FR2780338A1 - METHOD FOR MANUFACTURING CHIP CARDS PROVIDED WITH SURFACE FILMS - Google Patents
METHOD FOR MANUFACTURING CHIP CARDS PROVIDED WITH SURFACE FILMS Download PDFInfo
- Publication number
- FR2780338A1 FR2780338A1 FR9808015A FR9808015A FR2780338A1 FR 2780338 A1 FR2780338 A1 FR 2780338A1 FR 9808015 A FR9808015 A FR 9808015A FR 9808015 A FR9808015 A FR 9808015A FR 2780338 A1 FR2780338 A1 FR 2780338A1
- Authority
- FR
- France
- Prior art keywords
- card
- holes
- films
- film
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
L'invention concerne un procédé de fabrication d'une carte comportant, d'une part, un corps (2) de carte comprenant une couche externe (4, 7) revêtue d'un film de surface (8, 9). Selon l'invention, ce procédé se caractérise en ce qu'il comporte les étapes suivantes selon lesquelles :- on perce le film de surface (8, 9) de trous (14) débouchants; - on revêt la couche externe (4, 7) dudit film de surface (8, 9) percé de trous (14); et- on colamine à chaud un ensemble comprenant le film de surface (8, 9) et la couche externe (4, 7) revêtue dudit film (8, 9). L'invention s'applique en particulier, à la fabrication de cartes à puce sans contact.The invention relates to a method of manufacturing a card comprising, on the one hand, a card body (2) comprising an outer layer (4, 7) coated with a surface film (8, 9). According to the invention, this method is characterized in that it comprises the following steps according to which: the surface film (8, 9) is pierced with through holes (14); - The outer layer (4, 7) is coated with said surface film (8, 9) pierced with holes (14); and- hot-rolled an assembly comprising the surface film (8, 9) and the outer layer (4, 7) coated with said film (8, 9). The invention applies in particular to the manufacture of contactless smart cards.
Description
PROCEDE DE FABRICATION DE CARTES A PUCEMETHOD FOR MANUFACTURING CHIP CARDS
MUNIES DE FILMS DE SURFACEPROVIDED WITH SURFACE FILMS
L'invention concerne un procédé de fabrication de cartes à puce munies de films de surface habituellement désignés sous le terme anglo-saxon "overlays". Les cartes à puce ont pour fonction d'identifier leur porteur et de sécuriser des données relatives, notamment, à des transactions électroniques réalisées par ledit porteur, ou alors, à des droits auxquels The invention relates to a method of manufacturing smart cards provided with surface films usually designated by the English term "overlays". The function of smart cards is to identify their holder and to secure data relating, in particular, to electronic transactions carried out by said holder, or else, to rights to which
ce dernier peut prétendre.the latter can claim.
Ce sont des objets portatifs comportant, d'une part, un corps de carte et, d'autre part, un composant électronique à circuit intégré ou puce. Le corps de carte est plastique et se compose d'une ou plusieurs couches. Les couches externes dudit corps sont avantageusement revêtues de films de surface généralement transparents. Grâce à ces films, la carte a un bel aspect de brillance et les motifs imprimés du These are portable objects comprising, on the one hand, a card body and, on the other hand, an electronic component with integrated circuit or chip. The card body is plastic and consists of one or more layers. The outer layers of said body are advantageously coated with generally transparent surface films. Thanks to these films, the card has a beautiful shine appearance and the printed patterns of the
corps de carte sont protégés des dégradations qu'ils pourraient subir. card bodies are protected from damage they may suffer.
Le composant électronique est une microplaquette de silicium sur laquelle est intégré un circuit qui définit des ensembles fonctionnels, tels que des ensembles mémoires, par exemple de type RAM, ROM ou EEPROM, ou, dans le cas de cartes dites à microprocesseurs, une unité The electronic component is a silicon chip on which a circuit is integrated which defines functional assemblies, such as memory assemblies, for example of the RAM, ROM or EEPROM type, or, in the case of so-called microprocessor cards, a unit.
centrale de traitement (CPU).central processing unit (CPU).
Le composant électronique est incorporé au corps de la carte. A cet effet, il est parfois préalablement intégré dans le module électronique The electronic component is incorporated into the body of the card. To this end, it is sometimes previously integrated into the electronic module.
reporté dans une cavité du corps de carte. transferred to a cavity in the card body.
Le composant électronique est par ailleurs susceptible d'être connecté aux bornes d'une antenne. Dans ce cas, la carte dispose d'un mode de fonctionnement sans contact et les données qu'elle échange avec le milieu extérieur sont susceptibles d'être transmises par couplage électromagnétique entre l'antenne de la carte et une antenne d'un lecteur associé. Dans le cas o le composant électronique n'est pas connecté aux bornes d'une antenne, la transmission des données The electronic component is moreover capable of being connected to the terminals of an antenna. In this case, the card has a contactless operating mode and the data it exchanges with the outside environment are capable of being transmitted by electromagnetic coupling between the antenna of the card and the antenna of an associated reader. . In the case where the electronic component is not connected to the terminals of an antenna, the data transmission
s'effectue par contre nécessairement au moyen de contacts électriques. on the other hand necessarily takes place by means of electrical contacts.
Pour la fabrication de cartes à puce, on connaît différent procédés. Different processes are known for manufacturing smart cards.
Certains procédés proposent une colamination à chaud d'un ensemble comprenant les différentes couches destinées à former le corps de carte, les films de surface et la puce éventuellement intégrée au sein d'un module électronique et/ou connectée aux bornes d'une antenne. A cet effet, des forces de pression sont appliquées sur l'ensemble précité de manière que, à une température de l'ordre de Some methods propose hot colamination of an assembly comprising the different layers intended to form the card body, the surface films and the chip possibly integrated within an electronic module and / or connected to the terminals of an antenna. To this end, pressure forces are applied to the above-mentioned assembly so that, at a temperature of the order of
C, les couches et films soient soudés. C, the layers and films are welded.
Toutefois, ces procédés présentent certains inconvénients dus au fait que, au cours de la colamination, des bulles d'air sont parfois However, these methods have certain disadvantages due to the fact that, during colamination, air bubbles are sometimes
emprisonnées entre les films de surface et les couches qu'ils recouvrent. trapped between the surface films and the layers they cover.
Il en résulte certains défauts apparents à la surface du corps de carte et, notamment, la formation de cloques ou de zones de brillance contrastées. Considérant ce qui précède, un problème objectif que se propose de résoudre l'invention est d'éviter les défauts apparents à la surface des This results in certain apparent defects on the surface of the card body and, in particular, the formation of blisters or areas of contrasting brightness. Considering the above, an objective problem which the invention proposes to solve is to avoid apparent defects on the surface of the
cartes comportant des films de surface. cards with surface films.
La solution de l'invention à ce problème a pour objet un procédé de fabrication d'une carte comportant un corps de carte, ledit corps de carte comprenant une couche externe revêtue d'un film de surface caractérisé en ce qu'il comporte les étapes suivantes selon lesquelles on perce le film de surface de trous débouchants; on revêt la couche externe (4, 7) dudit film de surface percé de trous; et on colamine à chaud un ensemble comprenant ledit film de The solution of the invention to this problem relates to a method of manufacturing a card comprising a card body, said card body comprising an outer layer coated with a surface film characterized in that it comprises the steps following which the surface film is drilled through holes; the outer layer (4, 7) is coated with said surface film pierced with holes; and a set comprising said film is hot-rolled
surface et la couche externe revêtue dudit film. surface and the outer layer coated with said film.
Ainsi, les bulles d'air emprisonnées entre la couche externe et le film de surface s'échappent par les trous. La carte fabriquée ne présente Thus, the air bubbles trapped between the outer layer and the surface film escape through the holes. The manufactured card does not have
alors pas de défauts d'aspect dus auxdites bulles d'air. then no appearance defects due to said air bubbles.
Avantageusement, les trous ont un diamètre moyen compris entre 0,2 et 1, 4 mm, notamment de l'ordre de 0,8 mm. Ainsi, les trous cicatrisent au cours de l'étape de colamination et la Advantageously, the holes have an average diameter of between 0.2 and 1.4 mm, in particular of the order of 0.8 mm. Thus, the holes heal during the colamination step and the
carte finie ne présente pas de trous. finished card has no holes.
Avantageusement, 0,1 à 2,5 % de la surface du film, préférentiellement de l'ordre de 0,5 % de cette surface, est percée de Advantageously, 0.1 to 2.5% of the surface of the film, preferably of the order of 0.5% of this surface, is pierced with
1 0 trous.1 0 holes.
Ainsi, les retraits dus à la polymérisation du film et la cicatrisation ne sont pas suffisants pour occasionner des défauts d'aspect de la carte. L'invention sera mieux comprise à la lecture de l'exposé non limitatif des exemples de mise en oeuvre qui vont suivre, rédigés au regard des dessins ci-joints, dans lesquels: la figure lA montre, en coupe transversale, une carte à puce à contacts; la figure lB montre, en coupe transversale, une carte à puce sans contact; la figure 2, illustre, en coupe transversale, une étape de colamination d'une carte sans contact selon le procédé de l'invention; la figure 3A, montre, en coupe transversale et en vue agrandie, un film de surface destiné à la mise en oeuvre du procédé de l'invention; la figure 3B, montre, en coupe transversale et en vue agrandie, un film de surface d'une carte obtenue selon le procédé de l'invention; et la figure 4 montre, en coupe transversale, la manière dont sont fixés les films de surface dans l'ensemble destiné à une colamination Thus, the shrinkages due to the polymerization of the film and the scarring are not sufficient to cause defects in the appearance of the card. The invention will be better understood on reading the nonlimiting description of the examples of implementation which will follow, written with reference to the attached drawings, in which: FIG. 1A shows, in cross section, a smart card with contacts; FIG. 1B shows, in cross section, a contactless smart card; FIG. 2 illustrates, in cross section, a step of colamination of a contactless card according to the method of the invention; FIG. 3A shows, in cross section and in enlarged view, a surface film intended for the implementation of the method of the invention; FIG. 3B shows, in cross section and in enlarged view, a surface film of a card obtained according to the method of the invention; and FIG. 4 shows, in cross section, the manner in which the surface films are fixed in the assembly intended for colamination
selon le procédé de l'invention.according to the method of the invention.
Le procédé de l'invention est destiné à la fabrication de cartes 1 à puce du type de celles montrées aux figures 1A et lB. De telles cartes 1 à puces sont des objets normalisés tels que notamment définis dans les normes ISO 7810, 7816 et 14443 dont le contenu est intégré au présent exposé, par citation de référence. Elles se présentent notamment sous la forme de parallélépipèdes rectangles plats et portatifs dont les dimensions sont de l'ordre de 85 mm de longueur, 54 mm de largeur et The method of the invention is intended for the manufacture of smart cards 1 of the type of those shown in FIGS. 1A and 1B. Such smart cards 1 are standardized objects as defined in particular in ISO standards 7810, 7816 and 14443, the content of which is integrated into the present description, by reference citation. They are in particular in the form of rectangular and portable rectangular parallelepipeds whose dimensions are of the order of 85 mm in length, 54 mm in width and
760 Mm d'épaisseur.760 mm thick.
Les cartes 1 à puce sont constituées d'un corps 2 de carte au sein Smart cards 1 consist of a card body 2 within
duquel est intégré un composant électronique 3. of which an electronic component is integrated 3.
Le corps 2 de carte se compose d'une ou plusieurs couches 4, 5, 6, 7, thermoplastiques ou thermodurcissables, par exemple, constituées d'acrylonitrile butadiène styrène (ABS), de polychlorure de vinyle (PVC), de polyéthylène téréphtalate (PET), de polycarbonate (PC) ou de The card body 2 consists of one or more layers 4, 5, 6, 7, thermoplastic or thermosetting, for example, consisting of acrylonitrile butadiene styrene (ABS), polyvinyl chloride (PVC), polyethylene terephthalate ( PET), polycarbonate (PC) or
polyméthylméthacrylate (PMMA).polymethylmethacrylate (PMMA).
La ou les couches externes 4, 7 dudit corps 2 de carte sont généralement imprimées. Elles sont en outre revêtues de films 8, 9 de The outer layer or layers 4, 7 of said card body 2 are generally printed. They are also coated with films 8, 9 of
surface transparents de faible épaisseur, en général de l'ordre de 50 > rm. thin transparent surfaces, generally around 50> rm.
De même que pour les couches 4, 5, 6, 7 du corps 2 de carte, les films 8, 9 sont thermoplastiques ou thermodurcissables, par exemple constitués d'acrylonitrile butadiène styrène (ABS), de polychlorure de vinyle (PVC), de polyéthylène téréphtalate (PET), de polycarbonate (PC) ou de polyméthylméthacrylate (PMMA). Ces films 8, 9 peuvent être As for layers 4, 5, 6, 7 of the card body 2, the films 8, 9 are thermoplastic or thermosetting, for example made of acrylonitrile butadiene styrene (ABS), polyvinyl chloride (PVC), polyethylene terephthalate (PET), polycarbonate (PC) or polymethylmethacrylate (PMMA). These films 8, 9 can be
transparents ou imprimés.transparent or printed.
Le composant électronique 3 est une puce éventuellement intégrée au sein d'un module 10 et éventuellement connectée aux bornes d'une The electronic component 3 is a chip possibly integrated within a module 10 and possibly connected to the terminals of a
antenne 11 de la carte 1.antenna 11 of card 1.
La carte à contacts montrée à la figure 1A comporte un corps 2 de The contact card shown in FIG. 1A comprises a body 2 of
carte et un module 10.card and module 10.
Le corps 2 de carte comporte quatre couches plastiques 4, 5, 6, 7, deux couches externes 4, 7 et deux sous-couches 5, 6, les deux couches The card body 2 has four plastic layers 4, 5, 6, 7, two outer layers 4, 7 and two sublayers 5, 6, the two layers
4, 7 externes étant revêtues chacune d'un film 8, 9 de surface de PVC. 4, 7 external being each coated with a film 8, 9 of PVC surface.
Les couches 4, 5, 6, 7 sont thermoplastiques de PVC ou de PC. Layers 4, 5, 6, 7 are thermoplastic from PVC or PC.
Le module 10 est incorporé dans le corps 2 de carte. Il comporte une puce 3 à circuit intégré dont des plots de contact sont connectés, par des fils conducteurs 12, à des plages 13 de contact affleurant à la The module 10 is incorporated into the card body 2. It comprises an integrated circuit chip 3, of which contact pads are connected, by conductive wires 12, to contact pads 13 flush with the
surface du corps 2.body surface 2.
La carte sans contact montrée à la figure lB comporte un corps 2 The contactless card shown in FIG. 1B has a body 2
de carte et une puce 3.card and chip 3.
Le corps 2 de carte comporte quatre couches plastiques 4, 5, 6, 7, deux couches externes 4, 7 et deux sous-couches 5, 6 ainsi que deux films 8, 9. Les couches 4, 7 sont des couches thermoplastiques de PC d'une épaisseur de l'ordre de 150 Mm. La sous-couche 5 est une couche thermoplastique de PVC d'une épaisseur de l'ordre de 190 pm et la sous- couche 6 est une couche thermoplastique de PVC d'une épaisseur de l'ordre de 300 gm. Les films 8, 9, qui recouvrent les couches 4, 7 The card body 2 has four plastic layers 4, 5, 6, 7, two outer layers 4, 7 and two sublayers 5, 6 as well as two films 8, 9. The layers 4, 7 are thermoplastic layers of PC with a thickness of the order of 150 mm. The sublayer 5 is a thermoplastic layer of PVC with a thickness of the order of 190 μm and the sublayer 6 is a thermoplastic layer of PVC with a thickness of the order of 300 gm. Films 8, 9, which cover layers 4, 7
sont transparents et ont une épaisseur de l'ordre de 50 pm. are transparent and have a thickness of the order of 50 μm.
La puce 3 est connectée, par sa face active munies de protubérances, à des bornes de l'antenne 11 sérigraphiée à la surface The chip 3 is connected, by its active face provided with protuberances, to terminals of the antenna 11 screen-printed on the surface
de la sous-couche 5. Elle est noyée dans la sous-couche 6. of the sublayer 5. It is embedded in the sublayer 6.
Pour la fabrication d'une carte selon le procédé de l'invention et, notamment, pour la fabrication de la carte sans contact montrée à la For the manufacture of a card according to the method of the invention and, in particular, for the manufacture of the contactless card shown in the
figure lB, on procède en différentes étapes. FIG. 1B, we proceed in different stages.
Dans une étape préalable, les films 8, 9 sont percés de trous 14 débouchants. Ainsi que cela est plus particulièrement montré à la figure In a preliminary step, the films 8, 9 are pierced with through holes 14. As is more particularly shown in the figure
3A, ces trous 14 sont sensiblement cylindriques de révolution. 3A, these holes 14 are substantially cylindrical of revolution.
Néanmoins, ils peuvent avoir l'aspect de fentes ou plus généralement de découpes quelconques. Le diamètre moyen desdits trous 14, avantageusement compris entre 0,2 et 1,4 mm, est par exemple de l'ordre de 0,8 mm. L'entraxe moyen entre ces trous 14, avantageusement compris entre 2 et 20 mm, est par exemple de l'ordre de 10 mm. Aussi, 0, 1 à 2,5 %, notamment 0,5 % de la surface des films 8, 9 est percée de trous 14. On notera que les moyens destinés au perçage des trous 14 peuvent être constitués d'un rouleau muni d'aiguilles de diamètre voulu, ce rouleau étant passé sur des bandes de However, they can have the appearance of slots or more generally of any cuts. The average diameter of said holes 14, advantageously between 0.2 and 1.4 mm, is for example of the order of 0.8 mm. The average spacing between these holes 14, advantageously between 2 and 20 mm, is for example of the order of 10 mm. Also, 0.1 to 2.5%, in particular 0.5% of the surface of the films 8, 9 is pierced with holes 14. It will be noted that the means intended for drilling the holes 14 may consist of a roller provided with needles of the desired diameter, this roller being passed over strips of
films pour un perçage à grande échelle. films for large-scale drilling.
Dans une autre étape préalable, on reporte la puce 3 munie de protubérances 15 sur la sous-couche 5 à la surface de laquelle on a préalablement sérigraphie ou gravé l'antenne 11. La puce 3, fixée sur la sous-couche 5 est alors connectée électriquement aux bornes de ladite In another preliminary step, the chip 3 provided with protuberances 15 is transferred to the sublayer 5 on the surface of which the antenna 11 has been screen-printed or engraved. The chip 3, fixed to the sublayer 5 is then electrically connected to the terminals of said
antenne 11.antenna 11.
Lesdites étapes préalables ayant été effectuées, on superpose la couche externe 4, la sous-couche 5 portant la puce 3, la sous-couche 6, la couche externe 7 et les films de surface 8, 9 de manière à former un ensemble superposé que l'on place entre des plateaux 16, 17 parallèles Said preliminary steps having been carried out, the outer layer 4 is superimposed, the sublayer 5 carrying the chip 3, the sublayer 6, the outer layer 7 and the surface films 8, 9 so as to form a superimposed assembly that we place between plates 16, 17 parallel
d'un dispositif de pressage (figure 2). a pressing device (Figure 2).
A cause, en particulier, de l'épaisseur de la puce 3, les couches 4, 5, 6, 7 et films 8, 9 de l'ensemble placé dans le dispositif de pressage ne sont pas strictement parallèles. Des poches d'air existent donc dans l'ensemble superposé et, en particulier, entre les films 8, 9 et les couches externes 4, 7 qui n'adhèrent pas auxdits films 8, 9 à ce stade Because, in particular, of the thickness of the chip 3, the layers 4, 5, 6, 7 and films 8, 9 of the assembly placed in the pressing device are not strictly parallel. Air pockets therefore exist in the superimposed assembly and, in particular, between the films 8, 9 and the outer layers 4, 7 which do not adhere to said films 8, 9 at this stage
du procédé de l'invention.of the process of the invention.
Néanmoins, dans une étape de colamination au cours de laquelle les plateaux 16, 17 du dispositif de pressage sont rapprochés l'un de l'autre et amenés, par exemple dans un four, à une température de l'ordre de 120 C, les couches 4, 5, 6, 7 et films 8, 9 sont soudés les uns aux autres, les poches d'air se vidant par les trous 14 débouchants However, in a colamination step during which the plates 16, 17 of the pressing device are brought close to each other and brought, for example in an oven, to a temperature of the order of 120 C, the layers 4, 5, 6, 7 and films 8, 9 are welded to each other, the air pockets emptying through the through holes 14
suffisamment larges pour permettre l'échappée de l'air. wide enough to allow air to escape.
Sous l'effet de la pression et de la chaleur, les trous 14 cicatrisent, c'est-à-dire se rebouchent. Cette cicatrisation est permise du fait d'un diamètre suffisamment restreint des trous 14. La carte 1, alors obtenue après avoir été retirée du dispositif de Under the effect of pressure and heat, the holes 14 heal, that is to say, fill up. This scarring is allowed because of a sufficiently small diameter of the holes 14. The card 1, then obtained after having been removed from the device
pressage, ne présente aucun défaut d'aspect. pressing, has no appearance defect.
En pratique, pour la fabrication en série des cartes à puce, les ensembles colaminés ont des dimensions bien plus larges que celles des cartes et comprennent plusieurs puces 3 (voir figures 2 et 4). Ainsi, il est possible de fabriquer plusieurs cartes à la fois, après une étape In practice, for the mass production of smart cards, the colaminated assemblies have much larger dimensions than those of the cards and comprise several chips 3 (see FIGS. 2 and 4). Thus, it is possible to make several cards at the same time, after a step
complémentaire de découpe des ensembles colaminés. complementary cutting of colaminated assemblies.
A cet égard, il doit être noté que les films 8, 9, qui devaient antérieurement être tendus à la surface des ensembles de manière à minimiser la formation des poches d'air, ne sont pas nécessairement tendus dans la mise en oeuvre de l'invention. Il est par suite possible de recouvrir les couches à colaminer d'un unique film 8, 9 fixé, à la manière montrée à la figure 4, à une même extrémité de l'ensemble. Cet unique film 8, 9 couvre alors, de même qu'une couverture d'un livre, In this regard, it should be noted that the films 8, 9, which previously had to be stretched over the surface of the assemblies so as to minimize the formation of air pockets, are not necessarily stretched in the implementation of the invention. It is therefore possible to cover the layers to be laminated with a single film 8, 9 fixed, as shown in Figure 4, at the same end of the assembly. This unique film 8, 9 then covers, like a book cover,
l'ensemble des couches 4, 5, 6, 7.the set of layers 4, 5, 6, 7.
Bien entendu, le procédé de l'invention, décrit ci-dessus au regard de la fabrication d'une carte sans contact, s'applique à la fabrication de cartes à contacts. En effet, des bulles d'air sont toujours présentes Of course, the method of the invention, described above with regard to the manufacture of a contactless card, applies to the manufacture of contact cards. Indeed, air bubbles are always present
entre les couches et films avant colamination. between layers and films before colamination.
Le procédé de l'invention s'applique par ailleurs à la fabrication de cartes par colamination dans le cas o les modules ou alors les puces ne sont pas présentes dans l'ensemble colaminé, mais sont reportés The method of the invention also applies to the manufacture of cards by colamination in the case where the modules or else the chips are not present in the colaminated assembly, but are carried over
dans une étape ultérieure.in a later step.
Claims (6)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9808015A FR2780338B1 (en) | 1998-06-24 | 1998-06-24 | METHOD FOR MANUFACTURING CHIP CARDS PROVIDED WITH SURFACE FILMS |
| GB9913355A GB2338684B (en) | 1998-06-24 | 1999-06-08 | A method of manufacturing chip cards fitted with surface films |
| DE1999128522 DE19928522A1 (en) | 1998-06-24 | 1999-06-22 | Method of manufacture for integrated circuit cards using hot lamination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9808015A FR2780338B1 (en) | 1998-06-24 | 1998-06-24 | METHOD FOR MANUFACTURING CHIP CARDS PROVIDED WITH SURFACE FILMS |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2780338A1 true FR2780338A1 (en) | 1999-12-31 |
| FR2780338B1 FR2780338B1 (en) | 2000-08-25 |
Family
ID=9527812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9808015A Expired - Fee Related FR2780338B1 (en) | 1998-06-24 | 1998-06-24 | METHOD FOR MANUFACTURING CHIP CARDS PROVIDED WITH SURFACE FILMS |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE19928522A1 (en) |
| FR (1) | FR2780338B1 (en) |
| GB (1) | GB2338684B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10054873C2 (en) * | 2000-11-06 | 2002-10-17 | Mada Marx Datentechnik Gmbh | Contactless chip card and method for producing such a chip card |
| DE10304777B4 (en) * | 2003-02-05 | 2006-11-23 | Infineon Technologies Ag | Method for producing a chip using a heat and pressure process using a thermoplastic material and apparatus for carrying out the method |
| US20070237932A1 (en) | 2006-04-05 | 2007-10-11 | Assa Abloy Ab | Thermally stable proximity identification card |
| DE102008035522A1 (en) | 2008-07-30 | 2010-02-04 | Mühlbauer Ag | Method for producing a device for wireless communication or a prelaminate for such a device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4350545A (en) * | 1979-10-12 | 1982-09-21 | Armen Garabedian | Method of laminating plastic sheets |
| EP0640940A2 (en) * | 1993-08-23 | 1995-03-01 | N.V. Nederlandsche Apparatenfabriek NEDAP | Contactless chip card |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19614808A1 (en) * | 1996-04-15 | 1997-10-16 | Giesecke & Devrient Gmbh | Process for production of data cards |
-
1998
- 1998-06-24 FR FR9808015A patent/FR2780338B1/en not_active Expired - Fee Related
-
1999
- 1999-06-08 GB GB9913355A patent/GB2338684B/en not_active Expired - Fee Related
- 1999-06-22 DE DE1999128522 patent/DE19928522A1/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4350545A (en) * | 1979-10-12 | 1982-09-21 | Armen Garabedian | Method of laminating plastic sheets |
| EP0640940A2 (en) * | 1993-08-23 | 1995-03-01 | N.V. Nederlandsche Apparatenfabriek NEDAP | Contactless chip card |
Also Published As
| Publication number | Publication date |
|---|---|
| GB9913355D0 (en) | 1999-08-11 |
| DE19928522A1 (en) | 1999-12-30 |
| GB2338684B (en) | 2000-09-06 |
| FR2780338B1 (en) | 2000-08-25 |
| GB2338684A (en) | 1999-12-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1442424B1 (en) | Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness | |
| EP1192594B1 (en) | Method for making laminated cards provided with an intermediate petg layer | |
| CA2702286C (en) | Radiofrequency identification device for passport and method for making same | |
| FR2673041A1 (en) | METHOD FOR MANUFACTURING INTEGRATED CIRCUIT MICROMODULES AND CORRESPONDING MICROMODULE. | |
| EP2461277B1 (en) | Method for manufacturing a chip device | |
| FR2520541A1 (en) | Mounting assembly for memory integrated circuit in bank card - comprises flexible film support carrying metallic connecting pads for chip connections | |
| FR2721733A1 (en) | Method for manufacturing a contactless card by overmolding and contactless card obtained by such a method. | |
| EP1185955B1 (en) | Method for making contactless cards by lamination | |
| WO2007048927A1 (en) | Method for producing a number of chip cards | |
| FR2782821A1 (en) | NON-CONTACT CHIP CARD MANUFACTURING PROCESS | |
| EP3317820B1 (en) | Electronic document such as a chip card with reduced metallization | |
| FR2780338A1 (en) | METHOD FOR MANUFACTURING CHIP CARDS PROVIDED WITH SURFACE FILMS | |
| FR2794266A1 (en) | METHOD FOR MANUFACTURING PORTABLE ELECTRONIC DEVICE WITH INTEGRATED CIRCUIT HAVING LOW COST DIELECTRIC | |
| EP0907929B1 (en) | Method for inserting an electronic module in a card body with electronic memory | |
| WO2000030032A1 (en) | Method for making a hybrid smart card by double face printing | |
| EP0915431B1 (en) | IC card and manufacturing method of such a card | |
| FR2797977A1 (en) | MANUFACTURING PROCESS OF A PORTABLE ELECTRONIC DEVICE INCLUDING AN OVERMOLDING STEP DIRECTLY ON THE SUPPORT FILM | |
| FR2938380A1 (en) | Support layer for wire antenna of microcircuit card, has contact pads comprising set of connection zones arranged outside standard area, on which connection with end of corresponding wire connection element is realized | |
| WO2005064533A1 (en) | Methods for the production of an external-contact-free card and card thus obtained | |
| FR2794265A1 (en) | METHOD FOR MANUFACTURING LOW COST CONTACT DIELECTRIC CONTACT CHIP CARDS | |
| FR2789505A1 (en) | METHOD FOR MANUFACTURING SMART CARD PORTABLE STORAGE MEDIUM | |
| FR2861483A1 (en) | Method for manufacturing universal serial bus (USB) key, involves adjusting in one step the thickness of circuit to level of contact pads to give thickness conforming to USB standard | |
| FR3044797A1 (en) | THIN PLASTIC CARD COMPRISING AN ELECTRONIC COMPONENT AND A FLAT-CONDUCTIVE FRAME AND METHOD OF MANUFACTURING THE SAME | |
| FR2999753A1 (en) | Method for manufacturing longitudinal series of contact type microcircuit cards i.e. smart card, involves locating network of integrated circuit in set of cavities, and rolling support band by roller so as to partially cut of cards | |
| EP2738714A1 (en) | Method for manufacturing an electric or electronic device with power or communication interface |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| CA | Change of address | ||
| CD | Change of name or company name | ||
| ST | Notification of lapse |
Effective date: 20080229 |