ES444106A1 - Thick film circuits - Google Patents

Thick film circuits

Info

Publication number
ES444106A1
ES444106A1 ES444106A ES444106A ES444106A1 ES 444106 A1 ES444106 A1 ES 444106A1 ES 444106 A ES444106 A ES 444106A ES 444106 A ES444106 A ES 444106A ES 444106 A1 ES444106 A1 ES 444106A1
Authority
ES
Spain
Prior art keywords
thick film
film circuits
metal
dye
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES444106A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Spain SA
Original Assignee
Alcatel Espana SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Espana SA filed Critical Alcatel Espana SA
Publication of ES444106A1 publication Critical patent/ES444106A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A method for the manufacture of thick film circuits which comprises the steps of directly coating a metallic heat sink with a layer of ceramic material, forming a circuit on the ceramic layer by means of a deposit made on it with a dye design. and metal and subsequent heating of the assembly to a temperature high enough for the metal to melt with the dye. (Machine-translation by Google Translate, not legally binding)
ES444106A 1975-01-07 1976-01-07 Thick film circuits Expired ES444106A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB59975A GB1461031A (en) 1975-01-07 1975-01-07 Thick film circuits

Publications (1)

Publication Number Publication Date
ES444106A1 true ES444106A1 (en) 1977-04-16

Family

ID=9707218

Family Applications (1)

Application Number Title Priority Date Filing Date
ES444106A Expired ES444106A1 (en) 1975-01-07 1976-01-07 Thick film circuits

Country Status (3)

Country Link
AU (1) AU501221B2 (en)
ES (1) ES444106A1 (en)
GB (1) GB1461031A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10052247A1 (en) * 2000-10-21 2002-04-25 Hella Kg Hueck & Co Circuit structures on thermally sprayed layers
AT503706B1 (en) 2006-06-07 2011-07-15 Mikroelektronik Ges Mit Beschraenkter Haftung Ab CIRCUIT CARRIER

Also Published As

Publication number Publication date
AU8750175A (en) 1977-06-16
AU501221B2 (en) 1979-06-14
GB1461031A (en) 1977-01-13

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19970612