GB1386900A - Semiconductor layers - Google Patents
Semiconductor layersInfo
- Publication number
- GB1386900A GB1386900A GB201073A GB201073A GB1386900A GB 1386900 A GB1386900 A GB 1386900A GB 201073 A GB201073 A GB 201073A GB 201073 A GB201073 A GB 201073A GB 1386900 A GB1386900 A GB 1386900A
- Authority
- GB
- United Kingdom
- Prior art keywords
- sih
- hydrogen halide
- depositing
- seed layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02441—Group 14 semiconducting materials
- H01L21/0245—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
1386900 Si layer SIEMENS AG 15 Jan 1973 [14 March 1972] 2010/73 Heading ClA [Also in Division C7] A Si epitaxial layer is produced on a substrate by depositing a Si seed layer by irreversible thermal decomposition of a gaseous Si compound in the absence of hydrogen halide, followed by depositing further Si from the same atmosphere at the same temperature but with the addition of hydrogen halide. A Mg-Al spinel or sapphire substrate may be preheated at T>1000‹ C. in H 2 or etched in H 3 PO 4 at 200-400‹ C., then coated with Si at T>1000‹ C. from SiH 4 /H 2 or T<1000‹ C. from SiH 4 /He. HCl or HBr is added after the seed layer thickness reaches 0À05-0À3 Á, and deposition continued under equilibrium conditions.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19722212295 DE2212295C3 (en) | 1972-03-14 | 1972-03-14 | Process for the production of silicon or germanium epitaxial layers |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1386900A true GB1386900A (en) | 1975-03-12 |
Family
ID=5838865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB201073A Expired GB1386900A (en) | 1972-03-14 | 1973-01-15 | Semiconductor layers |
Country Status (8)
Country | Link |
---|---|
JP (1) | JPS5626137B2 (en) |
BE (1) | BE796757A (en) |
DE (1) | DE2212295C3 (en) |
FR (1) | FR2175840B1 (en) |
GB (1) | GB1386900A (en) |
IT (1) | IT981333B (en) |
LU (1) | LU67197A1 (en) |
NL (1) | NL7302014A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2129019A (en) * | 1982-09-30 | 1984-05-10 | Western Electric Co | Method of forming a heterostructure comprising a heteroepitaxial multiconstituent material |
WO2004086473A1 (en) * | 2003-03-19 | 2004-10-07 | Amberwave Systems Corporation | Method of producing high quality relaxed silicon germanium layers |
US7045451B2 (en) | 2003-04-05 | 2006-05-16 | Rohm And Haas Electronic Materials Llc | Preparation of group IVA and group VIA compounds |
US7141488B2 (en) | 2003-04-05 | 2006-11-28 | Rohm And Haas Electronic Materials Llc | Method of depositing germanium-containing films |
US7413776B2 (en) | 2003-04-05 | 2008-08-19 | Rohm And Haas Electronic Materials Llc | Method of depositing a metal-containing film |
-
1972
- 1972-03-14 DE DE19722212295 patent/DE2212295C3/en not_active Expired
-
1973
- 1973-01-15 GB GB201073A patent/GB1386900A/en not_active Expired
- 1973-02-13 NL NL7302014A patent/NL7302014A/xx unknown
- 1973-03-09 FR FR7308479A patent/FR2175840B1/fr not_active Expired
- 1973-03-12 LU LU67197D patent/LU67197A1/xx unknown
- 1973-03-13 IT IT2151973A patent/IT981333B/en active
- 1973-03-14 BE BE128783A patent/BE796757A/en unknown
- 1973-03-14 JP JP2913773A patent/JPS5626137B2/ja not_active Expired
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2129019A (en) * | 1982-09-30 | 1984-05-10 | Western Electric Co | Method of forming a heterostructure comprising a heteroepitaxial multiconstituent material |
US7041170B2 (en) | 1999-09-20 | 2006-05-09 | Amberwave Systems Corporation | Method of producing high quality relaxed silicon germanium layers |
US7674335B2 (en) | 1999-09-20 | 2010-03-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of producing high quality relaxed silicon germanium layers |
US7955435B2 (en) | 1999-09-20 | 2011-06-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of producing high quality relaxed silicon germanium layers |
WO2004086473A1 (en) * | 2003-03-19 | 2004-10-07 | Amberwave Systems Corporation | Method of producing high quality relaxed silicon germanium layers |
US7045451B2 (en) | 2003-04-05 | 2006-05-16 | Rohm And Haas Electronic Materials Llc | Preparation of group IVA and group VIA compounds |
US7141488B2 (en) | 2003-04-05 | 2006-11-28 | Rohm And Haas Electronic Materials Llc | Method of depositing germanium-containing films |
US7413776B2 (en) | 2003-04-05 | 2008-08-19 | Rohm And Haas Electronic Materials Llc | Method of depositing a metal-containing film |
US7767840B2 (en) | 2003-04-05 | 2010-08-03 | Rohm And Haas Electronic Materials Llc | Organometallic compounds |
Also Published As
Publication number | Publication date |
---|---|
FR2175840B1 (en) | 1977-07-29 |
JPS494976A (en) | 1974-01-17 |
JPS5626137B2 (en) | 1981-06-17 |
DE2212295B2 (en) | 1974-08-15 |
DE2212295A1 (en) | 1973-09-27 |
LU67197A1 (en) | 1973-05-22 |
BE796757A (en) | 1973-07-02 |
NL7302014A (en) | 1973-09-18 |
IT981333B (en) | 1974-10-10 |
FR2175840A1 (en) | 1973-10-26 |
DE2212295C3 (en) | 1975-04-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |