GB2338684A - Hot laminating electronic chip card with surface overlay pierced with holes - Google Patents
Hot laminating electronic chip card with surface overlay pierced with holes Download PDFInfo
- Publication number
- GB2338684A GB2338684A GB9913355A GB9913355A GB2338684A GB 2338684 A GB2338684 A GB 2338684A GB 9913355 A GB9913355 A GB 9913355A GB 9913355 A GB9913355 A GB 9913355A GB 2338684 A GB2338684 A GB 2338684A
- Authority
- GB
- United Kingdom
- Prior art keywords
- holes
- card
- pierced
- film
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
An electronic card having an integrated circuit 3 is manufactured by hot laminating using a surface film or overlay 8,9 pierced with through holes 14 so that air bubbles trapped between the overlay and outer layers 4,7 can escape. The holes may have a diameter of 0.2-1.4 mm, a pitch of 2-20 mm and cover 0.1-2.5% of the film surface area. The overlay 14 may be in the form of a single film which covers the layers 4,7, prior to laminating, in the manner of a book (Fig 4).
Description
2338684 1 A METHOD OF MANUFACTURING CHIP CARDS FITTED WITH SURFACE FILMS
The invention relates to a method of manufacturing chip cards provided with surface films of the kind commonly referred to as "overlays".
Chip cards serve to identify their bearer and to hold in secure manner data relating in particular to electronic transactions performed by said bearer, or rights which the bearer can claim.
They are portable articles comprising firstly a card body and secondly an electronic component having an integrated circuit or "chip".
The card body is made of plastic and comprises one or more layers. The outer layers of said body are advantageously covered in surface films which are generally transparent. These films give the card an attractive, bright appearance and the graphics printed on the card body is protected from damage it might suffer.
The electr6nic component is a silicon microwafer on which there is integrated a circuit which defines various functional assemblies such as memories, e.g. of the RAM, ROM, or EEPROM type, accompanied in "microprocesso' cards by a central processor unit (CPU). - The electronic component is incorporated in the card body. To this end, it is sometimes initially integrated in an electronic module which is placed in a cavity in the card body.
The electronic component can also be connected to the terminals of an antenna. Under such circumstances, the card has a contactless operating mode and the data which it interchanges with the surroundings can be transmitted by electromagnetic coupling between the antenna of the 2 card and an antenna of an associated reader. However, when the electronic component is not connected to the terminals of an antenna, data transmission necessarily takes place via electrical contacts.
Various methods are known for manufacturing chip cards.
Some methods propose laminating together an assembly comprising various layers while hot, which layers are designed to form the card body, the surface films, and the chip, which chip may optionally be integrated within an electronic module andlor be connected to the terminals of an antenna. To this end, pressure forces are applied to the above-specified assembly so that the layers and films are heat-sealed together at a temperature of about 12WC.
Unfortunately, those methods suffer from drawbacks due to the fact that, during lamination, bubbles of air are sometimes trapped between the surface films and the layers they cover. This gives rise to visible defects on the surface of the card body, and in particular to the formation of blisters or of zones of contrasting brilliance.
In the light of the above, a problem the invention seeks to solve is avoiding apparent surface defects on cards that have surface films.
To solve this problem, the invention provides a method of manufacturing a card comprising a card body, said card body having an electronic component and an outer layer coated in a surface film, the method being characterized in that it comprises the following steps in which:
the surface film is pierced with through holes; the outer layer is covered in said surface film pierced with holes, and 3 an assembly comprising the surface film and the outer layer covered in said film is laminated together while hot.
In this way the bubbles of air trapped between the outer layer and the surface film escape through the holes. The manufactured card then does not present defects in appearance due to said bubbles of air.
Advantageously, the mean diameter of the holes lies in the range 0.2 mm to 1.4 mm, and is in particular about 0.8 mm.
The holes thus heal during the lamination step and the finished card does not present any holes.
Advantageously 0.1% to 2.5% of the surface area of the film, and preferably about 0.5% of said surface area is pierced by holes.
Thus, the shrinkage due to the film polymerizing and healing is not sufficient to give rise to defects in the appearance of the card.
The invention will be better understood on reading the following nonlimiting descriptibn of embodiments, given with reference to the accompanying drawings, in which:
Figure 1A is a cross-section showing a chip card having contacts; Figure 1 B is a cross-section showing a contactless chip card; Figure 2 is a cross-section showing a step during lamination of a contactless card by the method of the invention; Figure 3A is a cross-section on a larger scale showing a surface film designed for use in the method of the invention; Figure 3B is a cross-section on a larger scale showing a surface film of a card obtained by the method of the invention; and Figure 4 is a cross-section showing how surface films are fixed in the assembly in preparation for lamination by the method of the invention.
4 The method of the invention is for use in manufacturing chip cards 1 of the types shown in Figures 1A and 1B. Such chip cards 1 are standardized articles, and in particular they are defined by the following ISO standards: 7810, 7816, and 14443, the contents of which is incorporated into the present description by reference. In particular, they are in the form of portable flat rectangular parallelepipeds having dimensions of the following order: length 85 mm, width 54 mm, and thickness 760 pm.
Chip cards 1 are constituted by a card body 2 within which an electronic component 3 is integrated.
The card body 2 is made up of one or more layers 4, 5, 6, and 7 that are thermoplastic or thermosettable, e.g. constituted by acrylonitrile butadiene styrene (ABS), polyvinyl chloride (PVC), polyethylene terephthalate (PET), polycarbonate (PC), or polymethyimethacrylate (PMMA).
The outer layer(s) 4, 7 of said card body 2 are generally printed. They are also covered in thin transparent surface films 8, 9 which are generally about 50 pm thick. Like the layers 4, 5, 6, and 7 of the card body 2, the films 8 and 9 are thermoplastic or thermosettable, e.g. constituted by acrylonitrile butadiene styrene (ABS), polyvinyl chloride (PVC), polyethylene terephthalate (PET), polycarbonate (PC), or polymethyimethacrylate (PMMA). The films 8 and 9 can be transparent or printed.
The electronic component 3 is a chip optionally integrated within a module 10 and optionally connected to the terminals of an antenna 11 of the card 1.
The card with contacts shown in Figure 1A has a card body 2 and a module 10.
The card body 2 has four plastics layers 4, 5, 6, and 7, namely two outer layers 4 and 7 and two inner layers 5 and 6, with each of the two outer layers 4, 7 being covered by a respective PVC surface film 8, 9. The layers 4, 5, 6, and 7 are thermoplastic, being made of PVC or of PC.
The module 10 is incorporated in the card body 2. It comprises an integrated circuit chip 3 whose contact pads are connected by conductor wires 12 to contact areas 13 which are flush with the surface of the body 2.
The contactless card shown in Figure 1 B comprises a card body 2 and a chip 3.
The card body 2 comprises four plastics layers 4, 5, 6, and 7, namely two outer layers 4, 7 and two inner layers 5, 6, together with two films 8, g. The layers 4 and 7 are thermoplastic layers of PC having a thickness of about 150 pm. The inner layer 5 is a thermoplastic layer of PVC that is about 190 pm thick, and the inner layer 6 is a thermoplastic layer of PVC that is about 300 pm thick. The films 8 and 9 covering the layers 4 and 7 are transparent and they are about 50 pm thick.
Via its active face which is provided with projections, the chip 3 is connected to terminals of the antenna 11 which is silk-screen printed on the surface of the inner layer 5. It is embedded in the inner layer 6.
To manufacture a card by the method of the invention, and in particular to manufacture the contactless card shown in Figure 1 B, various steps are performed.
In a preparatory step, the films 8 and 9 are pierced by through holes 14. As shown more particularly in Figure 3A, these holes 14 are substantially circularly cylindrical. Nevertheless, they may be in the form of slots or more generally in the form of arbitrary cutouts. The mean diameter 6 of said holes 14 advantageously lies in the range 0.2 mm to 1.4 mm, and is for example about 0.8 mm. The mean pitch of the holes 14 advantageously lies in the range 2 mm to 20 mm, and is for example about 10 mm. Thus, 0. 1 % to 2.5% and in particular about 0.5% of the surface area of the films 8, 9 is pierced by holes 14. It will be observed that the means for piercing the holes 14 can be constituted by a roller provided with needles of the desired diameter, the roller being passed over strips of film to pierce holes on a large scale.
In another preparatory step, the chip 3 with its projections 15 is applied to the inner layer 5 on whose surface the antenna 11 has already been silk-screen printed or etched. Once fixed on the inner layer 5, the chip 3 is electrically connected to the terminals of said antenna 11.
Once said preparatory steps have been performed, the outer layer 4, the inner layer 5 carrying the chip 3, the inner layer 6, the outer layer 7, and the surface films 8 and 9 are superposed so as to form a superposed assembly which is placed between parallel plates 16 and 17 of a press (Figure 2).
In particular because of the thickness of the chip 3, the layers 4, 5, 6, and 7, and the films 8 and 9 of the assembly as placed in the press are not strictly parallel. Pockets of air thus exist within the superposed assembly and in particular between the films 8, 9 and the outer layers 4, 7 which at this stage in the method of the invention do not adhere to said films 8, 9.
Nevertheless, in a lamination step during which the plates 16 and 17 of the press are moved towards each other and raised to a temperature of about 1200C, e.g. in an oven, the layers 4, 5, 6, and 7 and the films 8, 9 are heat-sealed to one another and the pockets of air empty out via the through holes 14 which are large enough to allow air to escape.
7 Under the effects of pressure and heat, the holes 14 heal, i.e. they close up. This healing is possible because the holes 14 are small enough in diameter.
The card 1 obtained after being withdrawn from the press then does not present appearance defects. Nevertheless, in glancing light, it is possible for the person skilled in the art to identify traces of healing.
In practice, for mass production of chip cards, the laminated-together assemblies are of dimensions that are much larger than those of individual cards and they contain a plurality of chips 3 (see Figures 2 and 4). It is thus possible to manufacture a plurality of cards simultaneously, after an additional step of cutting up the laminated assemblies.
In this respect, it should be observed the films 8, 9 which used to require tensioning over the surfaces of assemblies in order to minimize the formation of air pockets, are not necessarily tensioned when implementing the invention. It is consequently possible to cover the layers that are to be laminated together using a single film 8, 9 which is fixed as shown in Figure 4 at a common end of the assembly. This single film 8, 9 then covers the assembly of layers 4, 5, 6, and 7 like the dust jacket of a book.
Naturally, the method of the invention, as described above- with respect to manufacturing a contactless card, also applies to manufacturing cards with contacts. Bubbles of air are always present between the layers and the films prior to lamination.
The method of the invention also applies to manufacturing cards by lamination when the modules or the chips are not present in the laminated assembly, but are fitted thereto in a later step.
8
Claims (1)
1. A method of manufacturing a card comprising a card body, said card body having an electronic component and an outer layer coated in a surface film, the method comprising the following steps in which:
the surface film is pierced with through holes; the outer layer is covered in said surface film pierced with holes; and an assembly comprising the surface film and the outer layer covered in said film is laminated together while hot.
2. A method according to claim 1, wherein the card further comprises an electronic component having an integrated circuit.
3. A method according to claim 2, wherein the assembly that is laminated together while hot further includes the electronic component.
4. A method according to claim 2 or claim 3, wherein the electronic component is connected to terminals of an antenna in order to enable the card to operate in contactless manner.
5. A method according to any preceding claim, wherein the holes have a mean diameter lying in the range 0.2 mm to 1.4 mm, and in particular of about 0.8 mm.
6. A method according to any preceding claim, wherein the mean pitch of the holes lies in the range 2 mm to 20 mm, and is in particular about 10 mm.
7. A method according to any preceding claim, wherein 0.1% to 2.5%, and in particular 0.5% of the surface area of the film is pierced by holes.
9 8. A method according to any preceding claim, wherein the holes heal under the effect of the pressure and the heat due to lamination while hot.
9. A method according to any preceding claim, wherein the electronic component is a chip, and wherein in a step prior to lamination, the chip is fitted to an inner layer of the laminated assembly.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9808015A FR2780338B1 (en) | 1998-06-24 | 1998-06-24 | METHOD FOR MANUFACTURING CHIP CARDS PROVIDED WITH SURFACE FILMS |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB9913355D0 GB9913355D0 (en) | 1999-08-11 |
| GB2338684A true GB2338684A (en) | 1999-12-29 |
| GB2338684B GB2338684B (en) | 2000-09-06 |
Family
ID=9527812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9913355A Expired - Fee Related GB2338684B (en) | 1998-06-24 | 1999-06-08 | A method of manufacturing chip cards fitted with surface films |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE19928522A1 (en) |
| FR (1) | FR2780338B1 (en) |
| GB (1) | GB2338684B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10054873C2 (en) * | 2000-11-06 | 2002-10-17 | Mada Marx Datentechnik Gmbh | Contactless chip card and method for producing such a chip card |
| DE10304777B4 (en) * | 2003-02-05 | 2006-11-23 | Infineon Technologies Ag | Method for producing a chip using a heat and pressure process using a thermoplastic material and apparatus for carrying out the method |
| US20070237932A1 (en) | 2006-04-05 | 2007-10-11 | Assa Abloy Ab | Thermally stable proximity identification card |
| DE102008035522A1 (en) | 2008-07-30 | 2010-02-04 | Mühlbauer Ag | Method for producing a device for wireless communication or a prelaminate for such a device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4350545A (en) * | 1979-10-12 | 1982-09-21 | Armen Garabedian | Method of laminating plastic sheets |
| DE19614808A1 (en) * | 1996-04-15 | 1997-10-16 | Giesecke & Devrient Gmbh | Process for production of data cards |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL9301457A (en) * | 1993-08-23 | 1995-03-16 | Nedap Nv | Contactless identification card or smart card. |
-
1998
- 1998-06-24 FR FR9808015A patent/FR2780338B1/en not_active Expired - Fee Related
-
1999
- 1999-06-08 GB GB9913355A patent/GB2338684B/en not_active Expired - Fee Related
- 1999-06-22 DE DE1999128522 patent/DE19928522A1/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4350545A (en) * | 1979-10-12 | 1982-09-21 | Armen Garabedian | Method of laminating plastic sheets |
| DE19614808A1 (en) * | 1996-04-15 | 1997-10-16 | Giesecke & Devrient Gmbh | Process for production of data cards |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2338684B (en) | 2000-09-06 |
| GB9913355D0 (en) | 1999-08-11 |
| FR2780338B1 (en) | 2000-08-25 |
| DE19928522A1 (en) | 1999-12-30 |
| FR2780338A1 (en) | 1999-12-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AT | Applications terminated before publication under section 16(1) | ||
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20070608 |