GB1310580A - Light curable resin composition and photosensitive adhesitve systems - Google Patents

Light curable resin composition and photosensitive adhesitve systems

Info

Publication number
GB1310580A
GB1310580A GB1351970A GB1351970A GB1310580A GB 1310580 A GB1310580 A GB 1310580A GB 1351970 A GB1351970 A GB 1351970A GB 1351970 A GB1351970 A GB 1351970A GB 1310580 A GB1310580 A GB 1310580A
Authority
GB
United Kingdom
Prior art keywords
epoxy
resin
march
phenol
photo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1351970A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of GB1310580A publication Critical patent/GB1310580A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C1/00—Photosensitive materials
    • G03C1/52—Compositions containing diazo compounds as photosensitive substances
    • G03C1/62—Metal compounds reducible to metal
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C1/00—Photosensitive materials
    • G03C1/695—Compositions containing azides as the photosensitive substances
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/04—Chromates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0709—Catalytic ink or adhesive for electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
GB1351970A 1969-03-25 1970-03-20 Light curable resin composition and photosensitive adhesitve systems Expired GB1310580A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81037869A 1969-03-25 1969-03-25

Publications (1)

Publication Number Publication Date
GB1310580A true GB1310580A (en) 1973-03-21

Family

ID=25203717

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1351970A Expired GB1310580A (en) 1969-03-25 1970-03-20 Light curable resin composition and photosensitive adhesitve systems

Country Status (11)

Country Link
US (1) US3779758A (ja)
JP (1) JPS5040221B1 (ja)
AT (1) AT307846B (ja)
CA (1) CA958936A (ja)
CH (1) CH549098A (ja)
DE (1) DE2014737B2 (ja)
DK (1) DK141823B (ja)
FR (1) FR2039963A5 (ja)
GB (1) GB1310580A (ja)
NL (1) NL167032C (ja)
SE (1) SE372351B (ja)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3900320A (en) * 1971-09-30 1975-08-19 Bell & Howell Co Activation method for electroless plating
JPS5525418B2 (ja) * 1972-12-20 1980-07-05
US3887373A (en) * 1973-04-11 1975-06-03 Motorola Inc Non-polluting photoresist developing process
DE2411869C3 (de) * 1974-03-12 1982-07-08 Standard Elektrik Lorenz Ag, 7000 Stuttgart Photochemisches System zur Beschichtung des Leuchtschirmes von Farbfernsehröhren
US3928670A (en) * 1974-09-23 1975-12-23 Amp Inc Selective plating on non-metallic surfaces
US4191573A (en) * 1974-10-09 1980-03-04 Fuji Photo Film Co., Ltd. Photosensitive positive image forming process with two photo-sensitive layers
US4107351A (en) * 1976-10-15 1978-08-15 Rca Corporation Method of depositing or repairing a patterned metal layer on a substrate
GB1588475A (en) * 1977-05-14 1981-04-23 Hitachi Chemical Co Ltd Method of adhesion between insulating substrates and metal deposits electrolessly plated thereon and method of making additive printed circuit boards
US4388351A (en) * 1979-08-20 1983-06-14 Western Electric Company, Inc. Methods of forming a patterned metal film on a support
DK427780A (da) * 1980-10-10 1982-04-11 Neselco As Pulver til brug ved toer sensibilisering for stroemloes metallisering
DE3130159A1 (de) * 1981-07-30 1983-02-17 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt "verfahren zur herstellung von leiterplatten"
EP0089221A1 (en) * 1982-03-15 1983-09-21 EASTMAN KODAK COMPANY (a New Jersey corporation) Electrographic method of forming conductive circuit patterns and circuit boards formed thereby
US4555414A (en) * 1983-04-15 1985-11-26 Polyonics Corporation Process for producing composite product having patterned metal layer
US4666735A (en) * 1983-04-15 1987-05-19 Polyonics Corporation Process for producing product having patterned metal layer
JPS62102241A (ja) * 1985-10-30 1987-05-12 Tokyo Ohka Kogyo Co Ltd 感光性組成物
US4910072A (en) * 1986-11-07 1990-03-20 Monsanto Company Selective catalytic activation of polymeric films
US5075037A (en) * 1986-11-07 1991-12-24 Monsanto Company Selective catalytic activation of polymeric films
US4851159A (en) * 1988-05-02 1989-07-25 Monsanto Company Process for the preparation of N- phosphonomethylglycine
US5650261A (en) * 1989-10-27 1997-07-22 Rohm And Haas Company Positive acting photoresist comprising a photoacid, a photobase and a film forming acid-hardening resin system
US5506091A (en) * 1990-04-20 1996-04-09 Nisshinbo Industries, Inc. Photosensitive resin composition and method of forming conductive pattern
US5631753A (en) * 1991-06-28 1997-05-20 Dai Nippon Printing Co., Ltd. Black matrix base board and manufacturing method therefor, and liquid crystal display panel and manufacturing method therefor
US5532105A (en) * 1992-08-07 1996-07-02 Hitachi Chemical Company, Ltd. Photolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring board
US5665713A (en) * 1995-04-12 1997-09-09 Procter & Gamble Company Pharmaceutical composition for inhibiting the growth of viruses and cancers
ZA962880B (en) * 1995-04-12 1997-03-17 Procter & Gamble A pharmaceutical composition for inhibiting the growth of viruses and cancers
EP1292859B1 (en) * 2000-05-23 2005-07-27 Aprilis, Inc. Data storage medium comprising colloidal metal and preparation process thereof
CN103176365A (zh) * 2011-12-22 2013-06-26 深圳富泰宏精密工业有限公司 菲林及其制作方法，应用该菲林进行遮蔽的方法
FR3064010B1 (fr) * 2017-03-14 2022-11-18 Commissariat Energie Atomique Solution de precurseur pour former une couche d’oxyde metallique et procede de revetement d’un substrat par une couche d’oxyde metallique

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE407603A (ja) * 1930-02-05
US2501874A (en) * 1946-06-12 1950-03-28 Gen Aniline & Film Corp Photographic diazo-sensitized glassine paper
NL76649C (ja) * 1949-04-09
US3406068A (en) * 1951-07-30 1968-10-15 Rca Corp Photographic methods of making electron-sensitive mosaic screens
US2695846A (en) * 1952-11-04 1954-11-30 Powers Chemco Inc Developing of diazo and azide sensitized colloids
US2914404A (en) * 1953-07-31 1959-11-24 Blaupunkt Werke Gmbh Method of producing two-dimensional circuits or circuit elements on supporting bases
US2852379A (en) * 1955-05-04 1958-09-16 Eastman Kodak Co Azide resin photolithographic composition
US3006819A (en) * 1955-06-13 1961-10-31 Sanders Associates Inc Method of photo-plating electrical circuits
US2996380A (en) * 1957-10-08 1961-08-15 Sylvania Electric Prod Method of fabricating image display screens
NL113853C (ja) * 1959-07-22
US3222173A (en) * 1961-05-15 1965-12-07 Vitramon Inc Method of making an electrical unit
NL287857A (ja) * 1962-01-27
US3259559A (en) * 1962-08-22 1966-07-05 Day Company Method for electroless copper plating
BE637058A (ja) * 1962-09-07
US3316092A (en) * 1963-05-09 1967-04-25 Dietzgen Co Eugene Diazotype material comprising a metal sulfate nitrogenous compound and polymeric anhydride
US3326686A (en) * 1963-05-31 1967-06-20 Gen Aniline & Film Corp Light-sensitive two-component diazotype materials adapted for heat development
US3469984A (en) * 1965-05-17 1969-09-30 Addressograph Multigraph Heat-sensitive diazotype materials
DE1572155A1 (de) * 1965-08-10 1970-01-02 Dr Eduard Roell Licht-bzw.strahlungsempfindliches Material und Verfahren zu dessen Herstellung
US3458313A (en) * 1966-09-07 1969-07-29 Nasa High resolution developing of photosensitive resists

Also Published As

Publication number Publication date
US3779758A (en) 1973-12-18
SE372351B (ja) 1974-12-16
DK141823C (ja) 1980-11-10
JPS5040221B1 (ja) 1975-12-23
DK141823B (da) 1980-06-23
NL7004323A (ja) 1970-09-29
FR2039963A5 (ja) 1971-01-15
CH549098A (de) 1974-05-15
NL167032C (nl) 1981-10-15
NL167032B (nl) 1981-05-15
DE2014737A1 (de) 1970-10-01
DE2014737B2 (de) 1975-03-06
CA958936A (en) 1974-12-10
AT307846B (de) 1973-06-12

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee