GB2342501B - Apparatus for baking a resist deposited on a semiconductor wafer - Google Patents

Apparatus for baking a resist deposited on a semiconductor wafer

Info

Publication number
GB2342501B
GB2342501B GB9822000A GB9822000A GB2342501B GB 2342501 B GB2342501 B GB 2342501B GB 9822000 A GB9822000 A GB 9822000A GB 9822000 A GB9822000 A GB 9822000A GB 2342501 B GB2342501 B GB 2342501B
Authority
GB
United Kingdom
Prior art keywords
baking
semiconductor wafer
resist deposited
resist
deposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9822000A
Other versions
GB2342501A (en
GB9822000D0 (en
Inventor
Yong-Guk Bae
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of GB9822000D0 publication Critical patent/GB9822000D0/en
Publication of GB2342501A publication Critical patent/GB2342501A/en
Application granted granted Critical
Publication of GB2342501B publication Critical patent/GB2342501B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
GB9822000A 1997-10-24 1998-10-08 Apparatus for baking a resist deposited on a semiconductor wafer Expired - Fee Related GB2342501B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970054864A KR100275723B1 (en) 1997-10-24 1997-10-24 Oven with hot plate capable of controlling height of spacer

Publications (3)

Publication Number Publication Date
GB9822000D0 GB9822000D0 (en) 1998-12-02
GB2342501A GB2342501A (en) 2000-04-12
GB2342501B true GB2342501B (en) 2001-01-03

Family

ID=19523364

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9822000A Expired - Fee Related GB2342501B (en) 1997-10-24 1998-10-08 Apparatus for baking a resist deposited on a semiconductor wafer

Country Status (3)

Country Link
KR (1) KR100275723B1 (en)
GB (1) GB2342501B (en)
TW (1) TW436890B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100638584B1 (en) * 2005-08-01 2006-10-27 삼성전자주식회사 Device of heating a wafer and method of setting the device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137414A (en) * 1983-03-28 1984-10-03 Silicon Valley Group Wafer transporting centring and heating
US5226056A (en) * 1989-01-10 1993-07-06 Nihon Shinku Gijutsu Kabushiki Kaisha Plasma ashing method and apparatus therefor
US5431700A (en) * 1994-03-30 1995-07-11 Fsi International, Inc. Vertical multi-process bake/chill apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137414A (en) * 1983-03-28 1984-10-03 Silicon Valley Group Wafer transporting centring and heating
US5226056A (en) * 1989-01-10 1993-07-06 Nihon Shinku Gijutsu Kabushiki Kaisha Plasma ashing method and apparatus therefor
US5431700A (en) * 1994-03-30 1995-07-11 Fsi International, Inc. Vertical multi-process bake/chill apparatus

Also Published As

Publication number Publication date
GB2342501A (en) 2000-04-12
KR100275723B1 (en) 2001-01-15
GB9822000D0 (en) 1998-12-02
KR19990033495A (en) 1999-05-15
TW436890B (en) 2001-05-28

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20021008