GB2154921B - Device for attaching modular electronic components to or removing them from an insulative substrate - Google Patents

Device for attaching modular electronic components to or removing them from an insulative substrate

Info

Publication number
GB2154921B
GB2154921B GB08504536A GB8504536A GB2154921B GB 2154921 B GB2154921 B GB 2154921B GB 08504536 A GB08504536 A GB 08504536A GB 8504536 A GB8504536 A GB 8504536A GB 2154921 B GB2154921 B GB 2154921B
Authority
GB
United Kingdom
Prior art keywords
electronic components
insulative substrate
modular electronic
attaching modular
attaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08504536A
Other versions
GB2154921A (en
GB8504536D0 (en
Inventor
Robert Fridman
John B Holdway
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pace Inc
Original Assignee
Pace Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/583,218 external-priority patent/US4605152A/en
Priority claimed from US06/595,606 external-priority patent/US4620659A/en
Priority claimed from US06/649,065 external-priority patent/US4659004A/en
Application filed by Pace Inc filed Critical Pace Inc
Publication of GB8504536D0 publication Critical patent/GB8504536D0/en
Publication of GB2154921A publication Critical patent/GB2154921A/en
Application granted granted Critical
Publication of GB2154921B publication Critical patent/GB2154921B/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB08504536A 1984-02-24 1985-02-21 Device for attaching modular electronic components to or removing them from an insulative substrate Expired GB2154921B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US06/583,218 US4605152A (en) 1984-02-24 1984-02-24 Device for attaching modular electronic components to or removing them from an insulative substrate
US06/595,606 US4620659A (en) 1984-04-02 1984-04-02 Device for attaching modular electronic components to or removing them from an insulative substrate
US06/649,065 US4659004A (en) 1984-02-24 1984-09-10 Device for attaching modular electronic components to or removing them from an insulative device

Publications (3)

Publication Number Publication Date
GB8504536D0 GB8504536D0 (en) 1985-03-27
GB2154921A GB2154921A (en) 1985-09-18
GB2154921B true GB2154921B (en) 1988-06-08

Family

ID=27416398

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08504536A Expired GB2154921B (en) 1984-02-24 1985-02-21 Device for attaching modular electronic components to or removing them from an insulative substrate

Country Status (3)

Country Link
DE (1) DE3506315A1 (en)
FR (1) FR2560477A1 (en)
GB (1) GB2154921B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1293653C (en) * 1985-10-23 1991-12-31 Bradford W. Coffman Nozzle device
ATE90247T1 (en) * 1987-08-31 1993-06-15 Siemens Ag SOLDERING HEAD FOR SOLDERING OR SOLDERING COMPONENTS BY HEATING BY HOT GAS, ESPECIALLY FOR SURFACE MOUNT COMPONENTS (SMD).
US4972990A (en) * 1988-02-22 1990-11-27 Pace Incorporated Apparatus for removal and installing electronic components with respect to a substrate
US4971554A (en) * 1988-08-30 1990-11-20 Semiconductor Equipment Corporation Multi-nozzle surface mount rework system
DE3834049A1 (en) * 1988-10-06 1990-04-12 Peter Gammelin Device for soldering and desoldering SMD components (surface mounted devices)
GB2234461B (en) * 1989-07-10 1993-11-10 Automated Integrated Diagnosis Desoldering method and apparatus for integrated circuits
EP0426919B1 (en) * 1989-11-10 1993-10-20 William Samuel Fortune Hot gas soldering system
DE9113986U1 (en) * 1991-11-11 1992-04-16 Zevac Auslötsysteme GmbH, 3548 Arolsen Soldering device for soldering and desoldering electrical components
DE9304784U1 (en) * 1993-03-29 1993-08-05 Cooper Tools GmbH, 74354 Besigheim Soldering/desoldering device, especially for integrated circuits

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE650062A (en) * 1963-07-05
CH477149A (en) * 1967-05-30 1969-08-15 Konstantinov Konstantin Alexee Machine for manufacturing tubes from metal strip, in particular contact sleeves, and for arranging the tubes in a board of a printed circuit
US3912153A (en) * 1974-11-18 1975-10-14 Gen Motors Corp Method and apparatus for bonding semiconductor pill-type components to a circuit board
DE2500673C3 (en) * 1975-01-09 1980-02-07 Anatoly Aleksandrovitsch Osipov Device for soldering a series of soldering points arranged on an electrical circuit board
US4151945A (en) * 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
FR2435884A1 (en) * 1978-09-07 1980-04-04 Cit Alcatel WELDING MACHINE FOR A CONNECTOR TO A PRINTED CIRCUIT PLATE
DE2841868C3 (en) * 1978-09-26 1981-11-05 Siemens AG, 1000 Berlin und 8000 München Desoldering head for desoldering devices
US4295596A (en) * 1979-12-19 1981-10-20 Western Electric Company, Inc. Methods and apparatus for bonding an article to a metallized substrate
NL8201653A (en) * 1982-04-21 1983-11-16 Philips Nv METHOD AND APPARATUS FOR PLACING CHIP-SHAPED ELECTRICAL AND / OR ELECTRONIC COMPONENTS ON A SUBSTRATE

Also Published As

Publication number Publication date
GB2154921A (en) 1985-09-18
GB8504536D0 (en) 1985-03-27
DE3506315A1 (en) 1985-09-05
FR2560477A1 (en) 1985-08-30

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee