GB1457269A - Compositions comprising a polyimide resin or polyemide acid precursor therefor and an olefinically unsaturated imide or amide acid precursor therefor - Google Patents

Compositions comprising a polyimide resin or polyemide acid precursor therefor and an olefinically unsaturated imide or amide acid precursor therefor

Info

Publication number
GB1457269A
GB1457269A GB4980673A GB4980673A GB1457269A GB 1457269 A GB1457269 A GB 1457269A GB 4980673 A GB4980673 A GB 4980673A GB 4980673 A GB4980673 A GB 4980673A GB 1457269 A GB1457269 A GB 1457269A
Authority
GB
United Kingdom
Prior art keywords
acid precursor
compositions
compounds
imide
precursor therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4980673A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
Original Assignee
Ciba Geigy AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy AG filed Critical Ciba Geigy AG
Publication of GB1457269A publication Critical patent/GB1457269A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12Unsaturated polyimide precursors

Abstract

1457269 Unsaturated polyimide copolymers CIBA-GEIGY AG 25 Oct 1973 [2 Nov 1972] 49806/73 Headings C3R and C3P A curable composition comprises (a) an olefinically end-capped polyimide or polyamide imide of the formula or a polyamide-acid precursor thereof and (b) an olefinic imide or an amide acid precursor thereof. In the formulµ n is 1 to 100; D is and X and the various Y and R groups are extensively defined to embrace most of the usual such groups known for such compounds. The compounds (b) are stated to be reactive fluxes which render (a) processable at lower temperatures than in the absence of (b) and which are incorporated in the backbone of the cured product without appreciable volatilization or exudation. The compositions may be solutions, e.g. for use for coatings, films or adhesives, or moulding powders. Suitable solvents are mentioned; conventional compounding ingredients, e.g. fillers, dyes, pigment and UV or thermal stabilizers may also be included. Reference is made to Specification 1,425,241. Reference has been directed by the Comptroller to Specifications 1,238,045, 1,241,445, 1,255,935, 1,332,511 and 1,348,077. olefinically end-capped polyimide or polyamide imide of the formula or a polyamide-acid precursor thereof and (b) an oleflnic imide or or an amide acid precursor thereof. In the formulµ n is 1 to 100; D is and X and the various Y and R groups are extensively defined to embrace most of the usual such groups known for such compounds. The compounds (b) are stated to be reactive fluxes which render (a) processable at lower temperatures than in the absence of (b) and which are incorporated in the backbone of the cured product without appreciable volatilization or exudation. The compositions may be solutions, e.g. for use for coatings, films or adhesives, or moulding powders. Suitable solvents are mentioned; conventional compounding ingredients, e.g. fillers, dyes, pigment and UV or thermal stabilizers may also be included. Reference is made to Specification 1,425,241. Reference has been directed by the Comptroller to Specifications 1,238,045, 1,241,445, 1,255,935, 1,332,511 and 1,348,077.
GB4980673A 1972-11-02 1973-10-25 Compositions comprising a polyimide resin or polyemide acid precursor therefor and an olefinically unsaturated imide or amide acid precursor therefor Expired GB1457269A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US30319372A 1972-11-02 1972-11-02

Publications (1)

Publication Number Publication Date
GB1457269A true GB1457269A (en) 1976-12-01

Family

ID=23170934

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4980673A Expired GB1457269A (en) 1972-11-02 1973-10-25 Compositions comprising a polyimide resin or polyemide acid precursor therefor and an olefinically unsaturated imide or amide acid precursor therefor

Country Status (4)

Country Link
JP (1) JPS4977955A (en)
DE (1) DE2354384A1 (en)
FR (1) FR2205549B1 (en)
GB (1) GB1457269A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113087879A (en) * 2021-05-24 2021-07-09 上海交通大学 High-temperature electrostatic energy storage double-chain structure polymer dielectric and preparation method thereof
CN115746301A (en) * 2022-12-02 2023-03-07 慧创(东莞)材料技术有限责任公司 High-transparency polyimide film containing benzonorbornene structure and preparation method thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH620938A5 (en) * 1976-04-08 1980-12-31 Ciba Geigy Ag
JP5364414B2 (en) * 2009-03-30 2013-12-11 三井化学株式会社 Polyimide resin composition and metal laminate using the same
JP5166364B2 (en) * 2009-06-30 2013-03-21 三井化学株式会社 Polyimide resin composition and metal laminate using the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL34585A0 (en) * 1969-07-01 1970-07-19 Gen Electric Imido-substituted polyamide compositions

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113087879A (en) * 2021-05-24 2021-07-09 上海交通大学 High-temperature electrostatic energy storage double-chain structure polymer dielectric and preparation method thereof
CN115746301A (en) * 2022-12-02 2023-03-07 慧创(东莞)材料技术有限责任公司 High-transparency polyimide film containing benzonorbornene structure and preparation method thereof

Also Published As

Publication number Publication date
JPS4977955A (en) 1974-07-26
DE2354384A1 (en) 1974-05-16
FR2205549B1 (en) 1978-08-11
FR2205549A1 (en) 1974-05-31

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee