GB2218111A - Coating metallic substrates by the PVD process - Google Patents
Coating metallic substrates by the PVD process Download PDFInfo
- Publication number
- GB2218111A GB2218111A GB8905734A GB8905734A GB2218111A GB 2218111 A GB2218111 A GB 2218111A GB 8905734 A GB8905734 A GB 8905734A GB 8905734 A GB8905734 A GB 8905734A GB 2218111 A GB2218111 A GB 2218111A
- Authority
- GB
- United Kingdom
- Prior art keywords
- nickel
- palladium
- alloy
- pvd process
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000576 coating method Methods 0.000 title claims description 56
- 238000000034 method Methods 0.000 title claims description 45
- 239000011248 coating agent Substances 0.000 title claims description 40
- 239000000758 substrate Substances 0.000 title claims description 29
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 80
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 45
- 229910052759 nickel Inorganic materials 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 26
- 238000005260 corrosion Methods 0.000 claims description 25
- 239000011229 interlayer Substances 0.000 claims description 24
- 230000007797 corrosion Effects 0.000 claims description 22
- 229910052763 palladium Inorganic materials 0.000 claims description 21
- 239000010410 layer Substances 0.000 claims description 19
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000010931 gold Substances 0.000 claims description 14
- 239000003792 electrolyte Substances 0.000 claims description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 13
- 229910052737 gold Inorganic materials 0.000 claims description 13
- 239000000956 alloy Substances 0.000 claims description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000004411 aluminium Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052804 chromium Inorganic materials 0.000 claims description 9
- 239000011651 chromium Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 8
- 125000001931 aliphatic group Chemical group 0.000 claims description 7
- -1 vinyl- Chemical class 0.000 claims description 7
- 239000000080 wetting agent Substances 0.000 claims description 7
- 239000000654 additive Substances 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 150000003839 salts Chemical class 0.000 claims description 6
- 229920002994 synthetic fiber Polymers 0.000 claims description 6
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 5
- 239000005864 Sulphur Substances 0.000 claims description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 5
- 239000011133 lead Substances 0.000 claims description 5
- 150000001247 metal acetylides Chemical class 0.000 claims description 5
- 150000004767 nitrides Chemical class 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 239000011701 zinc Substances 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 4
- UXJWUQMJUKSBSL-UHFFFAOYSA-M CCS([O-])(=O)=O.C(C1=CC=CC=C1)[N+]1=CC=CC=C1 Chemical class CCS([O-])(=O)=O.C(C1=CC=CC=C1)[N+]1=CC=CC=C1 UXJWUQMJUKSBSL-UHFFFAOYSA-M 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- 150000001447 alkali salts Chemical class 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 claims description 3
- 229910021332 silicide Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 125000003903 2-propenyl group Chemical class [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 238000007792 addition Methods 0.000 claims 1
- 238000005240 physical vapour deposition Methods 0.000 description 27
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229910018104 Ni-P Inorganic materials 0.000 description 4
- 229910018536 Ni—P Inorganic materials 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 239000010956 nickel silver Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 238000012505 colouration Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 159000000000 sodium salts Chemical class 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- IEORSVTYLWZQJQ-UHFFFAOYSA-N 2-(2-nonylphenoxy)ethanol Chemical compound CCCCCCCCCC1=CC=CC=C1OCCO IEORSVTYLWZQJQ-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910000792 Monel Inorganic materials 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910017974 NH40H Inorganic materials 0.000 description 1
- 241001275902 Parabramis pekinensis Species 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000001926 alkyl arylether group Chemical group 0.000 description 1
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
- RHZUVFJBSILHOK-UHFFFAOYSA-N anthracen-1-ylmethanolate Chemical compound C1=CC=C2C=C3C(C[O-])=CC=CC3=CC2=C1 RHZUVFJBSILHOK-UHFFFAOYSA-N 0.000 description 1
- 239000003830 anthracite Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- JXLHNMVSKXFWAO-UHFFFAOYSA-N azane;7-fluoro-2,1,3-benzoxadiazole-4-sulfonic acid Chemical compound N.OS(=O)(=O)C1=CC=C(F)C2=NON=C12 JXLHNMVSKXFWAO-UHFFFAOYSA-N 0.000 description 1
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229920000847 nonoxynol Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
- C23C14/025—Metallic sublayers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Description
2 2; 18 111 COATING METALLIC SUBSTRATES BY THE PU PROCESS The invention
relates to the application to metallic substrate materials of coatings produced by the PU process. PU stands for physical vapour deposition. It embraces both functional and decorative coatings. The common coating materials include borides, carbides, nitrides, oxides and silicides of metallic elements in subgroups 4 to 6 of the periodic system, viz., titanium, hafnium and vanadium, niobium, tantalum and chromium, molybdenum and tungsten, individually or in combinations. Particular interest centres on the carbides, nitrides and oxides of the subgroup 4 elements, since apart from the high hardness and wear resistance of such coating materials, which can be several times greater than those of hard chromium deposits, they can exhibit attractive decorative colourations resembling for example gold in the TiN case and anthracite in the TiC case. The coating materials in question can also contain suitable admixtures of other elements such as aluminium, cobalt, gold, carbon, copper, nickel and/or palladium, which extend the range of colourations to blue, green, red or silvery tints. Furthermore, the PU process can be used to deposit metallic materials such as aluminium, titanium, zirconium, platinum or gold, so that suitable equipment having more than one sputtering source can also produce combination coatings. Titanium for example can be superficially oxidised by subsequent chemical or electrochemical treatment, so that colourations extending over the full spectrum range can be produced. Moreover, the PU process can even deposit amorphous and/or diamond-like carbon, in order for example to produce particularly low-friction and slow-wearing sufaces.
The PVD process has proved succesful in many branches of technology (cf. GB-PS 2 123 039) and has led to substantial improvements in the quality of the coated products, provided that the substrate material itself is sufficiently corrosionresistant when the coated products are exposed to corrosive environments, as is the case when PVD coatings of titanium carbide or nitride are applied to austenitic chromium-nickel steel or solid titanium substrates. However, if the substrate material has too little corrosion resistance, or no resistance whatever, to the specific corrosive environments, then corrosion damage will eventually ensue in service. Thi s applies for example to metallic substrate materials such as aluminium, lead, copper, magnessium, nickel, silver, steel and zinc or their respective alloys such as brasses, bronzes, German silver, Monel, Alpacca, zinc pressure diecasting alloys, lead spincasting alloys and so on. Corrosion damage still ensues when such substrate materials have already been provided with an electrolytically or chemically deposited underlayer of the matte, bright, semi-bright or semi-matte type consisting of chromium, -copper, copper alloy, nickel, nickel alloy, silver or tin alloy or a combination thereof. The term nickel or nickel alloy coating includes the disperse Ni, Ni-P and Ni-B types. The same problem arises with galvanised synthetic materials such as, for example, ABS (acrylonitrile-butadiene-styrene) or mixed polymerisates such as polycarbonate/ABS (e.g., Bayblend - Bayer, Lever-kusen), V polypropylene etc., which are usually provided with an initial non- electrolytic metallic layer or chemically deposited copper, nickel- phosphorus or nickel-boron, an interlayer of bright copper and bright to semi-matte nickel and a final layer of bright chromium.
Corrosion damage arises because coatings applied by the PVD process, in the commonly used thickness range of 0.3 - 1 micron, are porous or microfissured, particularly if the deposition temperature is low and the environment has not been purified; they have a high pinhole concentration and can have a very high positive electrochemical potential. The source of the high pinhole concentration lies in the preferred spike crystal growth normal to the substrate surface, which is characteristic of the PVD deposition process; the spikes are incapable of spreading out sufficiently over the substrate surface and thereby forming a continuous uniform coating layer. These coating defects can disappear given a sufficient coating thickness, but this remedy would not be cost effective from the equipment productivity viewpoint, since the deposition rate in the PVD process is extremely low. Moreover, one can only adopt very low PVD processing temperatures in the range 100-1200C in many cases notably when coating synthetic materials, to avoid heating the latter to their Vicat softening point. In view of the extremely low processing temperatures, the PVD process is incapable in the majority of applications of producing truly sound coatings.
One could consider suppressing damaging corrosion phenomena by providing an interlayer of a very noble metal such as gold or platinum, which could not be deposited by the normal electroplating techniques, or at least which would not adhere tenaciously to a chormium-plated surface. Apart from the high costs this would involve, such interlayers would- be extremely soft, particularly in the case of gold, and could very easily be damaged in the course of applying further layers by the PVD process. Moreover, it is particularly deleterious to interpose a layer of low micro-hardness beneath a hard outer layer. Furthermore, tests have shown that interlayer materials such as gold often give rise to tenacity problems when coatings applied by the PVD process are mechanically loaded in shear.
Accordingly, the object of the invention is to improve the corrosion resistance and mechanical tenacity of PVD coatings in finishes comprising a substrate material having little or no corrosion resistance and a coating applied by the PVD process.
According to the present invention, a method of applying a coating to a metallic substrate material of little or no corrosion resistance by the PVD process comprises using an interlayer of palladium-nickel alloy containing 30-90 wt.% preferably 60-85 wtJ of palladium, deposited from an aqueous electrolyte containing palladium and nickel ammines at a palladium concentration in the range 2-20 g/l and a nickel concentration in the range 5-30 9/1, together with optional conductivity salts and organic additives which can contain sulphur, and wherein the electrolyte components are selected so that any sulphur precipitated with the alloy has a valency exceeding two.
The additives in the electrolyte can be aliphatic, unsaturated and/or heterocyclic sulphonates, optional conductivity salts, selected aromatic sulphonimides as tensile stress reducers and/or anti-corrosion additives, together with non-ionic and/or anion-active wetting agents, characterised in that the added aliphatic, unsaturated and/or heterocyclic sulphonates consist of one or more alkali salts (more particularly sodium salts) of vinyl- allyl-, propin-, methallyl- and/or N-benzylpyridinium-2-ethyl sulphonic acids, N-pyridiniumpropylsulphobetain and/or Npyridiniummethylsulphobetain.
The metallic substrate material can be aluminium, lead, copper, magnesium, nickel, silver, steel, zinc, alloy materials based thereon such as brass, bronze, German silver, Monel, Alpacca, zinc pressure diecasting alloys or lead spincasting alloys, in their common technical forms. Different substrate materials can be provided with, or different optical effects or technical properties can be obtained by, electrolytically or chemically depositing additional layers of matte, bright, semi-bright or semi-matte copper, copper alloy, nickel, nickel alloy, silver or tin alloy or combinations thereof. The term nickel and nickel alloy layers includes the disperse, Ni-P and Ni-B types. Alternatively, the metallic substrate material can itself be an electroplate coating on a galvanisable synthetic material component, including single or combined layers of matte, bright, semi-bright or semi-matte copper, copper alloy, nickel, nickel alloy, silver or tin alloy. It is obvious that the palladium-nickel alloy cannot be deposited by the usual electroplating processes, at least as a tenacious coating on chromium-pl;ted substrates.
Palladium-nickel alloy coatings adapted and produced in the specified manner are surprisingly immune from damage when handled in conformity with the invention, even when the interlayer in question is applied extremely thinly. The palladium-nickel layer has a far higher micro- hardness, and resists possible damage during subsequent PVD processing much better than a comparable interlayer of pure gold. Even if the substrate material usually suffers severe corrosion in service, the problems disappear when the features of the invention are adopted. The palladium-nickel alloy coatings used in the special manner of the invention are in themselves known (of. DE-PS 31 08 508 and DE-PS-32 32 735). Moreover, there are no adhesion problems when the coating applied by the PVD process is loaded mechanically in shear.
According to a preferred embodiment of the invention, described in a different formulation, the invention relates to a process for the application of a PVD coating to a substrate material having little or no corrosion resistance, whereby an interlayer of a palladium-nickel alloy is first applied to the substrate material, by deposition from an aqueous solution containing palladium and nickel ammines at a palladium concentration in the range 2-20 g/l and a nickel concentration in the range 5-30 g/l, together with added aliphatic, unsaturated and/or heterocyclic sulphonatesq optional S conductivity salts, selected aromatic sulphonimides as tensile stress reducers and/or anti-corrosion additives (benzene-acidsulphonimide and/or benzene-sulphonyl resin) and further nonionic and/or anion-active wetting agents the palladium to nickel ratio in the electrolyte being so adjusted that the electrolytically deposited alloy has a palladium content in the range 30-90 wt.%, preferbly 60-85 wt.%, and the additive consisting of an aliphatic, unsaturated and/or heterocyclic sulphonate of the alkali salt type, more particularly such as one or more of the sodium salts of vinyl-, allyl-, propin-, methallyland/or N-benzylpyridinium-2-ethyl-sulphonic acids, N-pyridiniumpropylsulphobetain and/or N- pyridiniummethylsulphobetain.
The introduction already referred to known coatings for application by the PVD process. It is within the scope of the invention to use PVD coatings consisting of borides, carbides, nitrides, oxides and/or silicides of metallic elements in subgroups 4 to 6 of the periodic system, individually or in combination. More particularly they can be carbides, nitrides and/or oxides of subgroup 4 elements, such as TiN or TiC or mixtures of different substances, which can furthermore contain certain amounts of aluminium, cobalt, gold, carbon, copper, nickel and/or palladium. Alternatively, the PVD coatings can be of a metallic nature, such as aluminium, titaniumt zirconium, gold, platinum and so o n. They can even consist of amorphous and/or diamond-like carbon.
Evidently, if may also be necessary, depending on the nature of the substrate material, to provide another electrolytically deposited coating bef ore applying the palladium-nickel interlayer, in order for example to improve the surface finish of the substrate material by smoothing coatings, to ensure the adequate tenacity of the palladiumnickel layer, to attain special semi-bright surface effects, or in the case of synthetic materials to attain an adequate thermal shock resistance within the coated composite product by providing a copper underlayer of maximum possible thickness. The range likewise includes the disperse nickel, Ni-P and Ni-B coating types, which provide outstandingly hard underlayers for example. It is also evident that when coating electroplated synthetic materials the PVD processing temperature must be adjusted to conform to their Vicat softening point limits. - Palladium- nickel coatings cannot be applied by conventional electroplating means, at least because of their lack of tenacity to surfaces which have not been chromium-plated.
In order to ensure that the palladium-nickel interlayer is absolutely or substantially free from pores, its thickness is preferably adjusted in conformity with the surface finish of the substrate material and/or the electrolytically deposited underlayer thereon, and should be at least 0.1 micron. The coating thickness 'is preferably adjusted to the depth of roughness grooves on the substrate material or the underlayer deposited thereon. In other words, the palladium-nickel interlayer thickness is increased as the roughness grooves on the substrate surfaces become deeper. Average coating thicknesses lie in the range 0.5 to 5 microns. The PVD coating should preferably have a thickness in the range 0.1 to 5 microns, more preferably 0.3 to 1 micron. It is obvious that the PVD processing parameters should preferably be so adjusted that the coating will contain an absolute minimum of continuity defects (porosity, microfissures, pinholes).
The invention and the advantages accruing therefrom will now be discussed with reference to typical embodiments thereof.
ExampIg 1 Sheets of grade Ms 58 brass are cleaned, electrolytically degreased and pickled in conformity with the known rules of electroplating technology; they are then electroplated to thickness of ca. 1 micron in a copper cyanide bath, ca. 7 microns in a bright nickel bath and ca. 0.3 mirons in a sulphuric acid bright chromium bath.
Before applying PVD coating, the prepared sheets are cleaned ultrasonically, first in emulsifier-containing Freon (Du Pont product TWD 602) and f inally in Freon TF, prior to applying a TiN layer ca. 0.5 microns thick by the PVD process. The cleaning in Freon products prior to PVD coating is to be recommended as a means of removing any and all dirt and fingermarks before fixing in the special carrier frames for the PVD process.
The processed test sheets are then subjected to various corrosion tests, each of 72 hours duration, in condensate alternating with an atmosphere containing S02 test SFW 2.0 S, DIN 50 018, or acetic acid/salt-spray test ESS, DIN 50 021. The test sheets suffer serious pitting corrosion, with ca. 2-3 pores/cm2. Some of the test sheets are usually corroded all through.
Example
The bright chromium layer of test sheets prepared in a similar manner to those in Example 1 is replaced by a layer 1 to 1.5 microns thick of the palladium-nickel alloy of the invention; the rest of the coating treatments remain the same. They now remain sound after any of the 72 hour corrosion tests.
Palladium-nickel electrolytes in accordance with the invention can contain:
6 g palladium as 9 g nickel as g conductivity salt as 2.5 g sodium allysulphonate, optionally together with EPd(NH3)43C12 [Ni(NH3)63S04 M4)2S04 g benzene-acid-sulphonimide, sodium salt or:
2 g benzene-sulphonyl resin and as wetting agent:
0.5 g nonylphenolethoxylate (23 EO) NH40H to maintain a pH of 8-8.5, water to make up to 1 litre; z electrolyte temperature 25 - 300C gentle workpiece agitation cathode current density 1 AMm2 immersion period 4 - 6 minutes anodes of platinised titanium or graphite.
The non-ionic wetting agent can be replaced by selected anion-active tensides based on alkyl- and alkylarylether sulphonates such as 1 g/1 H 3C(CH2)12/14-0-(CH2-CH2-0)n-CH2-CH2-CH2-SO3K, with n = 11.
Since such wetting agents have no cloudiness point, it is now possible to use bath temperatures of for example 40500C. This simultaneously further improves the brightness of the coating.
Example
The substrate material used in Examples 1 and 2 is replaced by grade C 45 WN 1.0503 steel. The results are the same, i.e., a Pd/Ni interlayer is essential because of the corrosion problems.
Example 4
An additional 0.1 microns of 23 ct-gold/nickel alloy is sputtered on the final PU coating of titanium nitride. The corrosion problems in Example 1 are even further aggravated, whereas the Pd/Ni interlayer as used in Example 2 to replace the bright chromium interlayer eleminates the corrosion phenomena entirely.
Example 5
Titanium nitride can be replaced by titanium carbide, 1 titanium-aluminium carbonitride, titanium metal etc. The same corrosion differences as those between Examples 1 and 2 are again obtained.
Example 6
A test sheet of Bayblend T 45 MN is first nickel plated by the usual chemical process used in elec.troplating technology and the chemically deposited Ni-P coating is prestrengthened electrolytically in a Wattstype bath. Next, 20 - 30 microns of bright copper and 10 microns of semibright nickel are deposited in sulphuric acid-type baths. If a final PU coating is applied directly on the semi-bright nickel plate, the corrosion resistance tests as in Example 1 again result in failure. However, as soon as an interlayer of palladium/nickel is applied as in Example 2, corrosion resistance is immediately fully restored.
E x a mp--1-e 7 The bright chromium layer of thickness 0.3 microns, as used in Example 1, is replaced by 0.1 microns of pure gold deposited electrolytically in a conventional bath, and the M cover layer is then applied. Apart from their poor corrosion resistance, the specimens fail durability tests in a burnishing drum or using conventional polishing agents: the hard outer coating is systematically sheared off the gold interlayer. When one uses the palladium/nickel interlayer of the invention, the M cover layer becomes outstandingly tenacious; thus, the gold interlayer is too sensitive to shearing forces.
E.xaaxpl-c 8 I 2 1 For applications which make no special demands with respect to superior decorative brightness in the Palladium/nickel interlayer, and more particularly for any technical applications, it is equally possible to use Palladium/nickel electrolytes which contain no aliphatic, unsaturated and/or heterocyclic sulphonates and no aromatic sulphonimides. The palladium/nickel interlayer still produces the necessary corrosion resistance, and at the same time makes the subsequently applied PVD coating outstandingly tenacious, provided that any sulphur co-deposited therewith has a valency exceeding two. The electrolyte composition is:
6 g palladium as g nickel as Pd(NH3)4 CL2 Ni(NH 3)6S04 or (H2NS03)23i. 4H20 - 100 g conductivity salt as M4)2S04 or H2NS03NH4 optionally together with, as a wetting agent:
1 g H3C-(CH2)12/14-0-(CH2-CH2-0)n-CH2-CH2-CH2-SO3 K, with n = 11 NH4CH to maintain a pH of 8 - 8.5, water to make up to 1 litre; electrolyte temperature 40 - 500C gentle workpiece agitation cathode current density 1 A/dm2 immersion period 4 - 6 minutes anodes of platinised titanium or graphite.
The specimens are tested as described in Example 2 and give the same results as those in Example 2.
A
Claims (15)
1 A method of applying a coating to a metallic substrate material of little or no corrosion resistance by the PVD process comprising using an interlayer of palladium-nickel alloy containing 30 - 90 wt.% of palladium, deposited from an aqueous electrolyte containing palladium and nickel ammines at a palladium concentration in the range 2-20 g/l and a nickel concentration in the range 5-30 g/l, wherein the electrolyte components are selected so that any sulphur precipitated with the alloy has a valency exceeding two.
2. A method as in Claim 1, wherein the palladiumnickel alloy contains 60 85 wt.% of palladium.
3. A method as in Claim 1 or Claim 2, wherein the electrolyte contains conductivity salts and organic additions which contain sulphur.
4. A method as in any one of Claims 1 to 3, wherein the electrolyte contains, as additives, aliphatic, unsaturated and/or heterocyclic sulphonates, selected aromatic sulphonimides as tensile stress reducers and/or anti-corrosion additives, together with non-ionic and/or anionactive wetting agents, the added aliphatic, unsaturated and/or heterocyclic sulphonates consisting of one or more alkali salts of vinyl-, allyl-, propin-, methallyl- and or N-benzylpyridinium-2-ethyl sulPhonic acids, N-pyridiniumpropylsulphobet6in and/or Npyridiniummethylsulphobetain.
5. A method as in any one of Claims 1 to 4, wherein the metallic substrate material is aluminium, lead, copper, magnesium, nickel, silver, steel, zinc or an alloy material 4 V based thereon, and wherein it is further provided with an electrolytically or chemically deposited layer or layers of matte, bright, semi-bright or semi-matte copper, copper alloy, nickel, nickel alloy, silver or tin alloy or combinations thereof.
6. A method as in any one of Claims 1 to 4, wherein the metallic substrate material is itself an electroplate coating on a galvanisable synthetic material, more particularly single or combined layers of matte, bright, semibright or semi-matte copper, copper alloy, nickel, nickel alloy, silver or tin alloy.
7. A method as in any one of Claims 1 to 6, wherein the coating applied by the PVD process consists of one or more borides, carbides, nitrides, oxides and/or silicides of subgroup 40 to 6 elements of the periodic system.
8. A method as in Claim 7, wherein the coating applied by the PVD process can contain certain amounts of additional aluminium, cobalt, gold, carbon, copper, nickel and/or palladium.
9. A method as in any one of Claims 1 to 6, wherein the coating applied by the PVD process consists of metallic aluminium, titanium, zirconium or tantalum, which can be subsequently superficially oxidised by chemical or electrochemical means.
10. A method as in any one of Claims 1 to 6, wherein the coating applied by the PVD process consists of amorphous and/or diamond-like carbon.
11. A method as in any one of Claims 1 to 10, 4 wherein in order to produce an absolutely or at least substantially pore- free palladium-nickel interlayer, its thickness is adjusted to the depth of the roughness grooves on the substrate material and/or the electrolytically deposited underlayer thereon, and is at least 0.1 microns.
12. A method as in Claim 11, wherein the average thickness of the palladium-nickel interlayer is in the range 0.5 to 5 microns.
13. A method as in any one of Claims 1 to 12, wherein the thickness of the coating applied by the PVD process is in the range 0.1 to 5 microns.
14. A method as in Claim 13, wherein the thickness of the coating applied by the PVD process is in the range 0.3 to 1 micron.
15. A method as in any of Claims 1 to 14, more particularly for applying coatings having technical functions wherein the combination of a palladium-nickel interlayer and the cover coating applied by the PVD process is a substitute for hard chromium finishes.
Published 1989 at The Patent Office.Stale House.6671 High R0ITJc"r-Lo_-. don V.CiR 4TP. Further copiesmaybe obtainedfrOln ThePatentOffice Sales Branch, St Mary Cray, Orpington. Kent BP_9 3RD. Printea by W'iltiplex techniques ltd, St Mary Cray. Kell.. Con. 1167 1 l
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3809139A DE3809139A1 (en) | 1988-03-18 | 1988-03-18 | USE OF A PALLADIUM / NICKEL ALLOY LAYER AS AN INTERMEDIATE LAYER BETWEEN A NON-CORROSION-RESISTANT OR LESS-CORROSION-RESISTANT METAL BASE MATERIAL AND A COATING APPLIED BY THE PVD PROCESS |
Publications (3)
Publication Number | Publication Date |
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GB8905734D0 GB8905734D0 (en) | 1989-04-26 |
GB2218111A true GB2218111A (en) | 1989-11-08 |
GB2218111B GB2218111B (en) | 1992-05-06 |
Family
ID=6350105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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GB8905734A Expired - Lifetime GB2218111B (en) | 1988-03-18 | 1989-03-13 | Coating metallic substrates by the pvd process |
Country Status (5)
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JP (1) | JPH0277585A (en) |
CH (1) | CH677366A5 (en) |
DE (1) | DE3809139A1 (en) |
GB (1) | GB2218111B (en) |
HK (1) | HK141294A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0627496A2 (en) * | 1993-06-02 | 1994-12-07 | Andritz-Patentverwaltungs-Gesellschaft m.b.H. | Method and device for coating metal substrates, especially steel- and aluminium-sheets in shape of tapes |
GB2327091A (en) * | 1997-07-09 | 1999-01-13 | Masco Corp | Process for applying protective and decorative coating on an article |
EP1178128A1 (en) * | 2000-07-31 | 2002-02-06 | Ga-Tek, Inc. (dba Gould Electronics, Inc.) | Method of forming chromium coated copper for printed circuit boards |
WO2007144336A2 (en) * | 2006-06-13 | 2007-12-21 | Wolf-Dieter Franz | Cr(vi)-free black chroming |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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DE4006550C1 (en) * | 1990-02-15 | 1991-06-27 | Anke Gmbh & Co. Kg Oberflaechentechnik, 4300 Essen, De | Textured rolls for processing steel etc. - have electrolytical treated, surface deposited with chromium coated with nitride by PVD or CVD |
US5252360A (en) * | 1990-03-15 | 1993-10-12 | Huettl Wolfgang | Process for the protection of an engraved roll or plate by coating an engraved surface with an interlayer and thereafter applying a wear-resistant layer to the interlayer by PVD |
DE4008254A1 (en) * | 1990-03-15 | 1991-09-19 | Huettl & Vester Gmbh | METHOD FOR PRODUCING ENGRAVED ROLLS OR PLATES |
US5384201A (en) * | 1991-05-31 | 1995-01-24 | Robert Bosch Gmbh | Tool for treating surfaces of structural parts and carrier material for the same |
DE4232429A1 (en) * | 1992-09-28 | 1994-03-31 | Bosch Gmbh Robert | Tool for the treatment of surfaces of components and carrier material for this tool |
AU2001240599A1 (en) * | 2000-02-07 | 2001-08-14 | Cis Solartechnik Gmbh | Flexible metal substrate for cis solar cells, and method for producing the same |
DE10303650A1 (en) * | 2003-01-27 | 2004-07-29 | Hansgrohe Ag | Coating of objects such as plastic sprays comprises application of a layer of copper, nickel or a copper-nickel alloy, mechanical surface treatment of at least the outer applied layer and application of a palladium-nickel layer |
DE102004010762B4 (en) * | 2004-03-05 | 2006-06-29 | Daimlerchrysler Ag | composite component |
CN110885996A (en) * | 2019-12-25 | 2020-03-17 | 东莞立德精密工业有限公司 | Hardware surface treatment process and hardware |
CN114540813A (en) * | 2022-02-24 | 2022-05-27 | 瑞鼎机电科技(昆山)有限公司 | PVD (physical vapor deposition) coating process for pressing plate of coffee machine |
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EP0089818A3 (en) * | 1982-03-23 | 1985-04-03 | United Kingdom Atomic Energy Authority | Coatings for cutting blades |
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- 1988-03-18 DE DE3809139A patent/DE3809139A1/en active Granted
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- 1989-02-20 CH CH592/89A patent/CH677366A5/de not_active IP Right Cessation
- 1989-03-13 GB GB8905734A patent/GB2218111B/en not_active Expired - Lifetime
- 1989-03-15 JP JP1061083A patent/JPH0277585A/en active Pending
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GB1318387A (en) * | 1969-09-29 | 1973-05-31 | Ibm | Magnetic film structures and their manufacture |
GB1318818A (en) * | 1970-02-27 | 1973-05-31 | Magyar Tudomanyos Akademia | Method of producing a non-porous thin surface film on a substrate by vapour deposition in a vacuum |
GB1358233A (en) * | 1971-04-20 | 1974-07-03 | Ver Flugtechnische Werke | Deposition of a silver layer on titanium or titanium-based alloy |
EP0183852A1 (en) * | 1984-05-24 | 1986-06-11 | Electroplating Engineers of Japan Limited | High-purity palladium-nickel alloy plating bath, process therefor and alloy-covered articles and gold- or gold alloy-covered articles of alloy-covered articles |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0627496A2 (en) * | 1993-06-02 | 1994-12-07 | Andritz-Patentverwaltungs-Gesellschaft m.b.H. | Method and device for coating metal substrates, especially steel- and aluminium-sheets in shape of tapes |
EP0627496A3 (en) * | 1993-06-02 | 1995-06-14 | Andritz Patentverwaltung | Method and device for coating metal substrates, especially steel- and aluminium-sheets in shape of tapes. |
AT400040B (en) * | 1993-06-02 | 1995-09-25 | Andritz Patentverwaltung | METHOD AND DEVICE FOR COATING METAL SUBSTRATES, IN PARTICULAR STEEL OR ALUMINUM SHEETS IN STRIP SHAPE |
US5616362A (en) * | 1993-06-02 | 1997-04-01 | Andritz-Patentverwaltungs-Gesellschaft M.B.H. | Process and apparatus for the coating of metal |
GB2327091A (en) * | 1997-07-09 | 1999-01-13 | Masco Corp | Process for applying protective and decorative coating on an article |
GB2327091B (en) * | 1997-07-09 | 2002-06-05 | Masco Corp | Process for applying protective and decorative coating on an article |
EP1178128A1 (en) * | 2000-07-31 | 2002-02-06 | Ga-Tek, Inc. (dba Gould Electronics, Inc.) | Method of forming chromium coated copper for printed circuit boards |
CN100465341C (en) * | 2000-07-31 | 2009-03-04 | 尼科原料美国公司 | Method for forming copper for chrome-plating of printed circuit board |
WO2007144336A2 (en) * | 2006-06-13 | 2007-12-21 | Wolf-Dieter Franz | Cr(vi)-free black chroming |
EP1876268A1 (en) | 2006-06-13 | 2008-01-09 | Wolf-Dieter Franz | Black chromium process free of Cr-VI |
WO2007144336A3 (en) * | 2006-06-13 | 2008-02-28 | Wolf-Dieter Franz | Cr(vi)-free black chroming |
Also Published As
Publication number | Publication date |
---|---|
JPH0277585A (en) | 1990-03-16 |
HK141294A (en) | 1994-12-23 |
DE3809139C2 (en) | 1990-04-05 |
GB2218111B (en) | 1992-05-06 |
GB8905734D0 (en) | 1989-04-26 |
CH677366A5 (en) | 1991-05-15 |
DE3809139A1 (en) | 1989-09-28 |
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