GB1517302A - Vacuum laminating process - Google Patents

Vacuum laminating process

Info

Publication number
GB1517302A
GB1517302A GB4085375A GB4085375A GB1517302A GB 1517302 A GB1517302 A GB 1517302A GB 4085375 A GB4085375 A GB 4085375A GB 4085375 A GB4085375 A GB 4085375A GB 1517302 A GB1517302 A GB 1517302A
Authority
GB
United Kingdom
Prior art keywords
areas
layer
photo
resist
raised areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4085375A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of GB1517302A publication Critical patent/GB1517302A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laminated Bodies (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

1517302 Photo-sensitive resists E I DU PONT DE NEMOURS & CO 6 Oct 1975 [8 Oct 1974 17 April 1975] 40853/75 Heading G2C [Also in Division B5] A photo-resist-forming layer is applied to a surface having raised areas, e.g. a circuit board, by (1) positioning the surface of a solid, unexposed, photo-resist-forming layer adjacent to a surface having raised areas while the other surface of the layer has adhered thereto a flexible, polymeric film support, e.g. of polyamide, polyolefin, vinyl polymer, polyester or cellulose ester, (2) reducing the absolute gas pressure to less than one atmosphere in the region between the surface having raised areas and the surface of the layer, and (3) applying pressure to the entire surface of the film support at once over the area of the layer adjacent to the surface having raised areas so that the photoresist-forming layer is forced into intimate contact with the surface having raised areas. A resist image may be produced by (4) exposing the photo-resistforming layer imagewise to actinic radiation, (5) stripping the film support from the resulting imagebearing layer, steps (4) and (5) being effected in either order, and (6) removing areas of the layer imagewise to form a resist image on the surface having raised areas. Areas on the surface which are unprotected by the resist image may then be treated with a reagent capable of etching the areas or depositing a material on the areas. The photoresist-forming layer may be a negative-working material, the unexposed areas being removed and exposed areas remaining as the resist image, or a positive-working material, the unexposed areas forming the resist image. The photo-resist-forming layer preferably comprises an ethylenically unsaturated compound, a thermoplastic polymeric binder and an additional polymerization initiator activatable by actinic light, numerous examples of which are given. Binders specified include (meth)- acrylates, nylons, cellulose ethers and esters, synthetic and chlorinated rubbers, vinylidene chloride copolymers, polyvinyl esters, copolyesters, polyethylene oxides, polyglycols, polyvinyl chloride and copolymers, polyvinyl acetals, polyformaldehydes, saturated and unsaturated polyurethanes, polycarbonates, polystyrenes, and epoxides.
GB4085375A 1974-10-08 1975-10-06 Vacuum laminating process Expired GB1517302A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51311274A 1974-10-08 1974-10-08
US56890475A 1975-04-17 1975-04-17

Publications (1)

Publication Number Publication Date
GB1517302A true GB1517302A (en) 1978-07-12

Family

ID=27057750

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4085375A Expired GB1517302A (en) 1974-10-08 1975-10-06 Vacuum laminating process

Country Status (5)

Country Link
JP (1) JPS5513341B2 (en)
DE (1) DE2544553C2 (en)
FR (1) FR2287714A1 (en)
GB (1) GB1517302A (en)
NL (1) NL7511714A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0028366A1 (en) * 1979-11-02 1981-05-13 E.I. Du Pont De Nemours And Company Process for heating thin surface layers
WO2011019886A1 (en) * 2009-08-13 2011-02-17 Dow Global Technologies, Inc. A multi-layer laminate structure and manufacturing method
US9123847B2 (en) 2010-12-17 2015-09-01 Dow Global Technologies Llc Photovoltaic device
CN113473709A (en) * 2020-03-31 2021-10-01 竞华电子(深圳)有限公司 Printed circuit board processing method and printed circuit board

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069076A (en) * 1976-11-29 1978-01-17 E. I. Du Pont De Nemours And Company Liquid lamination process
JPS5489274A (en) * 1977-12-27 1979-07-16 Fujitsu Ltd Method of making printed board
DE3342678C2 (en) * 1983-11-25 1995-08-31 Held Kurt Method and device for the continuous production of metal-clad laminates
JPS6252552A (en) * 1985-08-30 1987-03-07 Hitachi Chem Co Ltd Method and device for vacuum sticking
JPS63259559A (en) * 1987-04-16 1988-10-26 Hitachi Condenser Co Ltd Pattern forming method for printed circuit board
DE3737945A1 (en) * 1987-11-07 1989-05-24 Anger Wolfgang Vacuum laminator
US4834821A (en) * 1988-01-11 1989-05-30 Morton Thiokol, Inc. Process for preparing polymeric materials for application to printed circuits
DK8689A (en) * 1988-01-11 1989-07-12 Thiokol Morton Inc PROCEDURE AND APPARATUS FOR PLACING POLYMER MATERIALS ON PRINTED CIRCUIT CARDS
US4992354A (en) * 1988-02-26 1991-02-12 Morton International, Inc. Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like
US5078820A (en) * 1988-03-25 1992-01-07 Somar Corporation Method and apparatus for pressure sticking a thin film to a base plate
US4927733A (en) * 1988-12-23 1990-05-22 E. I. Du Pont De Nemours And Company Conformation of vacuum - laminated solder mask coated printed circuit boards by fluid pressurizing
DE4018177A1 (en) * 1990-06-07 1991-12-12 Anger Electronic Gmbh Continuous circuit board polymer film lamination - using multichamber vacuum cladding appts. to allow continuous one- or two-side cladding
DE4026802A1 (en) * 1990-08-24 1992-02-27 Anger Electronic Gmbh Equipment to surface PCB with film(s) - has conveyors to feed to and discharge from vacuum chamber contg. 2 endless belts with devices to apply heat and pressure
DE4222262A1 (en) * 1991-09-03 1993-03-04 Anger Electronic Gmbh Appts. for laminating plastics prods. e.g. PVC films esp. in PCB mfr. - has vacuum chamber comprising 2 opposing movable platens, each having pressure mat backed by heating mats for receiving prod connected by thin polyester band
DE9111708U1 (en) * 1991-09-19 1992-04-16 Anger Electronic Ges.m.b.H. Emco InnovationsCenter, Hallein Device for laminating printed and unprinted films
IT1274181B (en) * 1994-05-18 1997-07-15 Amedeo Candore LAMINATION OF PHOTOSENSITIVE FILMS TO FORM A WELDING MASK ON PRINTED CIRCUIT BOARDS
DE19609590A1 (en) * 1996-03-12 1997-09-18 Kontron Elektronik Method and device for coating substrates, preferably printed circuit boards
MY120763A (en) 1997-09-19 2005-11-30 Hitachi Chemical Co Ltd Photosensitive film, process for laminating photosensitive resin layer, photosensitive resin layer-laminated substrate and process for curing photosensitive resin layer
EP1117006A1 (en) * 2000-01-14 2001-07-18 Shipley Company LLC Photoresist having increased photospeed
WO2002079878A1 (en) 2001-03-29 2002-10-10 Hitachi Chemical Co., Ltd. Photosensitive film for circuit formation and process for producing printed wiring board
US8801887B2 (en) 2005-12-23 2014-08-12 The Boeing Company Textured structure and method of making the textured structure

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1293655B (en) * 1969-04-24
US3042574A (en) * 1957-09-25 1962-07-03 Du Pont Method of making laminated structures
NL302012A (en) * 1963-08-14
CA757597A (en) * 1963-12-30 1967-04-25 L. Mees John Method for making printed circuits
JPS4518324Y1 (en) * 1966-12-19 1970-07-27
JPS449363Y1 (en) * 1968-08-05 1969-04-16
US3469982A (en) * 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
DE1953883A1 (en) * 1969-10-25 1971-05-06 Dornbusch & Co Process for the surface welding of heated webs of material, in particular thermoplastic plastic foils, as well as device for carrying out the process
FR2123089B1 (en) * 1970-12-11 1974-08-23 Saint Gobain
JPS48100201A (en) * 1972-04-04 1973-12-18
JPS5129443B2 (en) * 1972-07-20 1976-08-25
JPS5434909B2 (en) * 1973-02-08 1979-10-30
JPS49103167A (en) * 1973-02-08 1974-09-30

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0028366A1 (en) * 1979-11-02 1981-05-13 E.I. Du Pont De Nemours And Company Process for heating thin surface layers
WO2011019886A1 (en) * 2009-08-13 2011-02-17 Dow Global Technologies, Inc. A multi-layer laminate structure and manufacturing method
US8163125B2 (en) 2009-08-13 2012-04-24 Dow Global Technologies Llc Multi-layer laminate structure and manufacturing method
US8361602B2 (en) 2009-08-13 2013-01-29 Dow Global Technologies Llc Multi-layer laminate structure and manufacturing method
US9123847B2 (en) 2010-12-17 2015-09-01 Dow Global Technologies Llc Photovoltaic device
CN113473709A (en) * 2020-03-31 2021-10-01 竞华电子(深圳)有限公司 Printed circuit board processing method and printed circuit board
CN113473709B (en) * 2020-03-31 2022-05-31 竞华电子(深圳)有限公司 Printed circuit board processing method and printed circuit board

Also Published As

Publication number Publication date
DE2544553C2 (en) 1983-08-04
FR2287714B1 (en) 1982-10-15
JPS5163702A (en) 1976-06-02
DE2544553A1 (en) 1976-04-22
NL7511714A (en) 1976-04-12
FR2287714A1 (en) 1976-05-07
JPS5513341B2 (en) 1980-04-08

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Legal Events

Date Code Title Description
PS Patent sealed
PE20 Patent expired after termination of 20 years

Effective date: 19951005