GB2417132B - Method of forming a metal layer over a patterned dielectric by electroless deposition using a catalyst - Google Patents

Method of forming a metal layer over a patterned dielectric by electroless deposition using a catalyst

Info

Publication number
GB2417132B
GB2417132B GB0513698A GB0513698A GB2417132B GB 2417132 B GB2417132 B GB 2417132B GB 0513698 A GB0513698 A GB 0513698A GB 0513698 A GB0513698 A GB 0513698A GB 2417132 B GB2417132 B GB 2417132B
Authority
GB
United Kingdom
Prior art keywords
catalyst
forming
metal layer
layer over
electroless deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB0513698A
Other versions
GB2417132A (en
GB0513698D0 (en
Inventor
Markus Nopper
Axel Preusse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10302644A external-priority patent/DE10302644B3/en
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of GB0513698D0 publication Critical patent/GB0513698D0/en
Publication of GB2417132A publication Critical patent/GB2417132A/en
Application granted granted Critical
Publication of GB2417132B publication Critical patent/GB2417132B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H01L21/76846—Layer combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76853—Barrier, adhesion or liner layers characterized by particular after-treatment steps
    • H01L21/76855—After-treatment introducing at least one additional element into the layer
    • H01L21/76859—After-treatment introducing at least one additional element into the layer by ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
    • H01L21/76873—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroplating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
    • H01L21/76874—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroless plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/10—Applying interconnections to be used for carrying current between separate components within a device
    • H01L2221/1068—Formation and after-treatment of conductors
    • H01L2221/1073—Barrier, adhesion or liner layers
    • H01L2221/1084—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
    • H01L2221/1089—Stacks of seed layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
    • H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB0513698A 2003-01-23 2003-12-22 Method of forming a metal layer over a patterned dielectric by electroless deposition using a catalyst Expired - Lifetime GB2417132B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10302644A DE10302644B3 (en) 2003-01-23 2003-01-23 Process for producing a metal layer over a structured dielectric by means of electroless deposition using a catalyst
US10/602,192 US6951816B2 (en) 2003-01-23 2003-06-24 Method of forming a metal layer over patterned dielectric by electroless deposition using a catalyst
PCT/US2003/041185 WO2004068576A2 (en) 2003-01-23 2003-12-22 Method of forming a catalyst containing layer over a patterned dielectric

Publications (3)

Publication Number Publication Date
GB0513698D0 GB0513698D0 (en) 2005-08-10
GB2417132A GB2417132A (en) 2006-02-15
GB2417132B true GB2417132B (en) 2007-04-04

Family

ID=32826166

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0513698A Expired - Lifetime GB2417132B (en) 2003-01-23 2003-12-22 Method of forming a metal layer over a patterned dielectric by electroless deposition using a catalyst

Country Status (5)

Country Link
JP (1) JP5214092B2 (en)
KR (1) KR101098568B1 (en)
AU (1) AU2003299875A1 (en)
GB (1) GB2417132B (en)
WO (1) WO2004068576A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6943106B1 (en) * 2004-02-20 2005-09-13 Micron Technology, Inc. Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling
JP2006128288A (en) * 2004-10-27 2006-05-18 Tokyo Electron Ltd Film forming method, semiconductor device, manufacturing method thereof, program, and recording medium
CN101578394B (en) 2007-07-31 2011-08-03 日矿金属株式会社 Plated material having metal thin film formed by electroless plating, and method for production thereof
US8395264B2 (en) 2009-01-30 2013-03-12 Jx Nippon Mining & Metals Corporation Substrate comprising alloy film of metal element having barrier function and metal element having catalytic power
TW202117075A (en) * 2019-09-25 2021-05-01 日商東京威力科創股份有限公司 Substrate liquid treatment method and substrate liquid treatment device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5969422A (en) * 1997-05-15 1999-10-19 Advanced Micro Devices, Inc. Plated copper interconnect structure
US6316359B1 (en) * 1998-02-12 2001-11-13 Motorola Inc. Interconnect structure in a semiconductor device and method of formation
US20020050459A1 (en) * 2000-11-02 2002-05-02 Kabushiki Kaisha Toshiba Electronic device manufacturing method
WO2002045155A2 (en) * 2000-11-29 2002-06-06 Intel Corporation ELECTROLESS METHOD OF SEED LAYER DEPOSITION, REPAIR, AND FABRICATION OF Cu INTERCONNECTS
US6461675B2 (en) * 1998-07-10 2002-10-08 Cvc Products, Inc. Method for forming a copper film on a substrate
US6479902B1 (en) * 2000-06-29 2002-11-12 Advanced Micro Devices, Inc. Semiconductor catalytic layer and atomic layer deposition thereof

Family Cites Families (13)

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US4574095A (en) * 1984-11-19 1986-03-04 International Business Machines Corporation Selective deposition of copper
JPH0762545A (en) * 1993-08-30 1995-03-07 Mitsubishi Cable Ind Ltd Wiring board and its production
US6380083B1 (en) * 1998-08-28 2002-04-30 Agere Systems Guardian Corp. Process for semiconductor device fabrication having copper interconnects
JP4049978B2 (en) * 1999-09-15 2008-02-20 三星電子株式会社 Metal wiring formation method using plating
JP2001240960A (en) * 1999-12-21 2001-09-04 Nippon Sheet Glass Co Ltd Article coated with photocatalytic film, method of manufacturing for the article, and sputtering target used for depositing the film
KR100338112B1 (en) * 1999-12-22 2002-05-24 박종섭 Method of forming a copper wiring in a semiconductor device
CN1174118C (en) * 2000-01-07 2004-11-03 株式会社日矿材料 Method for metal plating, pretreating agent, and semiconductor wafer and semiconductor device using same
JP2001335952A (en) * 2000-05-31 2001-12-07 Rikogaku Shinkokai Electroless plating method, wiring device and its production method
JP2002004081A (en) * 2000-06-16 2002-01-09 Learonal Japan Inc Electroplating method to silicon wafer
JP2002025943A (en) * 2000-07-12 2002-01-25 Ebara Corp Substrate film forming method
JP2002053971A (en) * 2000-08-03 2002-02-19 Sony Corp Plating method, plating structure, method for producing semiconductor device, and semiconductor device
EP1180553A1 (en) * 2000-08-15 2002-02-20 Air Products And Chemicals, Inc. CVD process for depositing copper on a barrier layer
US6596344B2 (en) * 2001-03-27 2003-07-22 Sharp Laboratories Of America, Inc. Method of depositing a high-adhesive copper thin film on a metal nitride substrate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5969422A (en) * 1997-05-15 1999-10-19 Advanced Micro Devices, Inc. Plated copper interconnect structure
US6316359B1 (en) * 1998-02-12 2001-11-13 Motorola Inc. Interconnect structure in a semiconductor device and method of formation
US6461675B2 (en) * 1998-07-10 2002-10-08 Cvc Products, Inc. Method for forming a copper film on a substrate
US6479902B1 (en) * 2000-06-29 2002-11-12 Advanced Micro Devices, Inc. Semiconductor catalytic layer and atomic layer deposition thereof
US20020050459A1 (en) * 2000-11-02 2002-05-02 Kabushiki Kaisha Toshiba Electronic device manufacturing method
WO2002045155A2 (en) * 2000-11-29 2002-06-06 Intel Corporation ELECTROLESS METHOD OF SEED LAYER DEPOSITION, REPAIR, AND FABRICATION OF Cu INTERCONNECTS

Also Published As

Publication number Publication date
JP2006513325A (en) 2006-04-20
KR20050088363A (en) 2005-09-05
AU2003299875A1 (en) 2004-08-23
WO2004068576A3 (en) 2004-09-10
WO2004068576A2 (en) 2004-08-12
KR101098568B1 (en) 2011-12-26
GB2417132A (en) 2006-02-15
JP5214092B2 (en) 2013-06-19
GB0513698D0 (en) 2005-08-10

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20231221