 (en) * | 1991-04-04 | 1992-10-07 | International Business Machines Corporation | Low lead content Pb-Sn-Ag-Sb solder alloy useful in an interconnect metallization structure |
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