GB1461031A - Thick film circuits - Google Patents

Thick film circuits

Info

Publication number
GB1461031A
GB1461031A GB59975A GB59975A GB1461031A GB 1461031 A GB1461031 A GB 1461031A GB 59975 A GB59975 A GB 59975A GB 59975 A GB59975 A GB 59975A GB 1461031 A GB1461031 A GB 1461031A
Authority
GB
United Kingdom
Prior art keywords
oxy
thick film
depositing
acetylene
high temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB59975A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB59975A priority Critical patent/GB1461031A/en
Priority to AU87501/75A priority patent/AU501221B2/en
Priority to ES444106A priority patent/ES444106A1/en
Publication of GB1461031A publication Critical patent/GB1461031A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Abstract

1461031 Printed circuits STANDARD TELEPHONES & CABLES Ltd 7 Jan 1975 599/75 Heading H1D A thick film printed circuit is fabricated by depositing a layer of ceramic material containing, e.g. a large proportion of alumina on a finned aluminium heat sink depositing a circuit pattern thereon in metallic ink, and firing to fuse the metal into the ceramic layer which may be ground flat before deposition. The ceramic layer may be deposited at high temperature, e.g. by detonation of an ignited oxy-acetylene atmosphere, by a high velocity inert gas stream from a plasma torch, or by an oxy-acetylene or oxy-hydrogen torch; pulverulent ceramic material being introduced into the high temperature atmosphere.
GB59975A 1975-01-07 1975-01-07 Thick film circuits Expired GB1461031A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB59975A GB1461031A (en) 1975-01-07 1975-01-07 Thick film circuits
AU87501/75A AU501221B2 (en) 1975-01-07 1975-12-12 Producing thick film circuits ona ceramic substrate
ES444106A ES444106A1 (en) 1975-01-07 1976-01-07 Thick film circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB59975A GB1461031A (en) 1975-01-07 1975-01-07 Thick film circuits

Publications (1)

Publication Number Publication Date
GB1461031A true GB1461031A (en) 1977-01-13

Family

ID=9707218

Family Applications (1)

Application Number Title Priority Date Filing Date
GB59975A Expired GB1461031A (en) 1975-01-07 1975-01-07 Thick film circuits

Country Status (3)

Country Link
AU (1) AU501221B2 (en)
ES (1) ES444106A1 (en)
GB (1) GB1461031A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1199915A2 (en) * 2000-10-21 2002-04-24 Hella KG Hueck & Co. Circuit structures on thermally sprayed layers
US8134083B2 (en) 2006-06-07 2012-03-13 Ab Mikroelektronik Gesselschaft Mit Beschrankter Haftung Circuit carrier

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1199915A2 (en) * 2000-10-21 2002-04-24 Hella KG Hueck & Co. Circuit structures on thermally sprayed layers
EP1199915A3 (en) * 2000-10-21 2004-04-07 Hella KG Hueck & Co. Circuit structures on thermally sprayed layers
US8134083B2 (en) 2006-06-07 2012-03-13 Ab Mikroelektronik Gesselschaft Mit Beschrankter Haftung Circuit carrier

Also Published As

Publication number Publication date
AU501221B2 (en) 1979-06-14
ES444106A1 (en) 1977-04-16
AU8750175A (en) 1977-06-16

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee