GB2452121A - Packaging structure of a light emitting diode - Google Patents
Packaging structure of a light emitting diode Download PDFInfo
- Publication number
- GB2452121A GB2452121A GB0812350A GB0812350A GB2452121A GB 2452121 A GB2452121 A GB 2452121A GB 0812350 A GB0812350 A GB 0812350A GB 0812350 A GB0812350 A GB 0812350A GB 2452121 A GB2452121 A GB 2452121A
- Authority
- GB
- United Kingdom
- Prior art keywords
- chip
- light emitting
- emitting diode
- packaging structure
- mold tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 50
- 238000000605 extraction Methods 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 3
- 239000011347 resin Substances 0.000 claims abstract description 3
- 239000003292 glue Substances 0.000 claims description 17
- 238000012545 processing Methods 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 230000001788 irregular Effects 0.000 claims 1
- 239000012780 transparent material Substances 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000005286 illumination Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
A light emitting diode chip 1 is mounted on the surface of a circuit board 2 which has on the surface both a region for mounting the chip 21, and conductors 22 for connecting to the chip via lead wires 12. A hollow mold (fig 1; 3) is placed over the LED chip, and transparent material such as resin is injected into the mold under vacuum extraction to encapsulate the chip, after which the mold is removed. The transparent material solidifies to form a packaging layer 4. The mold can be semicircular in shape, or trapezoidal in cross-section, and can be faceted to form a microlens or pavilion cut shape. Because the LED chip is not recessed in the circuit board, emitted light is not obstructed by recess walls or other parts of the circuit board, allowing a light extraction angle of about 180{
Description
PACKAGING STRUCTURE OF A LIGHT EMITTING DIODE
BACKGROUND OF THE INVENTION
(a) Field of the Invention
The present invention relates to a packaging structure of a light emitting diode, and more particularly to a packaging structure of a light emitting diode, wherein a circuit board is provided with a co- planar chip-embedded region and conducting parts, allowing a chip to be embedded on a surface of the chip-embedded region. In addition, an exterior of the chip is provided with a packaging layer which is formed when a processing operation is performed with a mold tool, followed by removing the mold tool, so as to achieve a large light extraction angle of about 1800. Furthermore, due to an optical processing on an inner wall of an emplacement space, a light extraction efficiency of the packaging layer is improved, and at a same time, applicability in illumination devices is increased.
(b) Description of the Prior Art
As rapid development of modern technologies, the light emitting diode has been generally used in every corner of society, and its application is more versatile. From an indication light in the beginning, to an outdoor bulletin board, a flash light and a third break lamp, and then to a traffic sign and a backlit module, the light emitting diode has been gradually fused into a daily life and is very tightly connected to human lives.
However, following ripple of the society, the energy issue is even more focused on by every party. As shortage of all kinds of resources, such as that the continuous rise of oil price will directly or indirectly affect all kinds of products in the daily life, along with the utility charge.
Therefore, how to save energy and find a more efficient light emitting method is the issue that is indispensable and should be emphasized in the modern society, and the light emitting diode is the top choice among the solutions. In addition to having a long lifetime of usage, saving energy, having a quick reaction rate, being environmental friendly, being explosion-proof and very safe, the light emitting diode is also provided with an advantage that it can be used in all kinds of conditions.
Accordingly, the light emitting diode is considered as the best approach to implement energy saving and reducing energy consumption.
Nevertheless, as the light emitting diode has been broadly used in every party, the chip packaging, the improvement of material technology and the continuous increase to the brightness of light emitting diode have also become the directions of research by the industry. Referring to FIG. 8, it shows a side cutaway view of a conventional packaging method for a light emitting diode, wherein the packaging method of the light emitting diode is constituted by a chip A, a circuit board B and a package C. The chip A can be placed in a cavity space 81 provided by the circuit board B or in a frame surrounding the chip A. The chip A is also provided with lead wires Al to connect to conducting parts B2 provided by the cavity space BI of the circuit board B. In addition, glue can be directly applied inside the cavity space Bi or the frame and outside the chip A, to form the package C which encloses the chip A and the cavity space BI or the frame; whereas, the package C can achieve the effect of packaging the light emitting diode.
However, when practically applying the conventional packaging method for the light emitting diode, as described above, a lot of shortcomings still exist to be improved: 1. The chip A is placed in the cavity space BI of the circuit board B or in the frame, and the package C is formed to enclose the chip A and the cavity space Bi or the frame, by directly using the glue. However, when electric current passes through the chip A and the chip A emits light, the light extraction of the chip A will be 4 -affected by a wall angle of the cavity space Bi or the frame that a good light emitting effect cannot be achieved.
2. The packaging method for the light emitting diode directly uses the glue to form the package C which encloses the chip A and the cavity space BI or the frame, and the surface of the package C is a smooth and ordered profile. To further increase the light emitting effect, an exterior of the package C can be added with another optical lens. However, production cost and labor hours of manufacturing will be increased.
Accordingly, how to solve the aforementioned problems and shortcomings of the conventional packaging method for the light emitting diode is a technological issue of research and development for improvement by the present inventor and related vendors.
SUMMARY OF THE INVENTION
The primary object of the present invention is to provide a packaging structure of a light emitting diode, wherein a circuit board is provided with a co-planar chip-embedded region and conducting parts, a chip is embedded on a surface of the chip-embedded region, and a mold tool is directly placed at an exterior of the chip. After covering with the mold tool, a vacuum operation and a glue injection operation are conducted with an air extraction hole and a through-hole of the mold tool, so as to form a packaging layer when the mold tool is removed following performing a processing operation with the mold tool. Accordingly, a large light extraction angle of about 1800 and an effect of light extraction without being blocked by a dead angle can be achieved.
Another object of the present invention is provided a packaging structure of a light emitting diode, wherein the mold tool can be a full-mask design, and an optical processing can be conducted on an inner wall of an emplacement space inside the mold tool to form an effect like a micro lens or a pavilion facet, after using the internal emplacement space to cover the chip. In addition, a light extraction efficiency of the packaging layer can be improved, and at a same time, applicability in illumination devices can be increased.
To enable a further understanding of the said objectives and the technological methods of the invention herein, the brief description of the drawings below is followed by the detailed description of the preferred embodiments.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. I shows a side cutaway view of the present invention.
FIG. 2 shows a side cutaway view prior to using the present invention.
FIG. 3 shows a side cutaway view of the present invention in use.
FIG. 4 shows a side cutaway view of the present invention after being used.
FIG. 5 shows a side cutaway view of a preferred embodiment of the present invention in use.
FIG. 6 shows a side cutaway view of a preferred embodiment of the present invention after being used.
FIG. 7 shows a side cutaway view of another preferred embodiment of the present invention.
FIG. 8 shows a side cutaway view of a conventional packaging method for a light emitting diode.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring to FIGS. 1 to 3, it shows a side cutaway view of, a side cutaway view before use of and a side cutaway view in use of the present invention. A packaging structure of a light emitting diode comprises a chip I, a circuit board 2 and a mold tool 3, wherein the chip I is embedded on a chip-embedded region 21 provided on a surface of the circuit board 2, and is then electrically connected to conducting parts 22 of the circuit board 2 using lead wires 12 of the chip 1; an interior of the mold tool 3 is provided with an emplacement space 31 which can be -7.
in a trapezoidal shape or a semi-circular shape, the mold tool 3 can be directly covered on top of the circuit board 2, the emplacement space 31 inside the mold tool 3 can emplace the chip 1 and the lead wires 12 on the circuit board 2, and the mold tool 3 is provided with an air extraction hole 32 to perform a vacuum operation, as well as a through-hole 33 which is connected with outside to inject glue. When the mold tool 3 is covered on the circuit board 2, air inside the emplacement space 31 of the mold tool 3 can be extracted out first by using the air extraction hole 32 of the mold tool 3, so as to form a vacuum state. Next, the glue is injected into the emplacement space 31 of the mold tool 3 using the through-hole 33 of the mold tool 3, allowing the glue to fill the emplacement space 31 without resulting in air bubbles. In addition, a packaging layer 4, which is formed when a processing operation is performed with the mold tool 3 followed by removing the mold tool 3, can is be in a trapezoidal shape or a semi-circular shape.
Referring to FIGS. 1, 3 and 4, it shows a side cutaway view of, a side cutaway view in use of and a side cutaway view after use of the present invention. The circuit board 2 is provided with the co-planar chip-embedded region 21 and the conducting parts 22, allowing the chip 1 to be embedded on the surface of the chip-embedded region 21 without requiring other grooves or frames. Furthermore, an exterior of the chip I can be covered with the full-mask mold tool 3 and emplaced on the circuit board 2. When the glue is injected into and fills the emplacement space 31 of the mold tool 3, with the injected glue being a light pervious plastic material such as resin, plastic, silicon or epoxy resin, the full-mask mold tool 3 is removed from the top of circuit board 2 after the glue has been solidified, thereby forming the trapezoidal packaging layer 4. The packaging layer 4 encloses the chip I and the lead wires 12, allowing the conducting parts 22 of the circuit board 2 to energize the chip I through the lead wires 12, such that the chip 1 can emit light. As the exterior part of the chip I is not blocked by frames, walls or other objects, wide illumination can be achieved and a large light extraction angle of about 180° can be available.
Referring to FIG. 5 and FIG. 6, it shows a side cutaway view in use of and a side cutaway view after use of a preferred embodiment of the present invention. The interior of the mold tool 3 is provided with the emplacement space 31, and an inner waIl 311 of the emplacement space 31 is provided with a lens facet formed by an optical processing; or, the inner waIl 311 can be provided with a pavilion facet formed by the optical processing. In a same time, the vacuum operation and the glue injection operation when the emplacement space 31 has been vacuumized are performed using the air extraction hole 32 and the through-hole 33 of the mold tool 3. The packaging layer 4 is then formed when the glue has been solidified after filling the emplacement space 31.
Next, the mold tool 3 is removed from the top of packaging layer 4, and the packaging layer 4 in a shape of pavilion facet will be formed.
Furthermore, a light extraction efficiency of the packaging layer 4 can be improved and applicability in illumination devices can be increased due to light refraction from an angle of the pavilion facet.
Referring to FIG. 7, it shows a side cutaway view of another preferred embodiment of the present invention. The mold tool 3 is in a hollow shape and is provided with a latch-in part 34 which can be latched into a latch hole 23 provided on the circuit board 2. After latching and fixing, the glue is directly injected in from top of the hollow mold tool 3, and the latch-in part 34 of the mold tool 3 is removed from the latch hole 23 of the circuit board 2 when the glue is solidified, thereby forming the packaging layer 4 at the exterior of the chip 1 and the lead wires 12.
Following advantages are available when the aforementioned packaging structure of a light emission diode is used practically: 1. The circuit board 2 is provided with the co-planar -10-chip-embedded region 21 and the conducting parts 22, the chip I is embedded on the surface of chip-embedded region 21, the exterior of chip I is covered with the emplacement space 31 in the full-mask mold tool 3, and the packaging layer 4 is formed when the processing operation is performed at the exterior of chip 1 with the mold tool 3 followed by removing the mold tool 3.
In addition, when the chip I is energized to illuminate, as there is no other wall angle to block the light extraction of chip 1, the large light extraction angle of about 1800 is available, thereby achieving the good light emitting effect.
2. The mold tool 3 is directly used by the packaging structure of the light emitting diode to form the packaging layer 4 of the light emitting diode, and as on the inner wall 311 of the emplacement space 31 inside the mold tool 3 is provided with the lens facet or the pavilion facet that is formed by the optical processing, the packaging layer 4 formed can be directly provided with the effect of the lens facet or pavilion facet, to expand the range of light projection, improve the light extraction efficiency of the packaging layer, and increase the applicability in illumination devices1 without a need to add another optical lens at the exterior of packaging layer 4, such that the manufacturing cost can be saved.
Accordingly, the present invention provides a packaging structure of a light emitting diode, The packaging structure is produced with a mold tool to improve a light extraction angle to a large angle of about 180°, so that a good light emitting effect is achieved, a light extraction efficiency of packaging layer is improved, applicability in illumination device is increased, manufacturing cost is saved, and brightness of the light emitting diode is augmented.
It is of course to be understood that the embodiments described herein is merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims.
Claims (10)
- What is claimed is: 1. A packaging structure of a light emitting diode, especially that a light emitting diode is packaged by embedding a chip on a circuit board and injecting glue from top of the circuit board, with the circuit board being provided with a chip-embedded region on which the chip is embedded, and the chip being provided with lead wires that are connected to conducting parts; the circuit board being provided with a co-planar chip-embedded region and conducting parts, a chip being embedded on a surface of the chip-embedded region, and a packaging layer being formed at an exterior of the chip when a processing operation is performed, followed by removing the mold tool.
- 2. The packaging structure of a light emitting diode according to claim 1, wherein the packaging layer is in a trapezoidal shape or a semi-circular shape.
- 3. The packaging structure of a light emitting diode according to claim 1, wherein the mold tool is a full-mask type and includes an emplacement space.
- 4. The packaging structure of a light emitting diode according to claim 3, wherein the emplacement space inside the mold tool is in a-trapezoidal shape or a semi-circular shape.
- 5. The packaging structure of a light emitting diode according to claim 1, wherein the mold tool is provided with an air extraction hole to perform a vacuum operation.
- 6. The packaging structure of a light emitting diode according to claim 1, wherein the mold tool is provided with a through-hole which is connected with outside to inject glue.
- 7. The packaging structure of a light emitting diode according to claim 6, wherein the glue is a light pervious plastic material, such as resin, plastic, silicon or epoxy resin.
- 8. The packaging structure of a light emitting diode according to claim 3, wherein a surface of the emplacement space inside the mold tool is performed with an optical processing to form a wall of irregular angles, such as a lens facet or a pavilion facet.
- 9. The packaging structure of a light emitting diode according to claim 1, wherein the mold tool is in a hollow shape and is provided with a latch-in part which is latched into a latch hole of the circuit board.
- 10. Packaging structure of a light emitting diode substantially as herein described above and illustrated in the accompanying drawings of FIG. I to FIG. 7.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96213912U TWM329857U (en) | 2007-08-21 | 2007-08-21 | LED package structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB0812350D0 GB0812350D0 (en) | 2008-08-13 |
| GB2452121A true GB2452121A (en) | 2009-02-25 |
Family
ID=39718048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0812350A Withdrawn GB2452121A (en) | 2007-08-21 | 2008-07-07 | Packaging structure of a light emitting diode |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE202008009435U1 (en) |
| FR (1) | FR2920253B3 (en) |
| GB (1) | GB2452121A (en) |
| TW (1) | TWM329857U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2620990A3 (en) * | 2012-01-27 | 2014-02-26 | Nitto Denko Corporation | Light emitting diode device and method of producing the same |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101630491B1 (en) * | 2009-11-05 | 2016-06-24 | 루미니트 엘엘씨 | Method to provide microstructure for encapsulated high-brightness led chips |
| CN108465613B (en) * | 2018-04-27 | 2024-05-24 | 延锋伟世通汽车电子有限公司 | Circuit board gluing system and method for removing bubbles between circuit board and IC chip |
| CN114347395B (en) * | 2022-03-17 | 2022-06-03 | 威海嘉瑞光电科技股份有限公司 | Method for packaging semiconductor optical device and apparatus used therefor |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0730152A (en) * | 1993-07-09 | 1995-01-31 | Mitsubishi Cable Ind Ltd | Molding method for electronic component mounted on board and board structure for molding |
| JPH08111132A (en) * | 1994-10-12 | 1996-04-30 | Japan Aviation Electron Ind Ltd | Illumination-type keytop |
| JPH08148724A (en) * | 1994-11-21 | 1996-06-07 | Stanley Electric Co Ltd | Chip-mount-type led |
| JP2000049386A (en) * | 1998-07-30 | 2000-02-18 | Stanley Electric Co Ltd | Manufacturing surface-mounting components |
| WO2001045181A1 (en) * | 1999-12-17 | 2001-06-21 | Yoon Sun Kwan | Led lamp having female type leads formed on pcb |
| JP2005039177A (en) * | 2003-06-24 | 2005-02-10 | Stanley Electric Co Ltd | Surface mounting semiconductor electronic part and its manufacturing method |
| US20050045904A1 (en) * | 2003-09-01 | 2005-03-03 | Hsing Chen | Light emitting diode with high heat dissipation |
| US20060034082A1 (en) * | 2004-08-12 | 2006-02-16 | Samsung Electro-Mechanics Co., Ltd. | Multi-lens light emitting diode |
| US20060289885A1 (en) * | 2005-06-24 | 2006-12-28 | Shi-Ming Chen | Light-emitting diode |
-
2007
- 2007-08-21 TW TW96213912U patent/TWM329857U/en not_active IP Right Cessation
-
2008
- 2008-07-07 GB GB0812350A patent/GB2452121A/en not_active Withdrawn
- 2008-07-11 FR FR0803973A patent/FR2920253B3/en not_active Expired - Fee Related
- 2008-07-14 DE DE200820009435 patent/DE202008009435U1/en not_active Expired - Lifetime
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0730152A (en) * | 1993-07-09 | 1995-01-31 | Mitsubishi Cable Ind Ltd | Molding method for electronic component mounted on board and board structure for molding |
| JPH08111132A (en) * | 1994-10-12 | 1996-04-30 | Japan Aviation Electron Ind Ltd | Illumination-type keytop |
| JPH08148724A (en) * | 1994-11-21 | 1996-06-07 | Stanley Electric Co Ltd | Chip-mount-type led |
| JP2000049386A (en) * | 1998-07-30 | 2000-02-18 | Stanley Electric Co Ltd | Manufacturing surface-mounting components |
| WO2001045181A1 (en) * | 1999-12-17 | 2001-06-21 | Yoon Sun Kwan | Led lamp having female type leads formed on pcb |
| JP2005039177A (en) * | 2003-06-24 | 2005-02-10 | Stanley Electric Co Ltd | Surface mounting semiconductor electronic part and its manufacturing method |
| US20050045904A1 (en) * | 2003-09-01 | 2005-03-03 | Hsing Chen | Light emitting diode with high heat dissipation |
| US20060034082A1 (en) * | 2004-08-12 | 2006-02-16 | Samsung Electro-Mechanics Co., Ltd. | Multi-lens light emitting diode |
| US20060289885A1 (en) * | 2005-06-24 | 2006-12-28 | Shi-Ming Chen | Light-emitting diode |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2620990A3 (en) * | 2012-01-27 | 2014-02-26 | Nitto Denko Corporation | Light emitting diode device and method of producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2920253B3 (en) | 2009-07-24 |
| DE202008009435U1 (en) | 2008-09-11 |
| GB0812350D0 (en) | 2008-08-13 |
| FR2920253A3 (en) | 2009-02-27 |
| TWM329857U (en) | 2008-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) |
Free format text: REGISTERED BETWEEN 20101209 AND 20101215 |
|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |