GB0325247D0 - Method of forming a conductive metal region on a substrate - Google Patents

Method of forming a conductive metal region on a substrate

Info

Publication number
GB0325247D0
GB0325247D0 GB0325247A GB0325247A GB0325247D0 GB 0325247 D0 GB0325247 D0 GB 0325247D0 GB 0325247 A GB0325247 A GB 0325247A GB 0325247 A GB0325247 A GB 0325247A GB 0325247 D0 GB0325247 D0 GB 0325247D0
Authority
GB
United Kingdom
Prior art keywords
substrate
forming
conductive metal
metal region
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GB0325247A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conductive Inkjet Technology Ltd
Original Assignee
Conductive Inkjet Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conductive Inkjet Technology Ltd filed Critical Conductive Inkjet Technology Ltd
Priority to GB0325247A priority Critical patent/GB0325247D0/en
Publication of GB0325247D0 publication Critical patent/GB0325247D0/en
Priority to KR1020057013814A priority patent/KR20050097956A/en
Priority to EP04705844A priority patent/EP1590500A2/en
Priority to GB0401826A priority patent/GB0401826D0/en
Priority to JP2006502211A priority patent/JP2006516818A/en
Priority to US10/543,311 priority patent/US20060134318A1/en
Priority to PCT/GB2004/000358 priority patent/WO2004068389A2/en
Priority to GB0407303A priority patent/GB0407303D0/en
Priority to JP2006537430A priority patent/JP2007510063A/en
Priority to EP20040791626 priority patent/EP1687461A2/en
Priority to CN 200480037387 priority patent/CN1914353A/en
Priority to KR1020067010522A priority patent/KR20060123213A/en
Priority to CN 200480039450 priority patent/CN100521181C/en
Priority to US10/975,499 priority patent/US20050130397A1/en
Priority to JP2006537433A priority patent/JP2007510301A/en
Priority to PCT/GB2004/004589 priority patent/WO2005045095A2/en
Priority to US10/975,500 priority patent/US7243421B2/en
Priority to KR1020067010084A priority patent/KR20060126481A/en
Priority to EP04818166A priority patent/EP1678761A1/en
Priority to PCT/GB2004/004595 priority patent/WO2005044451A1/en
Ceased legal-status Critical Current

Links

GB0325247A 2003-01-28 2003-10-29 Method of forming a conductive metal region on a substrate Ceased GB0325247D0 (en)

Priority Applications (20)

Application Number Priority Date Filing Date Title
GB0325247A GB0325247D0 (en) 2003-10-29 2003-10-29 Method of forming a conductive metal region on a substrate
KR1020057013814A KR20050097956A (en) 2003-01-28 2004-01-28 Method of forming a conductive metal region on a substrate
EP04705844A EP1590500A2 (en) 2003-01-28 2004-01-28 Method of forming a conductive metal region on a substrate
GB0401826A GB0401826D0 (en) 2003-10-29 2004-01-28 The formation of layers on substrates
JP2006502211A JP2006516818A (en) 2003-01-28 2004-01-28 Method for producing a conductive metal region on a substrate
US10/543,311 US20060134318A1 (en) 2003-01-28 2004-01-28 Method of forming a conductive metal region on a substrate
PCT/GB2004/000358 WO2004068389A2 (en) 2003-01-28 2004-01-28 Method of forming a conductive metal region on a substrate
GB0407303A GB0407303D0 (en) 2003-10-29 2004-03-31 Electrical connection of components
PCT/GB2004/004595 WO2005044451A1 (en) 2003-10-29 2004-10-29 Electrical connection of components
JP2006537430A JP2007510063A (en) 2003-10-29 2004-10-29 Formation of layers on the substrate
EP20040791626 EP1687461A2 (en) 2003-10-29 2004-10-29 The formation of layers on substrates
CN 200480037387 CN1914353A (en) 2003-10-29 2004-10-29 Formation of layers on substrates
KR1020067010522A KR20060123213A (en) 2003-10-29 2004-10-29 The formation of layers on substrates
CN 200480039450 CN100521181C (en) 2003-10-29 2004-10-29 Method of electrically connecting connection points of elements to related connection points of circuit
US10/975,499 US20050130397A1 (en) 2003-10-29 2004-10-29 Formation of layers on substrates
JP2006537433A JP2007510301A (en) 2003-10-29 2004-10-29 Electrical connection of parts
PCT/GB2004/004589 WO2005045095A2 (en) 2003-10-29 2004-10-29 The formation of layers on substrates
US10/975,500 US7243421B2 (en) 2003-10-29 2004-10-29 Electrical connection of components
KR1020067010084A KR20060126481A (en) 2003-10-29 2004-10-29 Electrical connection of components
EP04818166A EP1678761A1 (en) 2003-10-29 2004-10-29 Electrical connection of components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0325247A GB0325247D0 (en) 2003-10-29 2003-10-29 Method of forming a conductive metal region on a substrate

Publications (1)

Publication Number Publication Date
GB0325247D0 true GB0325247D0 (en) 2003-12-03

Family

ID=29725583

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0325247A Ceased GB0325247D0 (en) 2003-01-28 2003-10-29 Method of forming a conductive metal region on a substrate

Country Status (2)

Country Link
CN (2) CN1914353A (en)
GB (1) GB0325247D0 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8904315B2 (en) 2007-12-17 2014-12-02 Nokia Corporation Circuit arrangements and associated apparatus and methods
GB2489042A (en) * 2011-03-18 2012-09-19 Conductive Inkjet Technology Ltd Photo-patternable structure
CN102154818B (en) * 2011-05-16 2012-05-09 东北林业大学 Method for preparing nickel coating on surface of cotton fabric or linen fabric
CA2990282C (en) * 2015-07-03 2023-08-08 National Research Council Of Canada Method of printing ultranarrow line
CN116321788B (en) * 2021-10-13 2024-02-06 苏州康尼格电子科技股份有限公司 PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method

Also Published As

Publication number Publication date
CN1902755A (en) 2007-01-24
CN100521181C (en) 2009-07-29
CN1914353A (en) 2007-02-14

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)