GB2174847A - Making printed circuit boards - Google Patents

Making printed circuit boards Download PDF

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Publication number
GB2174847A
GB2174847A GB08511811A GB8511811A GB2174847A GB 2174847 A GB2174847 A GB 2174847A GB 08511811 A GB08511811 A GB 08511811A GB 8511811 A GB8511811 A GB 8511811A GB 2174847 A GB2174847 A GB 2174847A
Authority
GB
United Kingdom
Prior art keywords
components
board
circuit boards
sealed
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB08511811A
Other versions
GB8511811D0 (en
Inventor
Frederick Guyatt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB08511811A priority Critical patent/GB2174847A/en
Publication of GB8511811D0 publication Critical patent/GB8511811D0/en
Publication of GB2174847A publication Critical patent/GB2174847A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

A pressing tool carrying a circuit pattern is used to impress the pattern on a plain plastic base. Components are then assembled on the base and the base is placed in a moulding box to set the components in position and provide a durable protection. When cool the base is ejected from the box.

Description

Description
The designer provides the master drawing of the circuit. Engraved on to a master plate to manufacture the pressing tool. A roll of plastic strip is pressed with pattern and cut to size. Operators assemble components (not fixed) to the base, check and put into moulding boxes. (Figure I) Mould machine sets components in place (Figure 2) and provides a durable protection. The box travels through a joining machine (Figure 3.). The box is cooled and finished flush. The face is protected. The final operation is to eject circuit from box.
CLAIMS 1. A channel circuit board with a surface impression of holes and channels lined with a conductive material joining the components in a electric or electronic circuit.
2. The channel circuit board as claimed in claim 1 is manufactured in stages A.B.C. of the description.
3. The channel circuit board as claimed in claim 2 has a pressed channel for the track lined with a conductive material. A pressed hole for the component lead or terminal leg.
4. The channel circuit board as claimed in claim 3 uses conductive resin as a medium to fill channels and fix component. Stages C and F of the description.
5. The channel circuit board as claimed in claim 3 uses metallic foil and solder to fill channel and component. Stage C and F.
6. The channel circuit board as claimed in claim 3 uses metallic filings such as brass filings and solder to fill channel and join components. Stages C. F. of the description.
7. The channel circuit board as claimed in claims 4.5. and 6. enable further surface treatment to be carried out without damaging the circuit.
8. The channel circuit board as claimed in claim 7 can be put together with similar boards, assembled in layers, or shaped to suit various containers. Stage G G of the description.

Claims (1)

  1. SPECIFICATION To enable own process and machine assembly of electronic circuit boards.
    Background Circuit boards of the printed type are in popular use.
    A plain board with all the components in place before joining, joined, sealed, machined and protected can be made to the specification of the individual design of the user.
    Technical feature This manufacture technique provides a sealed and complete circuit board from a plain plastic base, to include the assembly of the components; the sealing; the joining; the machining and the treating of a durable protective finish.
    Example The basic stages are shown here.
    A) Engraving the master plate to produce die.
    B) Making the die.
    C) Pressing and cropping the board to size.
    D) Assemble the components and check.
    E) Seal components and board in special boxes.
    F) Join components.
    G) Machine.
    H) Protect with coating.
    I) Eject.
GB08511811A 1985-05-09 1985-05-09 Making printed circuit boards Withdrawn GB2174847A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08511811A GB2174847A (en) 1985-05-09 1985-05-09 Making printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08511811A GB2174847A (en) 1985-05-09 1985-05-09 Making printed circuit boards

Publications (2)

Publication Number Publication Date
GB8511811D0 GB8511811D0 (en) 1985-06-19
GB2174847A true GB2174847A (en) 1986-11-12

Family

ID=10578902

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08511811A Withdrawn GB2174847A (en) 1985-05-09 1985-05-09 Making printed circuit boards

Country Status (1)

Country Link
GB (1) GB2174847A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990013990A2 (en) * 1989-05-02 1990-11-15 Hagner George R Circuit boards with recessed traces
US5055637A (en) * 1989-05-02 1991-10-08 Hagner George R Circuit boards with recessed traces

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB859047A (en) * 1957-01-12 1961-01-18 Armstrong Whitworth Co Eng A method of forming a base, or terminal board, for an electronic circuit
GB2033667A (en) * 1978-11-06 1980-05-21 Powers C D Improvements in circuit boards
EP0037988A1 (en) * 1980-04-11 1981-10-21 Braun Aktiengesellschaft Method of applying electrically conductive paths to an insulating support
EP0051378A2 (en) * 1980-11-03 1982-05-12 AMP INCORPORATED (a New Jersey corporation) Circuit board having cast circuitry and method of manufacture
EP0138673A2 (en) * 1983-09-21 1985-04-24 Allied Corporation Method of making a printed circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB859047A (en) * 1957-01-12 1961-01-18 Armstrong Whitworth Co Eng A method of forming a base, or terminal board, for an electronic circuit
GB2033667A (en) * 1978-11-06 1980-05-21 Powers C D Improvements in circuit boards
EP0037988A1 (en) * 1980-04-11 1981-10-21 Braun Aktiengesellschaft Method of applying electrically conductive paths to an insulating support
EP0051378A2 (en) * 1980-11-03 1982-05-12 AMP INCORPORATED (a New Jersey corporation) Circuit board having cast circuitry and method of manufacture
EP0138673A2 (en) * 1983-09-21 1985-04-24 Allied Corporation Method of making a printed circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990013990A2 (en) * 1989-05-02 1990-11-15 Hagner George R Circuit boards with recessed traces
WO1990013990A3 (en) * 1989-05-02 1991-01-10 George R Hagner Circuit boards with recessed traces
US5055637A (en) * 1989-05-02 1991-10-08 Hagner George R Circuit boards with recessed traces

Also Published As

Publication number Publication date
GB8511811D0 (en) 1985-06-19

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)