GB2378037A - Plasma cleaning of a machine or machine component - Google Patents

Plasma cleaning of a machine or machine component Download PDF

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Publication number
GB2378037A
GB2378037A GB0207456A GB0207456A GB2378037A GB 2378037 A GB2378037 A GB 2378037A GB 0207456 A GB0207456 A GB 0207456A GB 0207456 A GB0207456 A GB 0207456A GB 2378037 A GB2378037 A GB 2378037A
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GB
United Kingdom
Prior art keywords
machine
hollow space
plasma
component
machine component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0207456A
Other versions
GB2378037B (en
GB2378037A9 (en
GB0207456D0 (en
Inventor
Christof Diener
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of GB0207456D0 publication Critical patent/GB0207456D0/en
Publication of GB2378037A publication Critical patent/GB2378037A/en
Publication of GB2378037A9 publication Critical patent/GB2378037A9/en
Application granted granted Critical
Publication of GB2378037B publication Critical patent/GB2378037B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405Cleaning of reactor or parts inside the reactor by using reactive gases
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/10Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
    • F04B37/14Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high vacuum
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00Axial-flow pumps
    • F04D19/02Multi-stage pumps
    • F04D19/04Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/70Suction grids; Strainers; Dust separation; Cleaning
    • F04D29/701Suction grids; Strainers; Dust separation; Cleaning especially adapted for elastic fluid pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F05INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
    • F05DINDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
    • F05D2260/00Function
    • F05D2260/60Fluid transfer
    • F05D2260/607Preventing clogging or obstruction of flow paths by dirt, dust, or foreign particles

Abstract

A machine or machine component 1, having a hollow space 2 for a fluid or a granular product, and including movable machine elements, further includes a plasma cleaning arrangement comprising: means for supplying a process gas to the hollow space 8; and means for generating a plasma from the process gas, in the hollow space of the machine or machine component. The plasma may be generated by at least one electrode 5 fitted in or on the hollow space 2, or by other means such as microwave radiation or capacitive electrodes. The walls of the hollow space may act as a grounded return electrode 7. The invention allows cleaning of components and systems, including pumps, filters, catalytic converters, reactors, pipelines, injection moulds and mixers, even while in use. Deposits in the hollow space may be removed at any time or avoided from the outset.

Description

- 2378037
.. Machine or machine component with a hollow space, and a cleaning method for same 5 The invention concerns a machine or machine component (which term as used herein includes a process engineering unit) with a hollow space for either a fluid or a granular product, especially for accommodating machine elements that move with respect 10 to each other, and to a method of cleaning the said machine element or unit. Deposits and contamination can occur in the hollow space of such units because of the fluid flow or the granular product. In particular, the mode in which machine elements designed to work by 15 means of rotations and/or translational movements, such as pistons, valve actuators, paddles, mixing elements, etc., may be impaired. Various types of deposit may occur, according to the type of fluid or product.
During an engineering process, e.g. when separating or 20 etching material, residues are deposited in both the reaction space and machine components downstream of the reaction space, such as lines, pumps, catalytic converters and injection moulding equipment. According to the present description, the term "fluid" means a
25 liquid or gaseous substance, or a combination of both substances, such as a paste, or a viscous or fluid material (plastics, elastomers). The term "granular product" means powders, granules, etc. 30 German patent DEA-3725358 describes a coating installation with an integral plasma cleaning system, which can merely clean the reaction space of the coating installation whilst the coating process is interrupted. In this method of cleaning, a microwave 35 generated plasma is introduced into the reaction tube and the internal surfaces of the reaction space are
- 2 cleaned by dry etching. Only deposits in the reaction space can be removed. Other components of the coating installation must be dismantled for cleaning.
5 It is also known that process engineering units may be dismantled and affected components cleaned separately.
This method of working is very costly and labour intensive. 10 The function of this invention is to be capable of cleaning hollow areas of machine components and/or process engineering systems, especially moving machine elements within the component or system, at any time, even while a unit or machine is in operation, and hence IS without dismantling individual machine elements.
According to the invention, there is provided a machine or machine component of the type mentioned in the introduction, in which is embodied a plasma cleaning
20 installation, consisting of a process gas inlet to and an outlet from the hollow space, and means for generating a plasma in the hollow space, for example an electrode for plasma generation, fitted on or inside the hollow space.
The invention also provides a cleaning method for a hollow space fed by a fluid, in which a plasma cleaning installation embodied in the machine component or unit, fundamentally consisting of a process gas inlet to and 30 an outlet from the hollow space, and means (for example an electrode) for plasma generation, fitted on or inside the hollow space, is operated during the motion of the machine elements. This is beneficial for the removal of organic layers or contamination.
- 3 Microwave radiation can also be used for plasma generation. An electrode within the hollow space is not then required. Plasma can also be generated using capacitive or inductive methods.
The machine component may preferably comprise a vacuum pump. A plasma may be generated in the hollow space of the 10 machine component, or in the pumping space of the vacuum pump, in order that deposits or contaminants can be chemically or physically removed. There is no requirement to dismantle contaminated machine elements.
Long down-times and venting of hollow spaces can thus 15 be avoided. Suction-degrading filters can sometimes be dispensed with. Hence timewasting subsequent cleaning is not required. The plasma source can work both in standard or over-pressure mode, as well as in low pressure mode. A supplementary vacuum pump may be 20 required in the latter case. Plasma sources that may be considered are, for example, low frequency, high frequency, 50/60 Hz, microwave, corona and barrier sources. If a plasma is generated in the line or pump, this can be used to clean other components such as 25 valves, filters, sensors, catalytic converters and injection moulding equipment.
The term "process engineering unit", as used herein, includes mixers, injection moulding equipment, etc. If the walls of the hollow space and/or the vacuum pump are designed as a return electrode, only a single electrode may be embodied in the hollow space or the pumping space. It is preferable for the line forming 35 the return electrode to be grounded. If all the walls or the vacuum pump are designed as the return
- 4 electrode, a particularly good cleaning effect can be achieved. In a particularly advantageous method, the plasma 5 source can be operated during an engineering process.
Hollow spaces can thus be cleaned concurrently while a process takes place in the reaction space within a unit or machine, and this can dispense completely with down times of the unit or machine for cleaning purposes. If 10 the plasma source is always in operation during a process, deposits can be avoided from the outset, and chemical compounds emanating from the reaction space are broken down immediately (cracking). It is preferable for the chemical compounds to be broken down 15 into environmentally friendly components.
All recognised process gases may be considered for use as the process gas, in particular H202, 02, N2, N2O, air, CF4, noble gases, HCOOH, NH3, and mixtures of these.
A major advantage of the invention is that this cleaning method allows removal of organic material et al leaving practically no residue. It also kills off disease bearing agents.
Other features and benefits of the invention are brought out in the following description of an
engineered example of the invention, using the figure, which shows its fundamental features, and the claims.
30 The features described can be implemented alone, or in any combination, within the scope of the appended claims. Two preferred embodiments of the invention will now be 35 described with reference to the accompanying schematic
drawings, which show a vacuum pump and an injection moulding system respectively. In the drawings,: Fig. 1 is a schematic illustration of a vacuum pump connected to a vacuum unit, showing the 5 principle of the invention; and Fig. 2 is a schematic illustration of an injection moulding system operating according to the invention. These embodiments are by way of example only and should not be understood as restricting the invention in any way. The following key indicates the various parts shown in 15 the drawings.
1 Vacuum pump 2 Pump space 3 Feed 4 Vacuum unit 20 5 Electrode 6 DC or AC power source 7 Ground 8 Gas supply 9 Not used 25 10 Not used 11 Injection moulding unit 12 Device for producing a mouldable output product 13 Injection mould 14 Recipient 30 15 Process gas supply 16 Vacuum pump 17 Electrode 18 DC or AC power source 19 Ground 35 20 Seal 21 Contamination
- 6 22 Hollow space 23 Direction in which the container moves Fig.1 illustrates the principle of operation of a 5 vacuum pump 1, for example a dry sealing vacuum pump, lobe pump or turbo-pump, with a pumping space 2. The correspondingly shaped pistons (not shown in the figure) are rotated against the walls of the vacuum pump housing in the pumping space 2 to generate the 10 pumping effect. At the same time, a fluid is sucked by a known method via a feed line 3 from a vacuum unit 4 and expelled via an output flange (not shown in the figure). If this is a fluid used in an engineering system, it may contaminate the pistons and the housing 15 wall, for example in an engineering process such as Chemical Vapour Deposition (CVD). This can lead to deposits in the pump 2. For removal of the deposits, an electrode extending into the pump 2 is fitted, and this is connected to a DC or AC power source 6. In the 20 example shown, the feed 3 and the pump 2 are made from electrically conducting material. The pump 2 is grounded 7 and thus forms a second electrode. The feed line 3 is connected with a gas supply 8 for the process gas used for plasma generation.
Fig. 2 illustrates the construction of part of an injection moulding system with a device 12 for producing the mouldable output product and an injection mould 13. After extraction of the final or intermediate 30 product from the hollow spaces 22 in the injection mould 13, a container 14, capable of movement in the direction of the arrows 23, may be fitted over the injection mould 13, as shown in Fig. 2. The container 14 is coupled to the injection could 13 so as to form a 35 seal (seal 20), and hence the hollow spaces 22 in the injection would 13 can be evacuated. Contamination 21
- 7 in the hollow spaces 22 can be dissolved using a plasma treatment and then sucked out. Alternatively, the injection mould 12 can also be housed completely in a container. The container 14 has a gas supply 15 and a 5 connection to a vacuum pump 16. The plasma is generated using an electrode 17 (ground 19) and a DC or AC power source 18.
The invention thus provides a machine component (1) 10 and/or a process engineering system with an integral plasma cleaning installation and a cleaning method. A hollow space is employed, especially for housing machine elements fitted so as to be movable, and is fed with a fluid or accepts a granular product. Parts such 15 as pumps, filters, catalytic converters, reactors, pipelines, injection moulds and mixers etc. can repeatedly become contaminated by fluid residues during use. According to the invention the plasma generation installation consists of means (8) for supplying a 20 process gas and means for extracting the process gas from the hollow space (2), and an electrode fitted in the hollow space (2) for plasma generation. Deposits in the hollow space (2) can be removed at any time or avoided from the outset.
The plasma may also be generated without electrodes (e.g. using microwave radiation) in other forms of design. It can also be produced using capacitive electrodes. The plasma can be generated in the low 30 pressure area (low pressure plasma) or in the overpressure area (e.g. corona, barrier discharge, microwave discharge).
it.

Claims (1)

  1. - 8 CLAIMS
    1. A machine or machine component, having a hollow space for a fluid or a granular product, and including 5 moveable machine elements, wherein the machine or machine component also comprises a plasma cleaning device, the said device including means for supplying a process gas to the hollow space, means for extracting the process gas from the hollow space, and 10 means for producing a plasma in the hollow space of the machine or machine component.
    2. A machine or machine component as claimed in Claim 1,
    wherein the means for producing a plasma comprises an 15 electrode fitted in or on the hollow space.
    3. A machine component as in Claim 1, which is a vacuum pump. 20 4. A machine component as in Claim 1, which is an injection moulding unit.
    5. A machine component as claimed in Claim 4, wherein the plasma cleaning installation is aligned on the 25 injection mould.
    6. A method of cleaning method a hollow space of a machine or machine component which in use contains a fluid or a granular product, and which contains 30 moveable machine elements, which method comprises operating a plasma cleaning device, including means for supplying a process gas to the hollow space, means for extracting the process gas from the hollow space, and means for producing a plasma in the hollow 35 space of the machine or machine component, whilst the
    9 - moving elements in the machine are in operation.
    7. A method as claimed in Claim 6, wherein the means for producing a plasma comprises an electrode fitted in 5 or on the hollow space.
    8. Machine component (1) and/or an engineering system (11) with a hollow space (2; 22) for a fluid or granular product, in which are fitted especially 10 machine elements capable of movement, characterized in that a plasma cleaning installation, consisting fundamentally of a process gas supply (8; 15) and an extraction system for the hollow space (2; 22), and an electrode (5; 17) fitted in or on the hollow space 15 (2; 22) for producing the plasma, in which is embodied the machine component (1) and/or the engineering system (11).
    9. Cleaning method for a hollow space, for a fluid or a 20 granular product, in a machine component (1) and/or an engineering system (11), in which, especially in the hollow space (2j22), are fitted machine elements capable of movement, characterized in that a plasma cleaning installation embodied in the machine 25 component (1) and/or in the engineering system (11), fundamentally consisting of a process gas supply (8) and extraction system for the hollow space (2; 22), and an electrode fitted in the hollow space (2; 22) for producing the plasma, while the moving elements 30 in the machine are in operation.
GB0207456A 2001-03-29 2002-03-28 Machine or machine component with a hollow space,and a cleaning method for same Expired - Fee Related GB2378037B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10115394A DE10115394B4 (en) 2001-03-29 2001-03-29 Machine component and / or process plant with a cavity and cleaning method therefor

Publications (4)

Publication Number Publication Date
GB0207456D0 GB0207456D0 (en) 2002-05-08
GB2378037A true GB2378037A (en) 2003-01-29
GB2378037A9 GB2378037A9 (en) 2005-02-07
GB2378037B GB2378037B (en) 2005-06-29

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ID=7679456

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0207456A Expired - Fee Related GB2378037B (en) 2001-03-29 2002-03-28 Machine or machine component with a hollow space,and a cleaning method for same

Country Status (3)

Country Link
DE (1) DE10115394B4 (en)
FR (1) FR2822732B1 (en)
GB (1) GB2378037B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4119795A4 (en) * 2020-03-09 2024-04-10 Edwards Japan Ltd Vacuum pump

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007034751B3 (en) * 2007-07-25 2008-10-02 Plasma Technology Gmbh Plastic component plasma treatment in vacuum chamber involves holding back organic gas release resulted during plasma treatment as condensate by condensate trap, which is arranged in suction line
DE102011003781B3 (en) * 2011-02-08 2012-05-24 Meiko Maschinenbau Gmbh & Co. Kg Food waste disposal device used in kitchen of e.g. cafeteria, has plasma sources to clean portion of device casing, ignite plasma in gas and generate reactive gas so that reactive gas is brought into contact with portion of device casing
CN114733857B (en) * 2021-01-07 2023-09-15 中国科学院微电子研究所 Vacuum pipeline cleaning system and method

Citations (8)

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Publication number Priority date Publication date Assignee Title
US4438188A (en) * 1981-06-15 1984-03-20 Fuji Electric Company, Ltd. Method for producing photosensitive film for electrophotography
US4657616A (en) * 1985-05-17 1987-04-14 Benzing Technologies, Inc. In-situ CVD chamber cleaner
US4902531A (en) * 1986-10-30 1990-02-20 Nihon Shinku Gijutsu Kabushiki Kaisha Vacuum processing method and apparatus
US4960488A (en) * 1986-12-19 1990-10-02 Applied Materials, Inc. Reactor chamber self-cleaning process
EP0464696A1 (en) * 1990-06-29 1992-01-08 Applied Materials, Inc. Two-step reactor chamber self cleaning process
US5084125A (en) * 1989-09-12 1992-01-28 Matsushita Electric Industrial Co., Ltd. Apparatus and method for producing semiconductor substrate
US5273558A (en) * 1991-08-30 1993-12-28 Minnesota Mining And Manufacturing Company Abrasive composition and articles incorporating same
EP0888463A1 (en) * 1996-03-13 1999-01-07 Robert Bosch Gmbh Means for vacuum coating of bulk material

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WO1980001363A1 (en) * 1978-12-29 1980-07-10 Ncr Co Lpcvd systems having in situ plasma cleaning
DE3725358A1 (en) * 1987-07-30 1989-02-09 Telog Systems Gmbh DEVICE AND METHOD FOR SURFACE TREATMENT OF MATERIALS
US5273588A (en) * 1992-06-15 1993-12-28 Materials Research Corporation Semiconductor wafer processing CVD reactor apparatus comprising contoured electrode gas directing means
JPH06216175A (en) * 1993-01-15 1994-08-05 Toshiba Corp Semiconductor manufacturing apparatus and manufacture of semiconductor device
US6047713A (en) * 1994-02-03 2000-04-11 Applied Materials, Inc. Method for cleaning a throttle valve
JPH09123206A (en) * 1995-10-30 1997-05-13 Towa Kk Resin sealing molding machine electronic component

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4438188A (en) * 1981-06-15 1984-03-20 Fuji Electric Company, Ltd. Method for producing photosensitive film for electrophotography
US4657616A (en) * 1985-05-17 1987-04-14 Benzing Technologies, Inc. In-situ CVD chamber cleaner
US4902531A (en) * 1986-10-30 1990-02-20 Nihon Shinku Gijutsu Kabushiki Kaisha Vacuum processing method and apparatus
US4960488A (en) * 1986-12-19 1990-10-02 Applied Materials, Inc. Reactor chamber self-cleaning process
US5084125A (en) * 1989-09-12 1992-01-28 Matsushita Electric Industrial Co., Ltd. Apparatus and method for producing semiconductor substrate
EP0464696A1 (en) * 1990-06-29 1992-01-08 Applied Materials, Inc. Two-step reactor chamber self cleaning process
US5273558A (en) * 1991-08-30 1993-12-28 Minnesota Mining And Manufacturing Company Abrasive composition and articles incorporating same
EP0888463A1 (en) * 1996-03-13 1999-01-07 Robert Bosch Gmbh Means for vacuum coating of bulk material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4119795A4 (en) * 2020-03-09 2024-04-10 Edwards Japan Ltd Vacuum pump

Also Published As

Publication number Publication date
FR2822732A1 (en) 2002-10-04
GB2378037B (en) 2005-06-29
FR2822732B1 (en) 2006-05-26
DE10115394A1 (en) 2002-10-10
GB2378037A9 (en) 2005-02-07
GB0207456D0 (en) 2002-05-08
DE10115394B4 (en) 2005-03-24

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PCNP Patent ceased through non-payment of renewal fee

Effective date: 20200328