GB2334145B - Methods and apparatus for cleaning,rinsing and drying wafers - Google Patents

Methods and apparatus for cleaning,rinsing and drying wafers

Info

Publication number
GB2334145B
GB2334145B GB9900410A GB9900410A GB2334145B GB 2334145 B GB2334145 B GB 2334145B GB 9900410 A GB9900410 A GB 9900410A GB 9900410 A GB9900410 A GB 9900410A GB 2334145 B GB2334145 B GB 2334145B
Authority
GB
United Kingdom
Prior art keywords
rinsing
cleaning
methods
drying wafers
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9900410A
Other versions
GB9900410D0 (en
GB2334145A (en
Inventor
Glenn E Peterson
Eric Shurtliff
Chad Goudie
John Natalicio
Gregory A Olsen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Integrated Process Equipment Corp
Speedfam IPEC Corp
Speedfam Corp
Original Assignee
Integrated Process Equipment Corp
Speedfam IPEC Corp
Speedfam Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/676,546 external-priority patent/US5950327A/en
Application filed by Integrated Process Equipment Corp, Speedfam IPEC Corp, Speedfam Corp filed Critical Integrated Process Equipment Corp
Publication of GB9900410D0 publication Critical patent/GB9900410D0/en
Publication of GB2334145A publication Critical patent/GB2334145A/en
Application granted granted Critical
Publication of GB2334145B publication Critical patent/GB2334145B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
GB9900410A 1996-07-08 1997-07-08 Methods and apparatus for cleaning,rinsing and drying wafers Expired - Fee Related GB2334145B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/676,546 US5950327A (en) 1996-07-08 1996-07-08 Methods and apparatus for cleaning and drying wafers
US85520897A 1997-03-13 1997-03-13
PCT/US1997/011830 WO1998001892A1 (en) 1996-07-08 1997-07-08 Methods and apparatus for cleaning, rinsing, and drying wafers

Publications (3)

Publication Number Publication Date
GB9900410D0 GB9900410D0 (en) 1999-02-24
GB2334145A GB2334145A (en) 1999-08-11
GB2334145B true GB2334145B (en) 2001-08-22

Family

ID=27101574

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9900410A Expired - Fee Related GB2334145B (en) 1996-07-08 1997-07-08 Methods and apparatus for cleaning,rinsing and drying wafers

Country Status (6)

Country Link
JP (1) JP2002509643A (en)
KR (1) KR20000023597A (en)
DE (2) DE19781822B4 (en)
GB (1) GB2334145B (en)
TW (1) TW387093B (en)
WO (1) WO1998001892A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5954888A (en) * 1998-02-09 1999-09-21 Speedfam Corporation Post-CMP wet-HF cleaning station
WO1999053531A2 (en) * 1998-04-10 1999-10-21 Speedfam-Ipec Corporation Post-cmp wet-hf cleaning station
US6356091B1 (en) 1998-11-19 2002-03-12 Speedfam-Ipec Corporation Automatic wafer mapping in a wet environment on a wafer cleaner
US6368183B1 (en) * 1999-02-03 2002-04-09 Speedfam-Ipec Corporation Wafer cleaning apparatus and associated wafer processing methods
DE19904548C2 (en) * 1999-02-04 2001-07-05 Steag Micro Tech Gmbh Method and device for cleaning substrates
US6481447B1 (en) * 2000-09-27 2002-11-19 Lam Research Corporation Fluid delivery ring and methods for making and implementing the same
US6573522B2 (en) 2001-06-27 2003-06-03 Applied Matrials, Inc. Locator pin integrated with sensor for detecting semiconductor substrate carrier
JP3918981B2 (en) * 2001-10-03 2007-05-23 東京エレクトロン株式会社 Liquid processing apparatus and setting management method thereof
KR100791709B1 (en) * 2006-12-28 2008-01-03 동부일렉트로닉스 주식회사 Device and method for exposure of wafer
KR100929817B1 (en) * 2007-10-23 2009-12-07 세메스 주식회사 Substrate Processing Apparatus and Manufacturing Method of Substrate Processing Apparatus
KR101958874B1 (en) * 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
CN103839857B (en) * 2008-06-04 2017-09-19 株式会社荏原制作所 Substrate board treatment and method, substrate grasping mechanism and substrate grasping method
KR101097509B1 (en) * 2009-07-17 2011-12-22 주식회사 엠엠티 Apparatus for cleaning substrate
CN105665339B (en) * 2016-02-17 2018-04-06 上海华力微电子有限公司 A kind of drying device and drying means for groove profile wet method equipment
CN108649008A (en) * 2018-07-05 2018-10-12 睿力集成电路有限公司 One chip cleaning device and method for wafer cleaning after ion implanting
JP6892176B1 (en) * 2020-11-19 2021-06-23 不二越機械工業株式会社 Work cleaning device
CN215838789U (en) * 2021-07-16 2022-02-18 北京石头世纪科技股份有限公司 Base station and cleaning robot system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02250324A (en) * 1989-03-23 1990-10-08 Hitachi Ltd Manufacture of semiconductor device and cleaning apparatus used therefor
EP0412796A2 (en) * 1989-08-09 1991-02-13 Shin-Etsu Handotai Company Limited Automatic cleaning apparatus for disks
US5442828A (en) * 1992-11-30 1995-08-22 Ontrak Systems, Inc. Double-sided wafer scrubber with a wet submersing silicon wafer indexer
US5518552A (en) * 1992-05-28 1996-05-21 Tokyo Electron Limited Method for scrubbing and cleaning substrate

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5947457B2 (en) * 1982-11-15 1984-11-19 株式会社東芝 How to clean semiconductor wafers
US4517752A (en) * 1983-06-27 1985-05-21 Machine Technology, Inc. Splash retarder
US4519846A (en) * 1984-03-08 1985-05-28 Seiichiro Aigo Process for washing and drying a semiconductor element
DE3644854A1 (en) * 1985-07-31 1987-07-30 Speedfam Corp Workpiece holder
JPS6362673A (en) * 1986-09-01 1988-03-18 Speedfam Co Ltd Surface polishing machine associated with fixed dimension mechanism
JPS63224332A (en) * 1987-03-13 1988-09-19 Nec Corp Double side washing equipment for semiconductor wafer
DE3814706A1 (en) * 1988-04-30 1989-11-09 Philips & Du Pont Optical Process for depositing a thin metallic protective layer on an electrotype
US5357645A (en) * 1989-04-09 1994-10-25 System Seiko Co., Ltd. Apparatus for cleaning and drying hard disk substrates
DE4100526A1 (en) * 1991-01-10 1992-07-16 Wacker Chemitronic DEVICE AND METHOD FOR AUTOMATICALLY SEPARATING STACKED DISCS
JP2640698B2 (en) * 1991-07-31 1997-08-13 信越半導体株式会社 Automatic wafer cleaning equipment
JPH0547899A (en) * 1991-08-20 1993-02-26 Sharp Corp Wafer transfer arm
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
US5498199A (en) * 1992-06-15 1996-03-12 Speedfam Corporation Wafer polishing method and apparatus
US5483984A (en) * 1992-07-10 1996-01-16 Donlan, Jr.; Fraser P. Fluid treatment apparatus and method
US5485644A (en) * 1993-03-18 1996-01-23 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus
JPH0774225A (en) * 1993-09-02 1995-03-17 Toshiba Corp Conveyer apparatus
US5518542A (en) * 1993-11-05 1996-05-21 Tokyo Electron Limited Double-sided substrate cleaning apparatus
DE4408537A1 (en) * 1994-03-14 1995-09-21 Leybold Ag Device for the transport of substrates
US5779203A (en) * 1996-06-28 1998-07-14 Edlinger; Erich Adjustable wafer cassette stand

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02250324A (en) * 1989-03-23 1990-10-08 Hitachi Ltd Manufacture of semiconductor device and cleaning apparatus used therefor
EP0412796A2 (en) * 1989-08-09 1991-02-13 Shin-Etsu Handotai Company Limited Automatic cleaning apparatus for disks
US5518552A (en) * 1992-05-28 1996-05-21 Tokyo Electron Limited Method for scrubbing and cleaning substrate
US5442828A (en) * 1992-11-30 1995-08-22 Ontrak Systems, Inc. Double-sided wafer scrubber with a wet submersing silicon wafer indexer
US5529638A (en) * 1992-11-30 1996-06-25 Ontrak Systems, Inc. Method for wafer scrubbing

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IBM Technical Disclosure Bulletin, vol 17, no 2, 2/7/74, pg 427, "Wafer Processing", Carufe. *

Also Published As

Publication number Publication date
KR20000023597A (en) 2000-04-25
WO1998001892A1 (en) 1998-01-15
DE19781822B4 (en) 2004-09-09
DE19781822T1 (en) 1999-06-17
JP2002509643A (en) 2002-03-26
GB9900410D0 (en) 1999-02-24
TW387093B (en) 2000-04-11
GB2334145A (en) 1999-08-11

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20030708