GB0325247D0 - Method of forming a conductive metal region on a substrate - Google Patents
Method of forming a conductive metal region on a substrateInfo
- Publication number
- GB0325247D0 GB0325247D0 GB0325247A GB0325247A GB0325247D0 GB 0325247 D0 GB0325247 D0 GB 0325247D0 GB 0325247 A GB0325247 A GB 0325247A GB 0325247 A GB0325247 A GB 0325247A GB 0325247 D0 GB0325247 D0 GB 0325247D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- forming
- conductive metal
- metal region
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Priority Applications (20)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0325247A GB0325247D0 (en) | 2003-10-29 | 2003-10-29 | Method of forming a conductive metal region on a substrate |
KR1020057013814A KR20050097956A (en) | 2003-01-28 | 2004-01-28 | Method of forming a conductive metal region on a substrate |
EP04705844A EP1590500A2 (en) | 2003-01-28 | 2004-01-28 | Method of forming a conductive metal region on a substrate |
GB0401826A GB0401826D0 (en) | 2003-10-29 | 2004-01-28 | The formation of layers on substrates |
JP2006502211A JP2006516818A (en) | 2003-01-28 | 2004-01-28 | Method for producing a conductive metal region on a substrate |
US10/543,311 US20060134318A1 (en) | 2003-01-28 | 2004-01-28 | Method of forming a conductive metal region on a substrate |
PCT/GB2004/000358 WO2004068389A2 (en) | 2003-01-28 | 2004-01-28 | Method of forming a conductive metal region on a substrate |
GB0407303A GB0407303D0 (en) | 2003-10-29 | 2004-03-31 | Electrical connection of components |
PCT/GB2004/004595 WO2005044451A1 (en) | 2003-10-29 | 2004-10-29 | Electrical connection of components |
JP2006537430A JP2007510063A (en) | 2003-10-29 | 2004-10-29 | Formation of layers on the substrate |
EP20040791626 EP1687461A2 (en) | 2003-10-29 | 2004-10-29 | The formation of layers on substrates |
CN 200480037387 CN1914353A (en) | 2003-10-29 | 2004-10-29 | Formation of layers on substrates |
KR1020067010522A KR20060123213A (en) | 2003-10-29 | 2004-10-29 | The formation of layers on substrates |
CN 200480039450 CN100521181C (en) | 2003-10-29 | 2004-10-29 | Method of electrically connecting connection points of elements to related connection points of circuit |
US10/975,499 US20050130397A1 (en) | 2003-10-29 | 2004-10-29 | Formation of layers on substrates |
JP2006537433A JP2007510301A (en) | 2003-10-29 | 2004-10-29 | Electrical connection of parts |
PCT/GB2004/004589 WO2005045095A2 (en) | 2003-10-29 | 2004-10-29 | The formation of layers on substrates |
US10/975,500 US7243421B2 (en) | 2003-10-29 | 2004-10-29 | Electrical connection of components |
KR1020067010084A KR20060126481A (en) | 2003-10-29 | 2004-10-29 | Electrical connection of components |
EP04818166A EP1678761A1 (en) | 2003-10-29 | 2004-10-29 | Electrical connection of components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0325247A GB0325247D0 (en) | 2003-10-29 | 2003-10-29 | Method of forming a conductive metal region on a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
GB0325247D0 true GB0325247D0 (en) | 2003-12-03 |
Family
ID=29725583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0325247A Ceased GB0325247D0 (en) | 2003-01-28 | 2003-10-29 | Method of forming a conductive metal region on a substrate |
Country Status (2)
Country | Link |
---|---|
CN (2) | CN1914353A (en) |
GB (1) | GB0325247D0 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8904315B2 (en) | 2007-12-17 | 2014-12-02 | Nokia Corporation | Circuit arrangements and associated apparatus and methods |
GB2489042A (en) * | 2011-03-18 | 2012-09-19 | Conductive Inkjet Technology Ltd | Photo-patternable structure |
CN102154818B (en) * | 2011-05-16 | 2012-05-09 | 东北林业大学 | Method for preparing nickel coating on surface of cotton fabric or linen fabric |
CA2990282C (en) * | 2015-07-03 | 2023-08-08 | National Research Council Of Canada | Method of printing ultranarrow line |
CN116321788B (en) * | 2021-10-13 | 2024-02-06 | 苏州康尼格电子科技股份有限公司 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
-
2003
- 2003-10-29 GB GB0325247A patent/GB0325247D0/en not_active Ceased
-
2004
- 2004-10-29 CN CN 200480037387 patent/CN1914353A/en active Pending
- 2004-10-29 CN CN 200480039450 patent/CN100521181C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1902755A (en) | 2007-01-24 |
CN100521181C (en) | 2009-07-29 |
CN1914353A (en) | 2007-02-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AT | Applications terminated before publication under section 16(1) |