GB1358504A - Elastomerically encapsulated semiconductor device - Google Patents

Elastomerically encapsulated semiconductor device

Info

Publication number
GB1358504A
GB1358504A GB4084772A GB4084772A GB1358504A GB 1358504 A GB1358504 A GB 1358504A GB 4084772 A GB4084772 A GB 4084772A GB 4084772 A GB4084772 A GB 4084772A GB 1358504 A GB1358504 A GB 1358504A
Authority
GB
United Kingdom
Prior art keywords
electrodes
semi
wafer
sleeve
contact members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4084772A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CBS Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of GB1358504A publication Critical patent/GB1358504A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Gasket Seals (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

1358504 Semi-conductor devices WESTING- HOUSE ELECTRIC CORP 4 Sept 1972 [26 Oct 1971] 40847/72 Heading H1K A semi-conductor wafer 11 having electrodes 12 bonded to opposite faces has a pair of contact members 13 urged into contact with the electrodes 12 by the clamping effect of a flanged elastomeric sleeve 20 acting upon external flanges 15 on the contact members 13. The sleeve 20 also has a sealing portion 21 which extends into the channel 17 defined between the flanges 15 and provides a hermetic seal about the wafer 11. Suitable materials for the elastomeric sleeve 20 include silicone, butadienestyrene, butyl, nitrile or fluorocarbon rubbers, polyolefin tubing, neoprene, polysulphides, polyacrylates, chlorosulphonated polyethylene and polyurethane. As well as the PN junction diode shown the invention is described in relation to a thyristor.
GB4084772A 1971-10-26 1972-09-04 Elastomerically encapsulated semiconductor device Expired GB1358504A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19246871A 1971-10-26 1971-10-26

Publications (1)

Publication Number Publication Date
GB1358504A true GB1358504A (en) 1974-07-03

Family

ID=22709794

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4084772A Expired GB1358504A (en) 1971-10-26 1972-09-04 Elastomerically encapsulated semiconductor device

Country Status (9)

Country Link
JP (2) JPS4857581A (en)
AU (1) AU465197B2 (en)
BE (1) BE790502A (en)
CA (1) CA963586A (en)
DE (1) DE2250753A1 (en)
ES (1) ES406779A1 (en)
FR (1) FR2157923A1 (en)
GB (1) GB1358504A (en)
ZA (1) ZA725913B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0122431A1 (en) * 1983-03-11 1984-10-24 Siemens Aktiengesellschaft Semiconductor device with a disc-shaped housing
EP0127750A1 (en) * 1983-05-09 1984-12-12 Siemens Aktiengesellschaft Encapsulated semiconductor device in a cup-shaped container
WO2012059193A3 (en) * 2010-11-02 2012-07-26 Converteam Technology Ltd Power electronic device with edge passivation

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2246423C3 (en) * 1972-09-21 1979-03-08 Siemens Ag, 1000 Berlin Und 8000 Muenchen Thyristor with a disc-shaped housing
DE2525390A1 (en) * 1975-06-06 1976-12-16 Siemens Ag CONTROLLED SEMICONDUCTOR COMPONENT
JPS5619406Y2 (en) * 1976-06-10 1981-05-08
DE2630320A1 (en) * 1976-07-06 1978-01-12 Licentia Gmbh DISC-SHAPED SEMICONDUCTOR CELL WITH A RING-SHAPED HOUSING
DE2636631A1 (en) * 1976-08-13 1978-02-16 Siemens Ag THYRISTOR
JPS5636134Y2 (en) * 1976-09-07 1981-08-25
DE2654532C3 (en) * 1976-12-02 1982-03-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Disc-shaped semiconductor cell
FR2440077A1 (en) * 1978-10-23 1980-05-23 Transformation En Cie Indle Semiconductor power module casing - with metal discs pressed against O=ring by insulating lipped clamp ring
JPH0744191B2 (en) * 1989-12-15 1995-05-15 三菱電機株式会社 Semiconductor device and electrode block therefor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0122431A1 (en) * 1983-03-11 1984-10-24 Siemens Aktiengesellschaft Semiconductor device with a disc-shaped housing
EP0127750A1 (en) * 1983-05-09 1984-12-12 Siemens Aktiengesellschaft Encapsulated semiconductor device in a cup-shaped container
WO2012059193A3 (en) * 2010-11-02 2012-07-26 Converteam Technology Ltd Power electronic device with edge passivation
US9349790B2 (en) 2010-11-02 2016-05-24 Ge Energy Power Conversion Technology Ltd. Power electronic devices

Also Published As

Publication number Publication date
JPS4857581A (en) 1973-08-13
DE2250753A1 (en) 1973-05-03
ZA725913B (en) 1973-05-30
ES406779A1 (en) 1975-10-01
BE790502A (en) 1973-04-25
CA963586A (en) 1975-02-25
AU4624072A (en) 1974-03-07
AU465197B2 (en) 1975-09-18
FR2157923A1 (en) 1973-06-08
JPS5311966U (en) 1978-01-31

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee